Study of Gold Ball Deformation and Formation Process of Bond Intermetallics in Thermosonic Wire Bonding

2013 ◽  
Vol 2 (1) ◽  
pp. 31-38
Author(s):  
Koichiro ATSUMI ◽  
Tetsuo ANDO ◽  
Ikuo MORI
Keyword(s):  
Formation Process ◽  
Wire Bonding ◽  
Gold Ball ◽  
Thermosonic Wire Bonding

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

2015 ◽  
Vol 137 (1) ◽  
Author(s):  
Fuliang Wang ◽  
Dengke Fan
Keyword(s):  
Experimental Study ◽  
Finite Element ◽  
Energy Conservation ◽  
Design Process ◽  
Gold Wire ◽  
Wire Bonding ◽  
Fe Model ◽  
Amplification Ratio ◽  
Model Studies ◽  
Thermosonic Wire Bonding

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.

Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach

2016 ◽  
Vol 700 ◽  
pp. 132-141
Author(s):  
Muhammad Nubli Zulkifli ◽  
Azman Jalar ◽  
Shahrum Abdullah ◽  
Norinsan Kamil Othman
Keyword(s):  
Wire Bonding ◽  
Strength Distribution ◽  
Nanoindentation Test ◽  
Ball Bond ◽  
New Approach ◽  
Bonding Parameter ◽  
Responsible Mechanism ◽  
Reduced Modulus ◽  
Gold Ball ◽  
Ball Bonds

The evaluation of the strength and bondability of gold, Au ball bond requires a new approach to provide a more detail data. Nanoindentation test was used as a new approach to evaluate the strength distribution and bondability of Au ball. Au ball bonds that experienced different value of wire bonding parameter namely bonding force, bonding time, bonding power, and stage temperature were used as samples for the present analysis. The distribution of strength based on hardness and reduced modulus values located at the bonding area of Au ball bonds were found to be related with the values of the wire bonding parameter. Nanoindentation test was found to be a suitable approach to analyze and evaluate the bondability of Au ball bond in a localized and detailed manner. In addition, the responsible mechanism for the thermosonic Au wire bonding can be identified and analyzed by using the results obtained from the nanoindentation test.

Experimental Study of Kick up Phenomenon in Thermosonic Wire-Bonding

2012 ◽  
Vol 160 ◽  
pp. 77-81
Author(s):  
Jing Jing Tian ◽  
Lei Han
Keyword(s):  
Image Processing ◽  
Experimental Study ◽  
High Speed ◽  
Gold Wire ◽  
Wire Bonding ◽  
Processing Method ◽  
Experimental Results ◽  
High Speed Camera ◽  
Depth Study ◽  
Thermosonic Wire Bonding

Kick-up phenomenon during looping is an important factor in thermosonic wire bonding. In this study, the loping process during wire bonding was recorded by using high-speed camera, and wire profiles evolution was obtained from images sequence by image processing method. With a polynomial fitting, the wire loop profiling was described by the curvature changing, and kick-up phenomenon on gold wire was found between the instant of 290th frame(0.0537s) to 380th frame (0.0703s), the change of curvature is divided into three phases, a looping phase, a mutation phase and a kick-up phase. While in the kick-up phase, the kick up phenomenon is the most obvious. These experimental results were useful for in-depth study of kick-up phenomenon by simulation.

Nanoindentation Study on Heat Treated Gold Wire Bonding

2016 ◽  
Vol 857 ◽  
pp. 31-35
Author(s):  
Wan Yusmawati Wan Yusoff ◽  
Azman Jalar ◽  
Norinsan Kamil Othman ◽  
Irman Abdul Rahman
Keyword(s):  
High Temperature ◽  
Storage Period ◽  
Gold Wire ◽  
Constant Load ◽  
Wire Bonding ◽  
Nanoindentation Test ◽  
High Temperature Storage ◽  
Gold Ball ◽  
Ball Bonds ◽  
Temperature Storage

The effect of high temperature storage of gold ball bonds towards micromechanical properties has been investigated. Gold wire from thermosonic wire bonding exposed to high temperature storage at 150 °C for 10, 100 and 1000 hours. The nanoindentation test was used in order to evaluate the high temperature storage effect on wire bonding in more details and localized. Prior to nanoindentation test, the specimens were cross-sectioned diagonally. The constant load nanoindentation was performed at the center of gold ball bond to investigate the hardness and reduced modulus. The load-depth curve of nanoindentation for the high temperature storage gold wire has apparent the discontinuity during loading compared to as-received gold wire. The hardness value increased after subjected to high temperature storage. However, the hardness decreased when the storage period is extended. The decreasing in the hardness value may due to the grain size of Au metal which recrystallized after subjected to high temperature storage. The results obtained from nanoindentation is important in assessing the high temperature storage of wire bonding.

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding

2011 ◽  
Vol 51 (1) ◽  
pp. 43-52 ◽  
Author(s):  
A. Pequegnat ◽  
H.J. Kim ◽  
M. Mayer ◽  
Y. Zhou ◽  
J. Persic ◽  
...  
Keyword(s):  
Flow Rate ◽  
Wire Bonding ◽  
Free Air ◽  
Thermosonic Wire Bonding
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