Use of 3D Packaging Technology for Satellite Active Antennas Front-ends
Multi-Chip Module Vertical (MCM-V) technology, also called 3D packaging technology, enables the realization of a compact and low loss integrated feed for active antennas in Ka band. The active devices can be located in the vicinity of the radiating element, which reduces dramatically the volume and complexity of the antenna front-end for future architectures with more than a hundred beams in Ka band. This paper deals with the optimization of 3D packaging technology to reach the requirements of 30GHz microwave modules for space applications. The technological developments that have been led on the design and the assembly processes are detailed. The measurement results of an integrated feed module in radiation are given and the circuit designed to optimize the signal-to-noise ratio of the front-end for receiving antennas is characterized. The performance is as good as for an optimized planar front-end with a waveguide access for a much more compact module, especially in terms of footprint in an antenna array. These results successfully position 3D packaging as a disruptive technology for future space and telecom subsystems.