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Applied Nano ◽  
2021 ◽  
Vol 2 (4) ◽  
pp. 359-367
Author(s):  
Victor G. Zavodinsky ◽  
Olga A. Gorkusha

In the context of a full-potential orbital-free approach for the modeling of multi-atomic systems we investigated the dependence of the cohesive energies and bulk elastic modules of the large nanosystems Cn (n is up to 4096 atoms), Aln (n is up to 23,328 atoms) and tin (n is up to 2160 atoms). It was shown that the cohesive energies and elastic modules tend towards bulk crystal values at n ≈ 3000 for Cn systems, at n ≈ 1500 for Tin and at n ≈ 20,000 for Aln. The execution time for one energy iteration for Ti23328 was only 23 min.


Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 392
Author(s):  
Norifumi Endoh ◽  
Shoji Akiyama ◽  
Keiichiro Tashima ◽  
Kento Suwa ◽  
Takamasa Kamogawa ◽  
...  

Graphene is promising for next-generation devices. However, one of the primary challenges in realizing these devices is the scalable growth of high-quality few-layer graphene (FLG) on device-type wafers; it is difficult to do so while balancing both quality and affordability. High-quality graphene is grown on expensive SiC bulk crystals, while graphene on SiC thin films grown on Si substrates (GOS) exhibits low quality but affordable cost. We propose a new method for the growth of high-quality FLG on a new template named “hybrid SiC”. The hybrid SiC is produced by bonding a SiC bulk crystal with an affordable device-type wafer and subsequently peeling off the SiC bulk crystal to obtain a single-crystalline SiC thin film on the wafer. The quality of FLG on this hybrid SiC is comparable to that of FLG on SiC bulk crystals and much higher than of GOS. FLG on the hybrid SiC exhibited high carrier mobilities, comparable to those on SiC bulk crystals, as anticipated from the linear band dispersions. Transistors using FLG on the hybrid SiC showed the potential to operate in terahertz frequencies. The proposed method is suited for growing high-quality FLG on desired substrates with the aim of realizing graphene-based high-speed devices.


2021 ◽  
Vol 43 ◽  
pp. 2641-2646
Author(s):  
W. Wongwan ◽  
N. Sangwaranatee ◽  
J. Keawkhao ◽  
K. Boonin

2020 ◽  
Vol 844 ◽  
pp. 156002
Author(s):  
Przemyslaw Sedzicki ◽  
Lukasz Skowronski ◽  
Robert Szczesny ◽  
Hans-Werner Becker ◽  
Detlef Rogalla ◽  
...  

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