Use of 3D Packaging Technology for Satellite Active Antennas Front-ends

2012 ◽  
Vol 2012 (1) ◽  
pp. 000554-000560
Author(s):  
B. Bonnet ◽  
R. Chiniard ◽  
H. Legay ◽  
D. Nevo ◽  
P. Monfraix ◽  
...  

Multi-Chip Module Vertical (MCM-V) technology, also called 3D packaging technology, enables the realization of a compact and low loss integrated feed for active antennas in Ka band. The active devices can be located in the vicinity of the radiating element, which reduces dramatically the volume and complexity of the antenna front-end for future architectures with more than a hundred beams in Ka band. This paper deals with the optimization of 3D packaging technology to reach the requirements of 30GHz microwave modules for space applications. The technological developments that have been led on the design and the assembly processes are detailed. The measurement results of an integrated feed module in radiation are given and the circuit designed to optimize the signal-to-noise ratio of the front-end for receiving antennas is characterized. The performance is as good as for an optimized planar front-end with a waveguide access for a much more compact module, especially in terms of footprint in an antenna array. These results successfully position 3D packaging as a disruptive technology for future space and telecom subsystems.

Author(s):  
Alessandro Stuart Savoia ◽  
Barbara Mauti ◽  
Giosue Caliano ◽  
Giulia Matrone ◽  
Marco Piastra ◽  
...  

Author(s):  
Alessandro Stuart Savoia ◽  
Barbara Mauti ◽  
Roberto Bardelli ◽  
Fabrizio Toia ◽  
Giulia Matrone ◽  
...  

2016 ◽  
Vol 64 (11) ◽  
pp. 3667-3677 ◽  
Author(s):  
Chao Liu ◽  
Qiang Li ◽  
Yihu Li ◽  
Xiao-Dong Deng ◽  
Hailin Tang ◽  
...  

1998 ◽  
Vol 45 (4) ◽  
pp. 2272-2278 ◽  
Author(s):  
J. Vandenbussche ◽  
F. Leyn ◽  
G. Van der Plas ◽  
G. Gielen ◽  
W. Sansen

2009 ◽  
Vol 2009 ◽  
pp. 1-3
Author(s):  
Stefano Selleri ◽  
Giovanni Toso

2020 ◽  
Vol 24 ◽  
pp. 233121652097034
Author(s):  
Florian Langner ◽  
Andreas Büchner ◽  
Waldo Nogueira

Cochlear implant (CI) sound processing typically uses a front-end automatic gain control (AGC), reducing the acoustic dynamic range (DR) to control the output level and protect the signal processing against large amplitude changes. It can also introduce distortions into the signal and does not allow a direct mapping between acoustic input and electric output. For speech in noise, a reduction in DR can result in lower speech intelligibility due to compressed modulations of speech. This study proposes to implement a CI signal processing scheme consisting of a full acoustic DR with adaptive properties to improve the signal-to-noise ratio and overall speech intelligibility. Measurements based on the Short-Time Objective Intelligibility measure and an electrodogram analysis, as well as behavioral tests in up to 10 CI users, were used to compare performance with a single-channel, dual-loop, front-end AGC and with an adaptive back-end multiband dynamic compensation system (Voice Guard [VG]). Speech intelligibility in quiet and at a +10 dB signal-to-noise ratio was assessed with the Hochmair–Schulz–Moser sentence test. A logatome discrimination task with different consonants was performed in quiet. Speech intelligibility was significantly higher in quiet for VG than for AGC, but intelligibility was similar in noise. Participants obtained significantly better scores with VG than AGC in the logatome discrimination task. The objective measurements predicted significantly better performance estimates for VG. Overall, a dynamic compensation system can outperform a single-stage compression (AGC + linear compression) for speech perception in quiet.


1997 ◽  
Vol 478 ◽  
Author(s):  
C. D. Kramer ◽  
P.E.

AbstractThis paper presents current NASA biomedical developments and applications using thermoelectrics. Discussion will include future technology enhancements that would be most beneficial to the application of thermoelectric technology.A great deal of thermoelectric applications have focused on electronic cooling. As with all technological developments within NASA, if the application cannot be related to the average consumer, the technology will not be mass-produced and widely available to the public (a key to research and development expenditures and thermoelectric companies). Included are discussions of thermoelectric applications to cool astronauts during launch and reentry. The earth-based applications, or spin-offs, include such innovations as tank and race car driver cooling, to cooling infants with high temperatures, as well as, the prevention of hair loss during chemotherapy. In order to preserve the scientific value of metabolic samples during long-term space missions, cooling is required to enable scientific studies. Results of one such study should provide a better understanding of osteoporosis and may lead to a possible cure for the disease.In the space environment, noise has to be kept to a minimum. In long-term space applications such as the International Space Station, thermoelectric technology provides the acoustic relief and the reliability for food, as well as, scientific refrigeration/freezers. Applications and future needs are discussed as NASA moves closer to a continued space presence in Mir, International Space Station, and Lunar-Mars Exploration.


2021 ◽  
Author(s):  
Xiaofan Wen ◽  
Hai Xiahou ◽  
Hao Li ◽  
Jinping Zhang ◽  
Wenzhou Ruan
Keyword(s):  
Ka Band ◽  

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