Surface Roughness and Wettability of SAC/CNT Lead Free Solder

2016 ◽  
Vol 857 ◽  
pp. 73-75 ◽  
Author(s):  
Norliza Ismail ◽  
Roslina Ismail ◽  
Nik Khairul Amilin Nik Ubaidillah ◽  
Azman Jalar ◽  
Norazwani Muhammad Zain
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Substrate Surface ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Substrate Surface Roughness ◽  
Free Solder

The effect of substrate surface roughness on the wettability of SAC237 (Sn 99.9%, Ag 0.3%, Cu 0.7%) with difference percentage of CNT on copper substrate was investigated. Solder paste of SAC 237 without CNT, 0.01% and 0.04% of CNT were reflowed at 270°C on different surface roughness of Cu substrate (abrasive number 240, 400, 600, 800). Contact angle of soldered samples measured by Infinite Focus Microscope (IFM). As a result, contact angle value of investigated solders range 7° to 20°. Contact angle obtained decreases with the increasing surface roughness of Cu substrate. This demonstrates that rougher substrate enhance the wettability of the solders. Addition of CNT also effects the wettability of investigated solders. Higher composition of CNT show better wettability.

Contact Angle of Sn-8Zn-3Bi Lead-free Solder Alloy on Copper Substrate

2020 ◽  
Vol 30 (7) ◽  
pp. 49-53
Author(s):  
Ngoc Binh Duong
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Effect Of Temperature ◽  
Lead Free Solder ◽  
Experimental Conditions ◽  
Lead Free Solder Alloy ◽  
Free Solder

The wettability of Sn-8Zn-3Bi lead free solder alloy on the copper substrate was evaluated via measuring the contact angle of the solder and the substrate. The measured contact angle was then compared to the contact angle of the traditional and widely used eutectic Sn-37Pb solder alloy. Experiments to study the effect of temperature, flux, and surface roughness of the substrate on the contact angle were also carried out. The results show that the contact angle of Sn-8Zn-3Bi on copper substrate decreased as temperature increases. The minimum value of the contact angle obtained was approximately 23° for Sn-8Zn-3Bi. At the same experimental conditions, contact angle of Sn-8Zn-3Bi is higher than that of Sn-37Pb. When three types of fluxes were used, at 230°C, contact angle of Sn-8Zn-3Bi has the smallest value with the MHS37 flux, 25°, and it has the largest value with the zinc chloride flux, 47°. The surface roughness of the substrate has little influence on contact angle of Sn-8Zn-3Bi on copperand the contact angle has changed a few degrees as the roughness changed.

scholarly journals Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead-Free Solder Paste

2018 ◽  
Vol 2018 ◽  
pp. 1-10 ◽  
Author(s):  
Kannachai Kanlayasiri ◽  
Nadee Meesathien
Keyword(s):  
Zinc Oxide ◽  
Zno Nanoparticles ◽  
Intermetallic Layer ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Nano Zno ◽  
Solder Pastes ◽  
Free Solder

This research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. The results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. The maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. The findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. The slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu6Sn5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan

2013 ◽  
Vol 315 ◽  
pp. 675-680 ◽  
Author(s):  
Efzan M.N. Ervina ◽  
S.Y. Tan
Keyword(s):  
Contact Angle ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Temperature ◽  
Ε Phase ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Significant Increment

