GaN-on-Si Enhancement Mode Metal Insulator Semiconductor Heterostructure Field Effect Transistor with On-Current of 1.35 A/mm

2013 ◽  
Vol 52 (9R) ◽  
pp. 090204 ◽  
Author(s):  
Herwig Hahn ◽  
Fouad Benkhelifa ◽  
Oliver Ambacher ◽  
Assadullah Alam ◽  
Michael Heuken ◽  
...  
Keyword(s):  
Field Effect ◽  
Field Effect Transistor ◽  
Metal Insulator ◽  
Metal Insulator Semiconductor ◽  
Enhancement Mode ◽  
Semiconductor Heterostructure ◽  
Effect Transistor ◽  
Gan On Si

Diamond logic inverter with enhancement-mode metal-insulator-semiconductor field effect transistor

2014 ◽  
Vol 105 (8) ◽  
pp. 082110 ◽  
Author(s):  
J. W. Liu ◽  
M. Y. Liao ◽  
M. Imura ◽  
E. Watanabe ◽  
H. Oosato ◽  
...  
Keyword(s):  
Field Effect ◽  
Field Effect Transistor ◽  
Metal Insulator ◽  
Metal Insulator Semiconductor ◽  
Enhancement Mode ◽  
Effect Transistor

Fabrication of Enhancement-Mode GaN-Based Metal–Insulator-Semiconductor Field Effect Transistor

2000 ◽  
Vol 622 ◽  
Author(s):  
P. Chen ◽  
R. Zhang ◽  
Y.G. Zhou ◽  
S.Y. Xie ◽  
Z.Y. Luo ◽  
...  
Keyword(s):  
Field Effect ◽  
Field Effect Transistor ◽  
Voltage Measurement ◽  
Device Structure ◽  
Insulator Layer ◽  
Metal Insulator ◽  
Metal Insulator Semiconductor ◽  
Enhancement Mode ◽  
Piezoelectric Field ◽  
Effect Transistor

ABSTRACTAn enhancement-mode GaN metal-insulator-semiconductor field-effect transistor was successfully fabricated on a GaN/AlGaN/GaN double heterojunction structure with SiO2 as insulator layer. The enhancement mode DC characteristics have been achieved in the device with a gate length of 6 μm and a gate width of 100 μm. The device exhibited a DC transconductance of 0.6 mS/mm and a maximum drain-source current of 5 mA/mm. The gate leakage current is lower than 10−6 A at a bias of -10 V and the gate breakdown voltage is higher than 20 V. The channel stands a good chance of forming by hole accumulation between the top GaN layer and the AlGaN layer. The p-channel can be attributed to the presence of a piezoelectric field in the heterojunction, and the strongly asymmetric band bending and carriers distribution induced by the piezoelectric field. High-frequency capacitance-voltage measurement also gives a circumstantial evidence of the presence of a p-channel in the device structure.

AlN/AlGaN/GaN Metal Insulator Semiconductor Heterostructure Field Effect Transistor

2002 ◽  
Vol 41 (Part 1, No. 7A) ◽  
pp. 4481-4483 ◽  
Author(s):  
Dong-Hyun Cho ◽  
Mitsuaki Shimizu ◽  
Toshihide Ide ◽  
Hideyuki Ookita ◽  
Hajime Okumura
Keyword(s):  
Field Effect ◽  
Field Effect Transistor ◽  
Metal Insulator ◽  
Metal Insulator Semiconductor ◽  
Semiconductor Heterostructure ◽  
Effect Transistor
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