An Experimental and Theoretical Study of Heat Conduction and Vulcanization of Rubber Compounds in Molds

1987 ◽  
Vol 60 (1) ◽  
pp. 140-158 ◽  
Author(s):  
Dancheng Kong ◽  
James L. White ◽  
Frederick C. Weissert ◽  
Nobuyuki Nakajima

Abstract A fundamental study on curing of rubber compounds in molds is presented. We have measured the thermal conductivity of a range of rubber compounds determining the influence of carbon black, other fillers, and oil. The heats of reaction associated with the curing kinetics of model compounds were measured. A mathematical model is proposed to predict the temperature profiles for curing a reactive slab. This involves inclusion of an energy generation rate, which depends on time and temperature. This is expressed through a Damkohler number. Solutions of the heat conduction equation are interpreted in terms of the Fourier number and the Damkohler number. Calculations are carried out using experimentally determined thermal conductivities and curing kinetics. Thick parts are shown to heat up more slowly (associated with the Fourier number) and to show greater overshoots of cure temperature (associated with the Damkohler number).

2011 ◽  
Vol 474-476 ◽  
pp. 137-142
Author(s):  
Wen Xian Tang ◽  
Jian Zhang ◽  
Bao Ma

This paper was devoted to the numerical simulation the resin curing process. Anisotropic conduction was considered in the model. And Kamal-Ryan model was used to describe the curing kinetics of the resin. The general purpose finite element code ABAQUS was used in conjunction with its user subroutine UMATHT to solve the heat conduction equation and the kinetic model, simultaneously. Then corresponding experiment was carried out to validate the model. Finally, rate-of-cure, temperature and state-of-cure were analyzed during the curing process.


2014 ◽  
Vol 622-623 ◽  
pp. 453-458
Author(s):  
Hui Bin Ou ◽  
Mohamed Sahli ◽  
Thierry Barrière ◽  
J.C. Gelin

In recent years, multi-component injection molding has largely developed in the industries. During the manufacturing process, the critical challenge is in achieving an optimum adhesion between the two materials. This study examines the influence of curing kinetics on the interfacial adhesion strength between a silicone rubber and nylon 66 using a rotational rheometer. The evolution of adhesion strength of assembly during the curing behaviour of silicone rubber was measured by tensile test at different curing temperature and different curing time. The results showed a significant increase in adhesion was obtained while either the curing temperature or the curing time increased. In this study, the rheological property of silicone rubber fluid has been also determined by the rotational rheometer. In addition, the kinetics of the curing reaction of silicone rubber has been studied by differential scanning calorimeter.


INEOS OPEN ◽  
2018 ◽  
Vol 1 (1) ◽  
pp. 64-70
Author(s):  
O. N. Zabegaeva ◽  
◽  
D. A. Sapozhnikov ◽  
B. A. Bayminov ◽  
S. A. Zinov'eva ◽  
...  

2010 ◽  
Vol 42 (1) ◽  
pp. 51-57 ◽  
Author(s):  
Kun Huang ◽  
Jianling Xia ◽  
Xiaohua Yang ◽  
Mei Li ◽  
Haiyang Ding

2007 ◽  
Vol 90 (1) ◽  
pp. 229-236 ◽  
Author(s):  
N. Gabilondo ◽  
M. López ◽  
J. A. Ramos ◽  
J. M. Echeverría ◽  
I. Mondragon

Coatings ◽  
2018 ◽  
Vol 8 (3) ◽  
pp. 99 ◽  
Author(s):  
Ji-Won Park ◽  
Jong-Gyu Lee ◽  
Gyu-Seong Shim ◽  
Hyun-Joong Kim ◽  
Young-Kwan Kim ◽  
...  

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