The grain orientation plays a great important role during single grain grinding. Single grain grinding simulation could offer an insight into the material removal behavior. However, grinding simulation with FE methods has problems arising from large deformations at the chip root and negative rake angles of the grain. In this work, a coupled Eulerian-Lagrangian method (CEL) is used to model the grinding behavior of single diamond grain in different orientations. The influence of the grain orientations on the grinding forces, grinding process (sliding, ploughing and cutting) and critical undeformed chip thickness are analyzed. The force ratio shows great accordance with the analytical calculation data. The simulation results show that the chip generates quickly and the special grinding force is relatively small when the diamond particle is in octahedral orientation (111)-(100). The workpiece material flows to the side and front owing to the pressing of cutting crystal face. The swelling of the material is generated beside the abrasive grain. The range and height of swelling are increased gradually and kept invariant after chip formation. The deformation of workpiece material contacting with grain edge is very severe. Therefore the biggest residual stress appears at the grain edge of the groove.