Thermal mapp routing in pharmaceutical products transportation using machine learning approach: a systematic review

The cold chain is crucial to ensure the quality and effectiveness of transported and stored medicines. For this, it is necessary to carry out the thermal mapping of routes for drugs transported between 15°C and 30°C, so that the most assertive decision can be taken without raising costs. This study aims to identify the main factors influencing the thermal mapping of pharmaceutical products in the cold chain and applying the machine learning technique. The method used for this systematic review is the Prisma, where the identification, screening, eligibility, and inclusion stages were analyzed. After analyzing 75 articles, the result shows that only eight papers were consistent with the use of modeling in the medicine cold chain distribution. Thus, it can be concluded that there is an extensive field to be researched regarding the use of prediction algorithms in the cold chain of drugs and vaccines.

Development of infrared thermal mapping technique for electronic devices

The goal of this research project is to develop an experimental setup that is capable of demonstrating thermal behavior of the electronic device. The project focuses on thermal mapping at device, integrated circuit and printed circuit board (PCB) level. A unique technique to perform thermal mapping on integrated circuits and printed circuit board based on Infrared Thermography is proposed in this research project. The developed experimental setup is capable of performing steady state and transient analysis at device and PCB level. The proposed test setup is applied to perform thermal mapping on 68HC11 microcontroller board to predict accurate temperature distribution on the real time operating printed circuit board. The accuracy and validation of the experimental setup are the two major challenges faced in this work. Apart from this, to know the exact transistor junction temperature, it is necessary to develop methodology that prevents heat spreading, allows proper cooling and the one that provides stable cooling thermal coefficient. The performance of infrared thermography has been validated against thermocouple results. The experimental results are compared with the ones obtained by digital thermometer. In order to achieve stability and certainty in the results, insulated environment is preferred. Thermocouple results can be taken as reference since it is in physical contact with the die or the package. Cooling of the electronic device is also performed in this work. Oil based heatsink has been implemented using mineral Aldrich oil which is specially designed for IR spectroscopy. Several different combinations of layers of coating of Boron Nitride spray and black spray paint are deployed with different emissivity settings. The effect of the number of color layer coatings and emissivity values have been investigated. Various challenges pertaining to heat spreading, heat dependent cooling coefficients and spatial resolution have been resolved. The performance of the test setup has been evaluated for both steady state and transient analysis. In additon, thermocouple results have been taken as reference.

Development of infrared thermal mapping technique for electronic devices

The goal of this research project is to develop an experimental setup that is capable of demonstrating thermal behavior of the electronic device. The project focuses on thermal mapping at device, integrated circuit and printed circuit board (PCB) level. A unique technique to perform thermal mapping on integrated circuits and printed circuit board based on Infrared Thermography is proposed in this research project. The developed experimental setup is capable of performing steady state and transient analysis at device and PCB level. The proposed test setup is applied to perform thermal mapping on 68HC11 microcontroller board to predict accurate temperature distribution on the real time operating printed circuit board. The accuracy and validation of the experimental setup are the two major challenges faced in this work. Apart from this, to know the exact transistor junction temperature, it is necessary to develop methodology that prevents heat spreading, allows proper cooling and the one that provides stable cooling thermal coefficient. The performance of infrared thermography has been validated against thermocouple results. The experimental results are compared with the ones obtained by digital thermometer. In order to achieve stability and certainty in the results, insulated environment is preferred. Thermocouple results can be taken as reference since it is in physical contact with the die or the package. Cooling of the electronic device is also performed in this work. Oil based heatsink has been implemented using mineral Aldrich oil which is specially designed for IR spectroscopy. Several different combinations of layers of coating of Boron Nitride spray and black spray paint are deployed with different emissivity settings. The effect of the number of color layer coatings and emissivity values have been investigated. Various challenges pertaining to heat spreading, heat dependent cooling coefficients and spatial resolution have been resolved. The performance of the test setup has been evaluated for both steady state and transient analysis. In additon, thermocouple results have been taken as reference.

Thermal Mapping of a High-Speed Electric Motor Used for Traction Applications and Analysis of Various Cooling Methods—A Review

This paper gives a comprehensive review of advanced cooling schemes and their applications to the permanent magnet synchronous motors (PMSMs), as well as investigating the electrical motor’s topologies its thermal design issues, materials and performances. Particularly, the electromagnetic and electric performances, machine sizing, together with the structural design, are given. In addition, the work addresses the motor’s material design and properties along with its insulation performance, which is the main goal of optimization. Mainly, thermal mapping with analysis is provided according to the different cooling methods, including air-cooling, water-cooling, oil-cooling, heat-pipe-cooling, potting silicon gelatin cooling, and as well as cooling strategies for tubes and microchannels. The most common special features and demands of the PMSMs are described in the appearance of the motor’s failures caused by uncontrolled temperature rise. In addition, heat sources and energy losses, including copper loss, core loss versus motor speed, and output power, are analyzed. The review of the proposed cooling methods that will achieve the required heat transfer of the PMSM is presented with numerical simulations and measurements data. A review of numerical methods and results, including the finite element methods (FEM), such as the Ansys CFD software, to obtain a high-accuracy thermal mapping model of the PMSM system is given. The revived methods and design requirements due to PMSM temperature profile and cooling flow at different rotor speeds and torque loads are investigated. Finally, the motor design recommendations, including the newly developed cooling solutions, which enable it to effectively redistribute the temperature and heat transfer, increasing the efficiency of the PMSM machine, are laid out.