polycrystalline silicon carbide
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2022 ◽  
Vol 238 ◽  
pp. 111586
Author(s):  
Jingming Zheng ◽  
Zhenhai Yang ◽  
Linna Lu ◽  
Mengmeng Feng ◽  
Yuyan Zhi ◽  
...  




2019 ◽  
Vol 6 (2) ◽  
pp. 69-81
Author(s):  
Hitoshi Habuka ◽  
Mayuka Watanabe ◽  
Mikiya Nishida ◽  
Takashi Sekiguchi


Carbon ◽  
2019 ◽  
Vol 153 ◽  
pp. 417-427 ◽  
Author(s):  
C. Ramírez ◽  
E. García ◽  
E. Barrena ◽  
A. De Pablos ◽  
M. Belmonte ◽  
...  


2019 ◽  
Vol 159 ◽  
pp. 341-348 ◽  
Author(s):  
Sourav Gur ◽  
Mohammad Rafat Sadat ◽  
George N. Frantziskonis ◽  
Stefan Bringuier ◽  
Lianyang Zhang ◽  
...  


2017 ◽  
Vol 897 ◽  
pp. 383-386 ◽  
Author(s):  
Ken Nakagomi ◽  
Shogo Okuyama ◽  
Hitoshi Habuka ◽  
Yoshinao Takahashi ◽  
Tomohisa Kato

A method to adjust the polycrystalline SiC etching rate was studied taking into account the chlorine trifluoride gas transport. The etching rate profile over the 50-mm-diameter SiC wafer could be made symmetrical by means of the wafer rotation. By activating and indeactivating the pin-holes at the various positions of the gas distributor, the etching rate profile could be locally adjusted.



2017 ◽  
Vol 66 (6) ◽  
pp. 066104
Author(s):  
Zang Hang ◽  
Huang Zhi-Sheng ◽  
Li Tao ◽  
Guo Rong-Ming


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