In-mold lightweight integrating for structural/functional devices

Integration of function in structure is troublesome for structural/functional devices. A novel method of in-mold integrating for structural/functional devices was proposed and studied. In this method, a functional film was prepared by printing and surface mounting to achieve electrical functions, and then the film was formed and back molded into a final product. Owing to the complex electronic film, new problems are raised in the in-mold integrating process. The process was modeled, and was designed with the genetic algorithm. The interaction between the melt and the mounted film was analyzed by two-way fluid-structure coupling. Heat dissipation with anisotropic thermal conductivity was examined. Accordingly, a control panel was manufactured and tested. From the study, the functional film, causing asymmetrical cooling issue, results in concave warpage, which can be effectively controlled by comprehensive processing optimization. Film deformation is significant at button area because of tiny hollow structure. The deformation can be decreased by the epoxy encapsulation. The anisotropic thermal conductivity and injection layer cause heat dissipation problem, and thermal effect should be checked and designed by full thermal analysis. With the designed scheme, manufactured panels can perform all control functions, satisfy appearance requirements, and achieve lightweight performance.