scholarly journals Microencapsulation of Paraffin Wax in Melamine-Formaldehyde for use in Thermal Management Study

2021 ◽  
Vol 10 ◽  
pp. 84-91
Author(s):  
S.S. Pawar ◽  
C. Suryanarayana ◽  
A.B. Samui

Melamine formaldehyde microcapsules containing paraffin wax as phase change material (PCM) were synthesized. Free space was generated in-situ inside microcapsules. These were characterized by FTIR Spectrophotometer, Scanning electron microscope (SEM), Differential Scanning colorimeter (DSC), and optical microscope. It was confirmed that PCM was successfully encapsulated inside the shell material. Encapsulated PCM showed good phase change properties during heating and cooling. Enthalpy value of about 100 J/g was observed. The shape of the microcapsule, showing rough morphology is expected to help during processing and crystallization. It has been experimentally confirmed that no leakage occurs during the melting of PCM. Effectiveness in temperature control in a hot environment was also found to be satisfactory.

2020 ◽  
Vol 143 (1) ◽  
Author(s):  
Collier S. Miers ◽  
Amy Marconnet

Abstract Phase change materials (PCMs) are effective at storing thermal energy and are attractive for use in electronics to smooth temperature peaks during periods of high demand; however, the use of PCMs has been somewhat limited due to the poor thermal properties of the materials. Here, we propose a design for a tunable composite PCM heat sink for passive thermal management in electronic systems and develop an improved test platform to directly compare performance between different designs and PCMs. The composite design leverages high conductivity pathways, which are machined into aluminum heat sinks, and back-filled with PCMs. Two package sizes are considered with several internal fin structures. All designs are evaluated using a test platform with realistic power profiles, controlled interfacial loading, and in situ temperature measurement. The composite PCM heat sinks are benchmarked against solid aluminum packages of the same size. This study focuses on three commercially available PCMs. Performance is evaluated based on (1) the time it takes the test heater chip below each composite PCM package to reach the cut-off temperature of 95 °C and (2) the period of a full melt-regeneration cycle. A range of heat fluxes are considered in this study spanning 6.8–14.5 W cm−2. The isokite design with PlusICE S70 extends the time to reach 95 °C by 36.2% when compared to the solid package, while weighing 17.3% less, making it advantageous for mobile devices.


2018 ◽  
Vol 68 (2) ◽  
pp. 218 ◽  
Author(s):  
Kh. Gopal Krishna Singh ◽  
Sudipta Halder ◽  
Sukumar Pati ◽  
Jialai Wang

Microencapsulation of phase change materials (PCMs) with metallic shell materials is a very innovative and challenging task. This can mitigate the problems related to thermal barrier for conventional nonconductive shell materials as well as enhance mechanical properties of PCM microcapsules. Such microcapsules can be integrated into microelectronic devices for their intermittent thermal management in mission critical components. The present work is aimed at developing a new method to synthesise phase change material encapsulated with metallic shell material and characterising the same. Paraffin wax microspheres were first synthesised and then encapsulated with silver through in situ chemical reduction. Further more, a new set of experiments were identified to analyse the quality of encapsulation. The thermal properties were investigated under differential scanning calorimeter and thermogravimetric analyser. The average diameter of paraffin wax microspheres (PW) is found to be ±329 μm. It reveals from DSC analysis that the enthalpy of fusion is minimum for PW@Ag-PVA amongst all others. Accordingly, higher deposition of Ag is possible for PW@Ag-PVA. This is also supported by TGA results where PW@Ag-PVA has only 40 per cent mass loss and the remaining samples have 100 per cent. However, even for PW@Ag-PVA the encapsulation is found incomplete. The present work provides knowhow of the difficulties associated with encapsulation of PCMs with metallic shell material.<br /><br />


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