wireless testing
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2021 ◽  
Author(s):  
Christoph Cammin ◽  
Dmytro Krush ◽  
Ralf Heynicke ◽  
Gerd Scholl

Author(s):  
Xuejun Liu ◽  
Chunwei Zhu ◽  
Shuai Wang ◽  
Hongcheng Wang ◽  
Dai Jin ◽  
...  

2020 ◽  
Vol 316 ◽  
pp. 04004
Author(s):  
Du Chun-lin ◽  
Yin Xiao-fang ◽  
Qin Jia-yong ◽  
Liu Xiao-ning ◽  
Sun Yu-wei ◽  
...  

With the rise of mobile communication satellites and low-orbit Internet satellite constellations, wireless testing is required in spacecraft thermal vacuum test, and a comprehensive thermal testing environment for vacuum low-temperature absorption is needed. This paper clarifies the key parameters that need to be paid attention to in the application of vacuum absorbing materials under vacuum and low temperature environment, gives reference indexes, and puts forward the technical process and test results for the development of absorbing shroud.


2020 ◽  
Author(s):  
Pavel Trávníček ◽  
Jiří Němeček

Proceedings ◽  
2019 ◽  
Vol 42 (1) ◽  
pp. 3
Author(s):  
Zhiping Liu ◽  
Hanjin Yu ◽  
Kai Zhou ◽  
Runfa Li

The microstrip patch antenna sensor is a novel sensor used for structural health monitoring which can measure a metal structure’s crack defects in a wireless manner. However, it is difficult to identify the reflected signal from the signal of an antenna sensor. The radio-frequency identification (RFID) antenna sensor, which combines RFID technology and the microstrip patch antenna sensor, can solve the measurement problems that are difficult to the conventional wireless testing technologies. In this study, a dual-chip RFID antenna sensor was designed. The influence of the wireless testing method on the monitoring results of crack defects was investigated by tests, including the wireless tests of resonant frequency and the crack sensitivity tests. The tests results revealed that the antenna sensor had good wireless testing performance with regard to the metal structure’s crack defects. Additionally, the maximum of wireless identification distance reached 1.96 m.


2018 ◽  
Vol 7 (1) ◽  
pp. 131-142 ◽  
Author(s):  
Ralf Heynicke ◽  
Dmytro Krush ◽  
Christoph Cammin ◽  
Gerd Scholl ◽  
Bernd Kaercher ◽  
...  

Abstract. In the context of the Industry 4.0 initiative, Cyber-Physical Production Systems (CPPS) or Cyber Manufacturing Systems (CMS) can be characterized as advanced networked mechatronic production systems gaining their added value by interaction with the ambient Industrial Internet of Things (IIoT). In this context appropriate communication technologies and standards play a vital role to realize the manifold potential improvements in the production process. One of these standards is IO-Link. In 2016 more than 5 million IO-Link nodes have been produced and delivered, still gaining increasing acceptance for the communication between sensors, actuators and the control level. The steadily increasing demand for more flexibility in automation solutions can be fulfilled using wireless technologies. With the wireless extension for the IO-Link standard, which will be presented in this article, maximum cycle times of 5 ms can be achieved with a probability that this limit will be exceeded to be at maximum one part per billion. Also roaming capabilities, wireless coexistence mechanisms and the possibility to include battery-powered or energy-harvesting sensors with very limited energy resources in the realtime network were defined. For system planning, setup, operation and maintenance, the standard engineering tools of IO-Link can be employed so that the backward compatibility with wired IO-Link solutions can be guaranteed. Interoperability between manufacturers is a key requirement for any communication standard, thus a procedure for IO-Link Wireless testing is also suggested.


2016 ◽  
Vol 2016 ◽  
pp. 1-8 ◽  
Author(s):  
Erja Sipilä ◽  
Johanna Virkki ◽  
Jianhua Wang ◽  
Lauri Sydänheimo ◽  
Leena Ukkonen

Additive deposition of inks with metallic inclusions provides compelling means to embed electronics into versatile structures. The need to integrate electronics into environmentally friendly components and structures increases dramatically together with the increasing popularity of the Internet of Things. We demonstrate a novel brush-painting method for depositing copper oxide and silver inks directly on wood and cardboard substrates and discuss the optimization of the photonic sintering process parameters for both materials. The optimized parameters were utilized to manufacture passive ultra high frequency (UHF) radio frequency identification (RFID) tag antennas. The results from wireless testing show that the RFID tags based on the copper oxide and silver ink antennas on wood substrate are readable from ranges of 8.5 and 11 meters, respectively, and on cardboard substrate from read ranges of 8.5 and 12 meters, respectively. These results are well sufficient for many future wireless applications requiring remote identification with RFID.


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