Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications

2002 ◽  
Author(s):  
M. Ray Fairchild ◽  
Rick B. Snyder ◽  
Carl W. Berlin ◽  
D.H.R. Sarma
Keyword(s):  
Harsh Environment ◽  
Automotive Electronics

scholarly journals Thermoelectric Cooling to Survive Commodity DRAMs in Harsh Environment Automotive Electronics

IEEE Access ◽  
2021 ◽  
pp. 1-1
Author(s):  
Deepak M. Mathew ◽  
Hammam Kattan ◽  
Christian Weis ◽  
Jorg Henkel ◽  
Norbert Wehn ◽  
...  
Keyword(s):  
Harsh Environment ◽  
Automotive Electronics ◽  
Thermoelectric Cooling

Tantalum Capacitor Technology Options for High Temperature and Harsh Environment Applications

2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000299-000306
Author(s):  
Chris Reynolds
Keyword(s):  
High Temperature ◽  
Industrial Applications ◽  
Harsh Environment ◽  
Self Healing ◽  
Automotive Electronics ◽  
Hermetic Seal ◽  
Two Factors ◽  
Military Systems ◽  
Long Lifetime ◽  
New Generation

Abstract As new temperature critical applications continue to emerge, the need for components capable of enduring temperatures up to and exceeding 200°C is increasing. Advanced down-hole electronics, underhood automotive and aerospace systems rely on components delivering optimal performance while subject to extreme environmental conditions. This paper will discuss the design advances in tantalum technology that have given rise to innovative devices that provide the enabling technology for a new generation of applications. Traditionally, hermetically sealed “wet” axial tantalum capacitors (utilizing a non-solid electrolyte that promotes self-healing and long lifetime), have been used for both high bulk capacitance (to 5,600uF) and high voltage applications (to 125VDC). In recent years, this technology has been developed to meet the 200°C operational requirements of harsher environment industrial applications. For lower operating voltages (6v – 25v), SMD packages are preferred, and for several years, 200°C rated high temperature solid tantalum chip devices have been the preferred technology over “wet” tantalum for capacitances to 220uF, being smaller size, lower cost and having the combination of lower ESR and higher frequency response. More recently, hermetic SMD packaging has been developed for SMD solid tantalum capacitors. The hermetic seal enables the internal element to be operated in an inert gas environment, while offering superior resistance to moisture ingress. These two factors enable operation to 230°C, with higher capacitance (up to 330uF) and voltage (up to 63vDC) ranges. Both molded and hermetic high temperature SMD solid tantalum capacitors have been developed to be compatible with high temperature pcb or hybrid circuit assembly processes, with a range of termination finishes compatible with HMP solder, epoxy or wire bonding. Their design also harsh mechanical environment shock & vibration. This paper will discuss the evolution in materials, design and testing for each of these technologies, along with the considerations taken into account to give maximum compatibility with emerging requirements in high temperature and harsh environment applications, with emphasis on down-hole oil exploration, aerospace and military systems and underhood automotive electronics.

Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications

2015 ◽  
Vol 2015 (1) ◽  
pp. 000751-000756
Author(s):  
James McLeish ◽  
Randy Schueller
Keyword(s):  
High Reliability ◽  
Gold Wire ◽  
Consumer Products ◽  
Harsh Environment ◽  
Automotive Electronics ◽  
Package Design ◽  
Automotive Market ◽  
Wire Bonds ◽  
Bond Wires ◽  
Validation Tests

The transition to replace gold with copper bond wires in semiconductor components, primarily driven by the ever increasing price of gold wire, has been under way for several years. Cu wire bonds (Cu-WBs) are technically more challenging than gold to produce, requiring improved designs, processes and equipment. After introduction in consumer products, their use is now migrating to automotive electronics where product integrity for quality, reliability and durability (QRD) and safety over 10–15 years in a demanding harsh environment is paramount, in addition to managing cost in the highly competitive global automotive market. Reliability issues with some Cu wire bonded components detected during the rigorous product validation durability–reliability tests of automotive electronics, however, are starting to appear. The indications are that only optimized package design with well-controlled assembly processes are suitable for high reliability (hi-rel) harsh environment applications such as automotive, military and aerospace. A concern is that non-optimized Cu-WBs and package materials issues are being detected in module-level durability validation tests in parts that were qualified as automotive grade per AEC Q-100 or AEC-Q101. This article will explore the issues and discuss potential solutions as the Automotive Electronics Council (AEC) – the organization that defines requirements for automotive grade electronic components – works to update qualification procedures for evolving Cu-wire bond technology.

