Photolithographic Properties of Photosensitive Ag Paste for Low Temperature Cofiring

Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

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Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-020-03207-y ◽

2020 ◽

Vol 31 (8) ◽

pp. 6497-6505

Author(s):

Hui Fang ◽

Chenxi Wang ◽

Shicheng Zhou ◽

Qiushi Kang ◽

Te Wang ◽

...

Keyword(s):

Low Temperature ◽

Large Area ◽

Ag Paste ◽

Low Temperature Bonding

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Low temperature sintering of MOD assisted Ag paste for die-attach application

Materials Letters ◽

10.1016/j.matlet.2021.130799 ◽

2021 ◽

pp. 130799

Author(s):

Xun Liu ◽

Li Liu ◽

Rong Sun ◽

Junjie Li

Keyword(s):

Low Temperature ◽

Low Temperature Sintering ◽

Die Attach ◽

Ag Paste

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Exsolution and inversion in pigeonite from the Whin Sill, Northern England

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100109513 ◽

1978 ◽

Vol 36 (1) ◽

pp. 474-475

Author(s):

P.P.K. Smith

Keyword(s):

High Temperature ◽

Low Temperature ◽

Homogeneous Nucleation ◽

Silicate Mineral ◽

Antiphase Boundaries ◽

Two Phase ◽

Primitive Form ◽

The Core ◽

Nucleation Mechanisms ◽

And Inversion

Grains of pigeonite, a calcium-poor silicate mineral of the pyroxene group, from the Whin Sill dolerite have been ion-thinned and examined by TEM. The pigeonite is strongly zoned chemically from the composition Wo8En64FS28 in the core to Wo13En34FS53 at the rim. Two phase transformations have occurred during the cooling of this pigeonite:- exsolution of augite, a more calcic pyroxene, and inversion of the pigeonite from the high- temperature C face-centred form to the low-temperature primitive form, with the formation of antiphase boundaries (APB's). Different sequences of these exsolution and inversion reactions, together with different nucleation mechanisms of the augite, have created three distinct microstructures depending on the position in the grain.In the core of the grains small platelets of augite about 0.02μm thick have farmed parallel to the (001) plane (Fig. 1). These are thought to have exsolved by homogeneous nucleation. Subsequently the inversion of the pigeonite has led to the creation of APB's.

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