In-line advanced process control solution for the fabrication of micro-bumps

2017 ◽  
Vol 2017 (1) ◽  
pp. 000087-000092
Author(s):  
Dario Alliata ◽  
Stephane Godny ◽  
Cleonisse Serrecchia ◽  
Tristan Combier ◽  
Astrid Sippel ◽  
...  
Keyword(s):  
Process Control ◽  
Fabrication Process ◽  
Wafer Surface ◽  
Control Solution ◽  
Advanced Process Control ◽  
Line Scan ◽  
Advanced Packaging ◽  
3D Information ◽  
Light Beams ◽  
2D And 3D

Abstract In this paper, Confocal Chromatic Microscopy was investigated to characterize the micro-bump fabrication process. We designed and fabricated in house a new detector that integrates through the same optical chromatic lens two light beams that are reflected into a 2D line scan camera and a spectrometer to obtain on the fly 2D and 3D information while scanning the wafer surface. We inspected 300 mm round wafers hosting arrays of copper micro-bumps down to 10 μm in width and 5 μm in height at post Cu growing and etching step. The 2D inspection revealed the presence of partial μbumps, shifted and missing μbumps. The 3D inspection could recognize shorter and taller bumps and determine the coplanarity of each bump population at die level. This information could be used to classify GOOD and BAD dies over the wafer, so that after dicing only known good dies would be used in the following advanced packaging step. In this way, the risk of shorts and / or missing contact is minimized when stacking dies either on a wafer or on a die.

How to secure the fabrication of Gallium Nitride on Si wafers

2019 ◽  
Vol 2019 (1) ◽  
pp. 000444-000449
Author(s):  
D. Alliata ◽  
N. Anderson ◽  
M. Durand de Gevigney ◽  
I. Bergoend ◽  
P. Gastaldo
Keyword(s):  
Gallium Nitride ◽  
Phase Shift ◽  
Process Control ◽  
Silicon Substrate ◽  
High Volume ◽  
Fabrication Process ◽  
Control Solution ◽  
Total Control ◽  
Before And After ◽  
Infrared Interferometry

Abstract Process control solutions to secure the High-Volume Manufacturing of Gallium Nitride (GaN) devices for power applications are a must today. Unity recently developed and introduced on the market a total control solution that address both defectivity and metrology needs of GaN industry. Proprietary technologies like Phase Shift Deflectometry, darkfield inspection, confocal chromatic imaging and infrared interferometry are here explored to detect killer defects potentially affecting the gallium nitride wafer. More in detail, we characterized Gallium nitride on Silicon substrate before and after the fabrication of the final device and demonstrated how the fabrication process can be optimized.

“Front-end-ization” of the Back-End

2013 ◽  
Vol 2013 (1) ◽  
pp. 000799-000803
Author(s):  
Rajiv Roy
Keyword(s):  
Process Control ◽  
Defect Inspection ◽  
Advanced Process Control ◽  
Front End ◽  
Cost Of Ownership ◽  
Fine Pitch ◽  
Advanced Packaging ◽  
3D Stacking

The trend towards 3D stacking and advanced packaging has significantly altered the requirements for manufacturing tools in the back-end. Techniques and processes being adopted are beginning to resemble the front-end of 20 years ago but with updated and more affordable cost-of ownership capabilities. As an example, 0.5um defect inspection would have been considered a front-end requirement 20 years ago. Today TSV and advanced packaging techniques such as fine-pitch RDL are demanding 0.5u level inspection but at perhaps 10x improvement in wafer throughput and 20x improvement in COO. Other Front-end capabilities ranging from metrology to Advanced Process Control (APC) that are being adopted by the back-end will also be discussed.

Smart in-line defectivity/metrology process control solution for advanced 3D integration

2016 ◽  
Vol 2016 (1) ◽  
pp. 000032-000037 ◽  
Author(s):  
Amina Sidhoum ◽  
Nicolas Devanciard ◽  
Franck Bana ◽  
Arnaud Garnier ◽  
Nicolas Bresson ◽  
...  
Keyword(s):  
Process Control ◽  
Visual Inspection ◽  
Fabrication Process ◽  
Inspection Time ◽  
3D Integration ◽  
Control Solution ◽  
Automatic Visual Inspection ◽  
Morphology Characterization ◽  
Manufacturing Environments ◽  
First Time

Abstract When combined with in-line local metrology, Automatic Visual Inspection/Classification is a powerful tool to characterize 3D interconnect processes, either at the R&D level or in volume manufacturing environments. A new methodology that uses visual inspection results to drive local smart metrology was used for the first time to control the fabrication process of micro-pillar/micro-bump vertical contacts. Quantification of the inspection time when the smart logic concept was used revealed a throughput increase of 23% on average, while consistency of the automatic morphological accuracy was preserved as confirmed by in-line mechanical profilometry. The morphology characterization is discussed with respect to the electrical performances at die level.

Liquid‐to‐solid ratio control as an advanced process control solution for continuous twin‐screw wet granulation

AIChE Journal ◽  
2018 ◽  
Vol 64 (7) ◽  
pp. 2500-2514 ◽  
Author(s):  
Niels Nicolaï ◽  
Fien De Leersnyder ◽  
Dana Copot ◽  
Michiel Stock ◽  
Clara M. Ionescu ◽  
...  
Keyword(s):  
Process Control ◽  
Wet Granulation ◽  
Control Solution ◽  
Advanced Process Control ◽  
Solid Ratio ◽  
Twin Screw

Increasing revenue and reducing cost through the use of advanced process control technology in the sugar industry

2016 ◽  
pp. 620-624
Author(s):  
Scott Kahre
Keyword(s):  
Process Control ◽  
Sugar Industry ◽  
Operating Cost ◽  
Control Technology ◽  
Advanced Process Control ◽  
Output Controller ◽  
Complex Processes ◽  
Unit Operations ◽  
Sugar Unit ◽  
Optimum Cost

Advanced process control technology can provide sugar processors the ability to realize major revenue enhancements and/or operating cost reductions with low initial investment. One technology in particular, model predictive control (MPC), holds the potential to increase production, reduce energy costs, and reduce quality variability in a wide variety of major sugar unit operations. These include centrifugal stations, pulp dryers, extractors, diffusers, mills, evaporating crystallizers, juice purification, and more. Simple payback periods as low as two months are projected. As a PC-based add-on to existing distributed control systems (DCS) or programmable logic controller (PLC) systems, MPC acts as a multi-input, multi-output controller, utilizing predictive process response models and optimization functions to control complex processes to their optimum cost and quality constraints.

Sign in / Sign up

Export Citation Format

Share Document