Reliability of Cu Wirebonded ICs for Automotive Applications

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001721-001752
Author(s):  
Jim McLeish ◽  
Greg Caswell ◽  
Randy Schueller
Keyword(s):  
High Reliability ◽  
Gold Wire ◽  
Consumer Products ◽  
Harsh Environment ◽  
Automotive Electronics ◽  
Package Design ◽  
Automotive Market ◽  
Wire Bonds ◽  
Bond Wires ◽  
Validation Tests

The transition to replace gold with copper bond wires in semiconductor components, primarily driven by the ever increasing price of gold wire, has been under way for several years. Cu wire bonds (Cu-WBs) are technically more challenging than gold to produce, requiring improved designs, processes and equipment. After introduction in consumer products, their use is now migrating to automotive electronics where product integrity for quality, reliability and durability (QRD) and safety over 10–15 years in a demanding harsh environment is paramount, in addition to managing cost in the highly competitive global automotive market. Reliability issues with some Cu wire bonded components detected during the rigorous product validation durability–reliability tests of automotive electronics, however, are starting to appear. The indications are that only optimized package design with well-controlled assembly processes are suitable for high reliability (hi-rel) harsh environment applications such as automotive, military and aerospace. A concern is that non-optimized Cu-WBs and package materials issues are being detected in module-level durability validation tests in parts that were qualified as automotive grade per AEC Q-100 or AEC-Q101. This paper will explore the issues and discuss potential solutions as the Automotive Electronics Council (AEC) – the organization that defines requirements for automotive grade electronic components – works to update qualification procedures for evolving Cu-wire bond technology.

Automotive Electronics

IEE Review ◽  
1992 ◽  
Vol 38 (1) ◽  
pp. 32 ◽  
Author(s):  
M.H. Westbrook
Keyword(s):  
Automotive Electronics

Automotive Electronics

IEE Review ◽  
1988 ◽  
Vol 34 (5) ◽  
pp. 202
Author(s):  
C.H.G. Mills
Keyword(s):  
Automotive Electronics

Magnetostrictive Cold Spray Sensor for Long-Term or Harsh Environment Ultrasound

2019 ◽  
Author(s):  
S. W. Glass ◽  
◽  
J. P. Lareau ◽  
K. S. Ross ◽  
S. Ali ◽  
...  
Keyword(s):  
Cold Spray ◽  
Harsh Environment

The Valuable Impacts of Halophytic Genus Suaeda; Nutritional, Chemical, and Biological Values

2020 ◽  
Vol 16 (8) ◽  
pp. 1044-1057 ◽  
Author(s):  
Hamdoon A. Mohammed
Keyword(s):  
Search Engines ◽  
Scientific Literature ◽  
High Salinity ◽  
Chemical Constituents ◽  
Harsh Environment ◽  
Science Literature ◽  
Medicinal Uses ◽  
Nutritional Values ◽  
Alternative Medicines ◽  
Natural Substances

Background: Suaeda is a halophytic genus belonging to the Amaranthaceae family and can survive in the high salted marsh areas of the world. Suaeda plants can biosynthesize natural substances with powerful antioxidant activity and are considered as a renewable source of energy, food, and edible oil for a larger number of populations living in the harsh environment with high salinity and drought conditions. These plants also meet folk and alternative medicines' needs. Methods: The review encompasses available scientific literature related to folk medicinal uses of Suaeda plants, their nutritional values, and chemical constituents. In addition, the biological trials applied for the Suaeda plants are also part of the review. The review covers the researches from major science literature search engines and other sites representing scientific literature, i.e., Scifinder, Google Scholar, PubMed, ScienceDirect, Scopus, and Google. The searches were programmed on the advance options available in the search engines and are latest up to November 2019. The searches were exhaustive and rechecked for accuracy. Conclusion: The study summarizes the uses of Suaeda plants as a remedy for various ailments due to their contents from the polyphenols and flavonoids. The comparatively large amounts of fixed oils, minerals, and vitamins in Suaeda plants have also made them potential renewable sources for foods.

scholarly journals 2D kinematics of massive stars near the Galactic Centre

2020 ◽  
Vol 500 (3) ◽  
pp. 3213-3239
Author(s):  
Mattia Libralato ◽  
Daniel J Lennon ◽  
Andrea Bellini ◽  
Roeland van der Marel ◽  
Simon J Clark ◽  
...  
Keyword(s):  
Moving Objects ◽  
Hubble Space Telescope ◽  
Massive Stars ◽  
Line Of Sight ◽  
Galactic Centre ◽  
Harsh Environment ◽  
Proper Motions ◽  
Sgr A ◽  
Better Than ◽  
Rule Out

ABSTRACT The presence of massive stars (MSs) in the region close to the Galactic Centre (GC) poses several questions about their origin. The harsh environment of the GC favours specific formation scenarios, each of which should imprint characteristic kinematic features on the MSs. We present a 2D kinematic analysis of MSs in a GC region surrounding Sgr A* based on high-precision proper motions obtained with the Hubble Space Telescope. Thanks to a careful data reduction, well-measured bright stars in our proper-motion catalogues have errors better than 0.5 mas yr−1. We discuss the absolute motion of the MSs in the field and their motion relative to Sgr A*, the Arches, and the Quintuplet. For the majority of the MSs, we rule out any distance further than 3–4 kpc from Sgr A* using only kinematic arguments. If their membership to the GC is confirmed, most of the isolated MSs are likely not associated with either the Arches or Quintuplet clusters or Sgr A*. Only a few MSs have proper motions, suggesting that they are likely members of the Arches cluster, in agreement with previous spectroscopic results. Line-of-sight radial velocities and distances are required to shed further light on the origin of most of these massive objects. We also present an analysis of other fast-moving objects in the GC region, finding no clear excess of high-velocity escaping stars. We make our astro-photometric catalogues publicly available.

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