Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000073-000078
Author(s):  
Paul Gundel ◽  
Anton Miric ◽  
Kai Herbst ◽  
Melanie Bawohl ◽  
Jessica Reitz ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Cycling ◽  
Power Electronics ◽  
Thick Film ◽  
Low Cost ◽  
Automotive Applications ◽  
Ceramic Substrates ◽  
Hybrid Technologies

Abstract So far Direct Bonded Copper (DBC) substrates have been the standard for power electronics. They provide excellent electrical and thermal conductivity at low cost. Weaknesses of DBC technology are the inevitable warpage and the relatively low reliability under thermal cycling. The low reliability poses a significant hurdle in particular for automotive applications with high lifetime requirements. Thick Print Copper (TPC) substrates with low warpage and excellent reliability overcome these weaknesses, but also provide a reduced conductivity at a higher cost. We present two thick-film/DBC hybrid technologies which combine the best properties of DBC and TPC: excellent conductivity, low cost, reduced warpage and excellent reliability.

Metallization Issues in Advanced Ceramic Substrates:- Microstructural. Microchemistry and Thermal Conductivity in Aln

1989 ◽  
Vol 154 ◽  
Author(s):  
Alistair D. Westwood ◽  
Michael R. Notis
Keyword(s):  
Thermal Conductivity ◽  
Grain Boundary ◽  
Aluminum Nitride ◽  
Grain Boundaries ◽  
Thick Film ◽  
Interface Morphology ◽  
Ceramic Substrates ◽  
Microstructural Study ◽  
Boundary Film ◽  
Manganese Aluminum

AbstractMicrochemical and microstructural study has been carried out on the tungsten-aluminum nitride (W-AlN) thick film metallization interface. A reaction has been found to occur with the formation of precipitates at AlN grain boundaries and also within the AlN grains; a thin crystalline grain boundary film was also observed. The interface morphology and chemistry is compared to the molybdenum/manganese-aluminum nitride (MoMn-AlN) interface. The effects of morphology and microchemical variations upon thermal conductivity are discussed.

scholarly journals Fabrication, response and stability of miniature piezoresistive force-sensing thick-film cantilevers

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000024-000031
Author(s):  
Thomas Maeder ◽  
Caroline Jacq ◽  
Stefane Caseiro ◽  
Peter Ryser
Keyword(s):  
Thick Film ◽  
Low Cost ◽  
Substrate Material ◽  
Force Sensing ◽  
Second Step ◽  
Ceramic Substrates ◽  
Plastic Deformations ◽  
Self Heating ◽  
Signal Drift ◽  
Micro Cracks

Abstract Miniature ceramic cantilevers have been successfully applied to the fabrication of simple and low-cost piezoresistive thick-film force-sensing cells, using different thick-film and LTCC (low-temperature co-fired ceramic) substrates. The availability of thin substrates for some materials allows much improved sensitivity compared to classical thick-film technology, with LTCC also featuring rather low substrate elastic modulus and fine structurability. However, practical applicability may be hindered by processing difficulties, such as printing and handling very thin fired substrates, or, in the case of co-fired tapes, warpage during firing. Also, signal drift is observed with some devices. In this work, we show that most of the previously-observed signal drift in some LTCC sensors is not due to self-heating, and therefore stems from defects such as micro-cracks within the ceramic cantilevers or plastic deformations in internal conductors. In a second step, we explore manufacturability of thick-film cantilevers on very thin substrates, and show that it is possible to print a single-sided design on substrates with thickness as low as 45 μm, although a lower limit of ~100 μm, depending on substrate material, is more practical.

scholarly journals Thermal conductivity performance of nanoporous plate for high-power LED lighting and power electronics

2019 ◽  
Vol 1309 ◽  
pp. 012016
Author(s):  
A D Kurilov ◽  
V V Belyaev ◽  
K D Nessemon ◽  
E D Besprozvannyi ◽  
A O Osin ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Power Electronics ◽  
High Power ◽  
Led Lighting ◽  
High Power Led

scholarly journals A Machine Vision Approach for Bioreactor Foam Sensing

2021 ◽  
pp. 247263032110088
Author(s):  
Jonas Austerjost ◽  
Robert Söldner ◽  
Christoffer Edlund ◽  
Johan Trygg ◽  
David Pollard ◽  
...  
Keyword(s):  
Machine Learning ◽  
Machine Vision ◽  
State Of The Art ◽  
Low Cost ◽  
High Accuracy ◽  
Consumer Electronics ◽  
Learning System ◽  
Automotive Applications ◽  
Fine Grained

Machine vision is a powerful technology that has become increasingly popular and accurate during the last decade due to rapid advances in the field of machine learning. The majority of machine vision applications are currently found in consumer electronics, automotive applications, and quality control, yet the potential for bioprocessing applications is tremendous. For instance, detecting and controlling foam emergence is important for all upstream bioprocesses, but the lack of robust foam sensing often leads to batch failures from foam-outs or overaddition of antifoam agents. Here, we report a new low-cost, flexible, and reliable foam sensor concept for bioreactor applications. The concept applies convolutional neural networks (CNNs), a state-of-the-art machine learning system for image processing. The implemented method shows high accuracy for both binary foam detection (foam/no foam) and fine-grained classification of foam levels.

A reliable low cost power electronics interface for photovoltaic energy systems

Solar Energy ◽  
2014 ◽  
Vol 108 ◽  
pp. 370-376 ◽  
Author(s):  
Wajiha Shireen ◽  
Adarsh Nagarajan ◽  
Sonal Patel ◽  
Radhakrishna Kotti ◽  
Preetham Goli
Keyword(s):  
Power Electronics ◽  
Low Cost ◽  
Energy Systems ◽  
Photovoltaic Energy
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