This work presents the studies of wettability Sn-6Zn-4Bi lead-free solder alloy in electronic applications. A reference solder Sn-3.1Ag-0.9 Cu lead-free solder alloy is used to compare the properties of both solders. Differential Scanning Calorimeter (DSC) profile, wettability and the microstructure of the solder were investigated. The melting temperature of Sn-Zn-Bi (Tm=194.97°C) is lower than Sn-Ag-Cu (Tm=220.40°C). Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for Sn-Ag-Cu was decreasing from 28.23º to 24.97º and for Sn-Zn-Bi solder alloys were decreasing from 48.92º to 29.78º as the temperature increased from 230°C to 250°C. A significant increment of contact angle for Sn-Zn-Bi at 270°C and the contact angle did not change at 270°C for Sn-Ag-Cu. The result of spreading area is inversed with the contact angle. The layers of intermetallic compound were examined by energy-dispersive X-ray. The Sn-Zn-Bi solder exhibits a mixture of Cu-Sn+Cu-Zn phase and ϒ-Cu5Zn8phase. The Sn-Ag-Cu solder exhibits Cu6Sn5 (η-phase) and Cu3Sn (ε-phase). As a conclusion, Sn-Zn-Bi is a potential lead-free solder to develop based on its wettability properties than previous available solder materials.

Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

2012 ◽  
Vol 710 ◽  
pp. 569-574 ◽  
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Alloy ◽  
Surface Texture ◽  
Copper Substrate ◽  
Dynamic Contact Angle ◽  
Dynamic Contact ◽  
Contact Angles ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Free Solder

In the present work, the effect of surface texture on wetting characteristics of lead-free solder Sn-0.7Cu on copper substrates have been investigated at 298°C. The wetting tests were carried out using FTA 200 (First Ten Angstrom) dynamic contact angle analyzer. The surface texture of copper substrate significantly affected the wetting properties of Sn-0.7Cu solder alloy. Contact angles of about 30° were obtained on Cu substrate having smooth surface texture (Ra = 0.0155µm). On other hand contact angles on rough copper surface texture (Ra = 1.1194µm) were reduced to 20°. The contact angles decreased with increasing surface texture of Cu substrate. For rough Cu substrate, it seems that the solder atoms dissolve into the substrate in the time period of 200-600s.

Wetting and Intermetallic Study between Sn-3.5Ag-1.0Cu-xZn Lead-Free Solders and Copper Substrate (x = 0, 0.1, 0.4, 0.7)

2012 ◽  
Vol 501 ◽  
pp. 150-154 ◽  
Author(s):  
Ramani Mayappan
Keyword(s):  
Copper Substrate ◽  
Electronics Industry ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Spreading Area ◽  
Cu Substrate ◽  
Soldering Time ◽  
Free Solder ◽  
Lead Free Solders

The development of lead-free solders has been an essential task in the electronics industry because of the restriction of lead use by legislation. Among the candidates, Sn-Ag-Cu group of solder alloys have great advantages to replace the conventional Sn-Pb solder. In this study, the wetting and intermetallic study between Sn-3.5Ag-1.0Cu-xZn lead-free solder reacting on copper substrate were investigated under different soldering conditions. The addition of 0.7wt% of Zn improved the wettability on Cu substrate since it has the highest spreading area at 310°C. The Cu6Sn5 and Cu3Sn phases are the main interface intermetallic formed and these intermetallics increased in thickness with time and temperature. At 270°C, the addition of 0.7wt% Zn retarded the growth of Cu3Sn intermetallic until 10 min of the soldering time. Generally the addition of Zn was beneficial in retarding the total intermetallic thickness.

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging

2015 ◽  
Vol 1087 ◽  
pp. 162-166
Author(s):  
Nor Aishah Jasli ◽  
Hamidi Abd Hamid ◽  
Ramani Mayappan
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Intermetallic Formation ◽  
X Ray ◽  
Ni Addition ◽  
Free Solder ◽  
Scanning Electron

This study investigated the effect of Ni addition on intermetallic formation in the Sn-8Zn-3Bi solder under liquid state aging. The intermetallic compounds were formed by reacting the solder alloy with copper substrate. Different reflow time was used at temperature 220°C. Morphology of the phases formed was observed using scanning electron microscope (SEM) and in order to determine elemental compositions of the phases, energy dispersive x-ray (EDX) was used. The formation of the reaction layer led by Cu5Zn8 intermetallic and then followed by Cu6Sn5 and Cu3Sn when reflow time increases. Keywords: lead free solder, intermetallic, Cu5Zn8, Cu6Sn5, liquid state aging.

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