scholarly journals PCB access impedances extraction method of in-situ integrated circuit

2018 ◽  
Vol 7 (3) ◽  
pp. 108-116 ◽  
Author(s):  
Z. Xu ◽  
B. Ravelo ◽  
J. Gantet ◽  
N. Marier
Keyword(s):  
Integrated Circuits ◽  
Transmission Lines ◽  
Integrated Circuit ◽  
Extraction Method ◽  
Printed Circuit Boards ◽  
Voltage Source ◽  
Circuit Boards ◽  
Passive Network ◽  
Impedance Extraction ◽  
Network Good

This article describes an extraction technique of input and output impedances of integrated circuits (ICs) implemented onto the printed circuit boards (PCBs). The feasibility of the technique is illustrated with a proof-of-concept (POC) constituted by two ICs operating in a typically transmitter-receiver (Tx-Rx) circuit. The POC system is assumed composed of three different blocks of emitter signal source, load and interconnect passive network. This latter one is assumed defined by its chain matrix known from its electrical and physical characteristics. The proposed impedance extraction method is elaborated from the given signals at the transmitter output and receiver input. The terminal access impedances are formulated in function of the parameters of the interconnect system chain matrix. The feasibility of the method is checked with a passive circuit constituted by transmission lines driven by voltage source with RL-series network internal impedance and loaded at the output by the RC-parallel network. Good correlation between the access impedance reference and calculated is found.

EQUIVALENT DIPOLE MODEL FOR ESTIMATING THE NEAR FIELD OF RES STRUCTURES

2020 ◽  
pp. 102-106
Author(s):  
Т.С. Глотова ◽  
А.С. Иваницкий ◽  
В.В. Глотов
Keyword(s):  
Dipole Moment ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Printed Circuit Boards ◽  
Dipole Moments ◽  
Near Field ◽  
International Standards ◽  
Sufficient Information ◽  
Circuit Boards ◽  
Printed Circuit

Электромагнитная совместимость интегральных микросхем становится все более важным аспектом в разработке высокоскоростных печатных плат. Международные стандарты были установлены для количественной и качественной оценки характеристик интегральных микросхем, а также помехоустойчивости с использованием различных методов измерения. Для решения задач, связанных с прогнозированием электромагнитных помех между интегральными микросхемами и печатными платами, необходимы модели интегральных микросхем как на внутриаппаратурном уровне, так и внутрисистемном. Такие модели могут быть получены из моделирования при наличии достаточной информации об интегральной микросхеме. Однако в большинстве практических случаев подробная информация об интегральных микросхемах может быть недоступна разработчикам радиоэлектронного оборудования. Предлагается улучшенная модель дипольного момента для анализа характеристик связи ближнего и дальнего электромагнитного поля от интегральной микросхемы, полученная на основе сканирования ближнего поля. Представлен массив электрических и магнитных дипольных моментов, используемых для воспроизведения распределений поля в плоскости сканирования над интегральной микросхемой. Полученные дипольные моменты могут использоваться в качестве источников излучений для интегральной микросхемы. Усовершенствованная модель дипольного момента особенно полезна для решения проблем радиочастотных помех, когда необходимо точно проанализировать шумовую связь в ближнем поле Electromagnetic compatibility of integrated circuits is becoming an increasingly important aspect in the design of high-speed printed circuit boards. International standards have been established to quantitatively and qualitatively assess the performance of integrated circuits as well as noise immunity using a variety of measurement methods. To solve problems associated with predicting electromagnetic interference between integrated microcircuits and printed circuit boards, models of integrated microcircuits are needed both at the in-hardware and in-system levels. Such models can be obtained from simulations if there is sufficient information about the integrated circuit. However, in most practical cases, detailed information on integrated circuits may not be available to avionics designers. An improved model of the dipole moment is proposed for analyzing the characteristics of the coupling of the near and far electromagnetic fields from an integrated circuit, obtained on the basis of scanning the near field. An array of electric and magnetic dipole moments is presented, used to reproduce the field distributions in the scanning plane above an integrated microcircuit. The obtained dipole moments can be used as sources of radiation for an integrated circuit. The advanced dipole moment model is especially useful for solving RFI problems when it is necessary to accurately analyze noise communications in the near field

