Thermocracking of a heavy fraction of the oil residue in a mixture with shale

The process of tar thermal cracking in a mixture with crushed oil shale to obtain components of motor fuels and raw materials for the process of thermal cracking is investigated in this paper. The optimization results of technological parameters (shale concentration, temperature, and duration) are presented and the material balance (mass.%) of the process is made. It was found that during single-stage processing under relatively mild conditions (5 MPa, 425C, feed space velocity of 1.0 h-1), a deep destruction of tar is achieved (the yield of the gasoline fraction from boiling point to 200C is ~12 wt.%; medium distillates with boil. point 200370C-43-44 mass.%; raw materials for thermal cracking with boil. point above 370C ~15-16 wt.% on per the original tar). The generating coke-like products and the V and Ni contained in the raw materials are deposited on the mineral part of the shale and removed from the reaction zone with the liquid products of the process.

Mathematical simulation of the processes of two-beam laser controlled thermal-splitting of quartz glass

The paper presents the results of modeling the processes of controlled thermal cracking of quartz glass under the parallel action of two infrared laser beams of different geometries on the material: with maximum intensity in the center and with zero intensity in the center (annular section). To calculate the temperature distribution in the material, the method of Green's functions was used, which allows us to obtain a well-interpreted solution for almost any type of function of surface heat sources. Further, taking into account the quasi-static approach, using the methods of the classical theory of thermoelasticity, thermoelastic microstresses were calculated, both on the surface and in the depth of the material. It is established that the simultaneous use of these two types of laser exposure makes it possible to control the temperature field more efficiently, and create prerequisites for the most stable formation of a microcrack. The simulation results show that with a bi-beam effect, the micromechanical stresses necessary for the formation of a microcrack are realized in shorter time intervals, both on the surface and in the depth of the material, which allows increasing the processing speed by up to 30 %. Strengthening control over the process of controlled thermal cracking can significantly reduce the percentage of defects and improve the quality of the resulting microeletronics products.