embedded configuration
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2020 ◽  
Vol 12 (25) ◽  
pp. 3285-3289
Author(s):  
Cheng Jing ◽  
Haohan Chen ◽  
Rongfeng Cai ◽  
Yaping Tian ◽  
Nandi Zhou

A novel electrochemical aptasensor for ATP was developed based on an aptamer-embedded configuration-switchable tetrahedral DNA nanostructure (TDN) and the formation of a G-quadruplex.


2016 ◽  
Vol 5 (2) ◽  
pp. 223-227 ◽  
Author(s):  
Andrej Ivanco ◽  
Kan Zhou ◽  
Heath Hofmann ◽  
Zoran S. Filipi

Author(s):  
Wang Xiujuan ◽  
Li Xiaobing ◽  
Cheng Meng ◽  
Chen Yutang ◽  
Zhang Zhongxin ◽  
...  

2013 ◽  
Vol 411-414 ◽  
pp. 370-376
Author(s):  
Xiu Juan Wang ◽  
Xiao Bing Li ◽  
Yu Tang Chen ◽  
Meng Cheng ◽  
Zhong Xin Zhang ◽  
...  

This paper mainly introduces the design idea of real-time database in embedded configuration software. According to the characteristics of real-time database, this paper using three layer storage structures which consist of shared memory, file system and general database. It improves the access efficiency of real-time database and data reliability in a timely manner.


2013 ◽  
Vol 331 ◽  
pp. 387-390
Author(s):  
Ji Nian Yang ◽  
Ai Qin Xu

The polypropylene/ethylene-1-octene/short glass fiber (PP/EOC/SGF) ternary composites were prepared by extrusion and subsequent injection processes. The effects of compatilizers, including maleic anhydride grafted PP (PP-g-MAH) and maleic anhydride grafted EOC (EOC-g-MAH), on the evolution of phase structures and mechanical properties of PP composites were examined. Results show that the interfacial adhesion between SGF and matrix are enhanced significantly. Moreover, the EOC-g-MAH promotes to form the elastomeric particle-embedded configuration. Mechanical testing reveals that the PP/EOC/SGF composites characterized by much higher impact toughness and keeping the competitively tensile properties could be obtained through co-incorporation of SGF and EOC as well as right compatilizers adopted.


2012 ◽  
Vol 466-467 ◽  
pp. 714-718
Author(s):  
Deng Feng Li ◽  
Hu Li ◽  
Huan Huan Wang ◽  
Yun Ting Bai

In order to deal with the dissatisfaction of traditional automobile instruments applied in pure electric vehicles, an automobile intelligent instrument is designed to meet new requirements of the pure electric vehicles by combining the embedded development board with the embedded configuration software MCGS. In this instrument, the hardware development platform is developed to communicate with the main controller of vehicles by extending CAN bus interfaces on the embedded development board, the main control chip of which is S3C2440. Moreover, the embedded configuration software MCGS is adopted to achieve the software design of the instrument system. Compared with traditional automobile instruments, the intelligent instrument is of high reliability, high precision and diversifications in display interfaces and can be installed in pure electric vehicles as a universal instrument.


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