Copolyamide-Imide Membrane with Low CTE and CME for Potential Space Optical Applications

Polyimide diffractive membrane lens can be used in space optical telescope to reduce the size and mass of an imaging system. However, traditional commercial aromatic polyimide membrane is hard to meet the challenging requirements of dimensional stability and optical homogeneity for optical use. Based on molecular structure design and the optimization of fabrication process, the prepared copolyamide-imide membrane achieved the desired performance of membrane as an optical material. It showed a very low coefficient of thermal expansion (CTE), which is 0.95 ppm/°C over a temperature range of −150–100 °C and relatively low coefficient of moisture expansion (CME), which is only 13.30 ppm/% RH (0~90% RH). For the optical use, the prepared copolyamide-imide membrane (φ200 mm) achieved good thickness uniformity with wave-front error smaller than λ/30 (λ = 632 nm) in RMS (root mean square). Besides, it simultaneously meets the optical, thermal, and mechanical requirements for space telescope use. Copolyamide-imide membranes in this research with good comprehensive performance can be used as large aperture membrane optical system architectures.

Properties of Porous PDMS and Stretchability of Flexible Electronics in Moist Environment

Polydimethylsiloxane (PDMS) is a good choice for the substrate and encapsulation of clinical flexible electronics, since it possesses some distinguished characteristics such as high elasticity, excellent optical characteristic, good biocompatibility, and stability. In the present study, the emulsion polymerization technique was used once more to fabricate porous PDMS, which is expected to assure the sweat penetration through the flexible electronics, and therefore to reduce the irritation to the skin due to the flexible electronics. To assess the mechanical performance of flexible electronics with moisture, the saturated moisture concentration, coefficient of moisture expansion, and elastic modulus of porous PDMS for different relative wetness fraction were measured in experiment. Meanwhile, an asymptotic homogenization method (AHM) was adopted to predict these parameters theoretically. Results indicate that the saturated moisture concentration is linear to the porosity, while the coefficient of moisture expansion is independent of the porosity, both of which are well verified by the experimental data. The fitted formula on the elastic modulus for different porosities suggested in our previous study was developed to take account of the relative wetness fraction based on the experimental data. These three parameters were finally applied in calculating the stretchability of a flexible electronic with serpentine interconnects in moist environment. Numerical stimulation reveals that the stretchability increases with the porosity and relative wetness fraction of the substrate and encapsulation. The present work is hoped to pave the way for flexible electronics in clinical applications.

AN EXPERIMENTAL INVESTIGATION INTO MOISTURE-INDUCED EXPANSION OF PLASTERS

<p>This paper presents an experimental study on moisture-induced expansion of selected plasters. Contactless measurement is introduced and a coefficient of moisture expansion for different building plasters is established. It is found that stresses which might develop in building materials due to moisture variations are equal to or higher than stresses which might be caused by temperature variations.</p>

Hygrothermal Effect on Deformations of QFN Electronic Packaging

The hygrothermal-mechanical behavior of a quad flat non-lead (QFN) package without a chip inside is investigated experimentally and numerically. The present study is focused on understanding the effect of the inherent hygrothermal behaviors of epoxy molding compound (EMC) on the deformations of QFN package. Prior to studying the package, the coefficient of moisture expansion for the EMC is measured experimentally. Full-field moiré and Twyman-Green interferometries are used for measuring the real-time in-plane and out-of-plane deformations of the specimen, respectively, under thermal and moisture loading. In addition, the finite element and theoretical analyses are adopted for validating the experimental observations and further understanding the hygrothermal mechanics of the specimen. The coefficient of moisture expansion of the EMC was experimentally obtained to be about 0.2. The experimental results of the full-field deformations of the specimen, due to temperature, moisture and a combination of both, are presented. The experimental observations are validated by the finite element and theoretical analyses. It was observed that the maximum moisture-induced deformation (strain) can be up to as large as 50% of the thermal deformation (strain) caused by ΔT = 50°C for the specimen. As a result, neglecting moisture-induced deformations (strains) would cause the significant amount of error in thermal deformation (strain) measurement of plastic packages. Furthermore, the present study has laid down the fundamental mechanics and approaches for the QFN packaging structural design and analysis in terms of hygrothermal effects.