Suitable Conditions for Effective Inter Chip Communication based on Surface Wave Phenomenon

2021 ◽  
Vol 14 ◽  
Author(s):  
Mahaveer Penna ◽  
Shiva Shankar ◽  
Keshava Murthy ◽  
Jijesh J J
Keyword(s):  
Surface Wave ◽  
Integrated Circuits ◽  
Electromagnetic Waves ◽  
Printed Circuit Boards ◽  
Analytical Models ◽  
Circuit Boards ◽  
High Frequencies ◽  
Printed Circuit ◽  
High Data ◽  
Low Dispersion

Background: The communication between two Integrated Circuits (IC) of the Printed Circuit Boards (PCB) currently happening through copper traces which allow electric charge to flow. Several limitations being encountered with the copper traces during high data rate communication because of the resistivity factors, which eventually leads to the damage of traces and the system. Methods: The solution for this issue comes with the design of surface wave communication-based waveguide/channel between the IC’s. Surface wave communication over a specified communication fabric/channel performs the propagation of electromagnetic waves effectively even at high frequencies compared to the copper traces using conductor-dielectric combination. This paper deals in revealing suitable conditions through profound analytical models for achieving effective surface wave communication between the pins of integrated circuits. Results: The analysis includes defining the possible wave propagation terms, suitable channel design aspects for PCB application and corresponding analysis for effective communication at frequencies from 50GHz to 500GHz of millimeter range. This study provides the roadmap to explore a deterministic channel/fabric for pin to pin communication between the IC’s as an alternate for the copper traces. Conclusion: In this process, the proposed channel achieves low dispersion compared to the copper traces at millimeter frequency range.

scholarly journals Biodismantling, a Novel Application of Bioleaching in Recycling of Electronic Wastes

Recycling ◽  
2020 ◽  
Vol 5 (3) ◽  
pp. 22
Author(s):  
Benjamin Monneron-Enaud ◽  
Oliver Wiche ◽  
Michael Schlömann
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Raw Materials ◽  
Iron Sulfate ◽  
Circuit Boards ◽  
Copper Leaching ◽  
Valuable Metals ◽  
A New Technique ◽  
Abiotic Controls ◽  
Processing Steps

Electronic components (EC) from waste electrical and electronic equipment (WEEE) such as resistors, capacitors, diodes and integrated circuits are a subassembly of printed circuit boards (PCB). They contain a variety of economically valuable elements e.g., tantalum, palladium, gold, and rare earth elements. However, until recently there has been no systematic dismantling and recycling of the EC to satisfy the demand for raw materials. A problem connected with the recycling of the EC is the removal of the components (dismantling) in order to recover the elements in later processing steps. The aim of the present study was to develop a new technique of dismantling using bioleaching technology to lower costs and environmental impact. In triplicate batch experiments, used PCBs were treated by bioleaching using an iron-oxidizing mixed culture largely dominated by Acidithiobacillus ferrooxidans strains supplemented with 20 mM ferrous iron sulfate at pH 1.8 and 30 °C for 20 days. Abiotic controls were treated by similar conditions in two different variations: 20 mM of Fe2+ and 15 mM of Fe3+. After 20 days, successful dismantling was obtained in both the bioleaching and the Fe3+ control batch. The control with Fe2+ did not show a significant effect. The bioleaching condition presented a lower rate of dismantling which can partially be explained by a constantly higher redox potential leading to a competition of solder leaching and copper leaching from the printed copper wires. The results showed that biodismantling—dismantling using bioleaching—is possible and can be a new unit operation of the recycling process to maximize the recovery of valuable metals from PCBs.

Non-destructive detection methods for discontinuities of interconnection structures

2016 ◽  
Vol 33 (1) ◽  
pp. 23-35 ◽  
Author(s):  
Tomas Blecha
Keyword(s):  
Transmission Lines ◽  
Printed Circuit Boards ◽  
Characteristic Impedance ◽  
Diagnostic Methods ◽  
Detection Methods ◽  
Circuit Boards ◽  
Content Type ◽  
Multiple Line ◽  
Detection And Localization ◽  
Non Destructive

Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.

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