Chip Embedding for Printed Circuit Boards and Subsystems

2010 ◽  
Vol 2010 (1) ◽  
pp. 000891-000897 ◽  
Author(s):  
Thomas Gottwald ◽  
Alexander Neumann
Keyword(s):  
Embedded Systems ◽  
Significant Influence ◽  
Printed Circuit Boards ◽  
Emerging Technologies ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Manufacturing Complexity ◽  
Electrical Component ◽  
Escape Routing ◽  
The Cost

The reason for chip embedding by means of PCB technology are manifold. Actually there are several emerging technologies on the market which all face one common problem: To realize the escape routing of a high pin count die one has to use several build up layers or very fine lines & spaces for the PCB. Both approaches have a significant influence on the cost of a electrical component because both solutions raise the manufacturing complexity. Due to this problem approaches like “chip first” or “chip last” are being discussed in plenty of papers. With this paper, an alternative way of producing embedded systems is mentioned, which overcomes many of the actual problems.

The Use of Polymer Thick Film for Making Printed Circuit Boards

1982 ◽  
Vol 1 (1) ◽  
pp. 22-23 ◽  
Author(s):  
F.W. Martin
Keyword(s):  
Thick Film ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronics Industry ◽  
Circuit Board ◽  
Technical Knowledge ◽  
Circuit Boards ◽  
Printed Circuit ◽  
The Cost

The electronics industry is facing a situation in which the cost of electronic functions is dropping continuously while the cost of interconnecting the functions by traditional means, especially through the use of printed circuit boards, continues to rise. Polymer thick film is one proven approach to reversing the trend of rising interconnection costs. It is relatively easy for the typical printed circuit board manufacturer to convert to or adapt polymer thick film because he has most of the necessary equipment, technical knowledge and personnel.

scholarly journals Design and fabrication of low-cost micromachining system for prototyping printed circuit boards

2021 ◽  
Author(s):  
Dhinesh S K ◽  
◽  
Senthil Kumar K L ◽  
Megalingam A ◽  
Gokulraj A P ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Working Environment ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Milling Operation ◽  
Wide Range ◽  
Complex Shapes ◽  
The Cost ◽  
Selection Of

Printed circuit boards (PCBs) have a portentous position in constructing modern electronic equipment. Currently, chemical etching is the process used to produce PCBs at huge volumes, which is not suitable for preparing prototypes. The working environment is also not an encouraging one. There is no economical way to manufacture PCBs in low volumes, which is the basic requirement for Small and Medium Scale Enterprises (SMEs). Prototyping the desired circuit boards, prior to the mass production, is essential to avoid major losses by producing faulty designs. Developing a low-cost machine for prototyping PCBs may overcome these drawbacks. Hence, in this work, a machine capable of performing PCB mechanical milling operation on wide range of materials like copper/epoxy boards and flexible substrates has been developed. The machine developed is capable of milling lines that are 0.3 mm in width and 0.46 mm in depth. The performance of the machine reveals that it can mill any complex shapes and designs with expected accuracy. Selection of hardware components according to the needs would reduce the cost and programming snag further, which makes it affordable to SMEs.

Design for Manufacturability: Cost Analysis of Electronic Circuit Board Assembly

1991 ◽  
Author(s):  
Charlie A. S. Heng ◽  
Robert K. L. Gay
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit Board Assembly ◽  
Flexible Assembly ◽  
Printed Circuit ◽  
Circuit Board Assembly ◽  
Specific Configuration ◽  
The Cost

Abstract This paper discusses a methodology to predict the cost of assembling printed circuit boards (PCB). It is formulated using the flexible assembly system in the Experimental Printed Circuit Board Assembly Facility (EPCBAF) of the GINTIC Institute of CIM. The concept of Boothroyd and Dewhurst is applied in this work. The assembly cost accounts for insertion, test and rework costs only. Although focusing on the specific configuration of the system in EPCBAF, the discussion is directed towards broad applications, enabling a wide variety of assembly systems to be simulated.

VORONOI DIAGRAM OF A POLYGON IN CHESSBOARD METRIC AND MASKLESS LITHOGRAPHIC APPLICATIONS

2008 ◽  
Vol 18 (04) ◽  
pp. 357-371
Author(s):  
HAYONG SHIN ◽  
SEYOUN PARK ◽  
EONJIN PARK ◽  
DEOK-SOO KIM
Keyword(s):  
Voronoi Diagram ◽  
Printed Circuit Boards ◽  
Medial Axis ◽  
Production Volume ◽  
Path Generation ◽  
Flat Panel Display ◽  
Circuit Boards ◽  
Display Devices ◽  
Printed Circuit ◽  
The Cost

Lithography using photomasks has been the major workhorse in manufacturing printed circuit boards, semiconductors, and flat panel display devices. However, the cost of photomask is so high that it often becomes the bottleneck, especially when the production volume is low. For this reason, maskless lithography technology is recently gaining more attention, and hence, the computation of efficient lithography path becomes of greater importance than ever in order to obtain high throughput of lithography process. The target machine of this paper has a numerically controlled XY table on which a substrate is located and a variable size (square-shape) aperture in front of the light source. In this paper, we present an approach to efficient lithography path generation using Voronoi diagram and medial axis transform in chessboard metric. The properties and construction method of Voronoi diagram of a polygonal object in chessboard metric are examined. Then, lithography path generation scheme is explained. The proposed idea can also be applied to the fabrication of photomask itself and the rapid prototyping of a 3D model via layered lithography.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Laser dicing of electronics printed circuit boards using a DPSS UV Nd:YVO4 laser

2007 ◽  
Author(s):  
X. C. Wang ◽  
Z. L. Li ◽  
T. Chen ◽  
K. H. L. Li ◽  
B. K. Lok ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit
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