2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
Latest Publications

TOTAL DOCUMENTS

310

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Published By IEEE

9781728102863

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Energy and Area Efficient 11-T Ternary Content Addressable Memory for High-Speed Search

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754423 ◽

2019 ◽

Author(s):

Diptesh Datta ◽

Piyush Dewangan ◽

Neelam Surana ◽

Joycee Mekie

Keyword(s):

High Speed ◽

Content Addressable Memory ◽

Ternary Content Addressable Memory ◽

Area Efficient

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A Refined Selected-Codes Linearity Test on Pipelined ADC

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754420 ◽

2019 ◽

Author(s):

Fangru Liu ◽

Jianhua Feng ◽

I-Chun Tsai ◽

Hongfei Ye

Keyword(s):

Pipelined Adc ◽

Linearity Test

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A 6.5kV FSRD structure with an epitaxial p buffer and diffused n buffer layers

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754324 ◽

2019 ◽

Author(s):

Cailin Wang ◽

Pu Li ◽

Le Su ◽

Lei Zhang

Keyword(s):

Buffer Layers

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The influence of comparator offset on event-driven level-crossing analog-to-digital converter

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754194 ◽

2019 ◽

Author(s):

Xingyuan Tong ◽

Mengdi Song ◽

Fengjuan Wang

Keyword(s):

Analog To Digital Converter ◽

Digital Converter ◽

Level Crossing ◽

Analog To Digital ◽

Event Driven ◽

Comparator Offset

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A high efficient triple-stacked 28VGaAs MMIC power amplifier with bandwidth of 6.5-10.5GHz

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754068 ◽

2019 ◽

Author(s):

Ruiqiang Zhang ◽

Peng Li ◽

Lanfeng Lin ◽

Tangsheng Cheng ◽

Kefeng Han ◽

...

Keyword(s):

Power Amplifier ◽

High Efficient

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A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754260 ◽

2019 ◽

Cited By ~ 1

Author(s):

Fengjuan Wang ◽

Yue Li ◽

Ningmei Yu

Keyword(s):

Heat Dissipation ◽

3D Ic ◽

Highly Efficient ◽

Dissipation System

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Preparation and Photoelectric Properties of p-Cu2O/n-ZnO Thin Film Heterojunction

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754435 ◽

2019 ◽

Author(s):

Ying Wang ◽

Yantao Liu ◽

Jianping Ma ◽

Wenxia Wang ◽

Xin Peng ◽

...

Keyword(s):

Thin Film ◽

Zno Thin Film ◽

Photoelectric Properties

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High power 880nm laser chip with a predicted MTTF of 200,000 hours

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754432 ◽

2019 ◽

Author(s):

Zhanqiang Ren ◽

Qingmin Li ◽

Kechang Song ◽

Xirong Li

Keyword(s):

High Power ◽

Laser Chip

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A New Multilevel Interpolated TDC Method Based on a Two-Step Synchronizer

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754482 ◽

2019 ◽

Author(s):

Dahe Liu ◽

Xueyou Shi ◽

Guangyi Chen ◽

Wengao Lu ◽

Zhongiian Chen

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Effects of Annealing Temperature on the Properties of ZnO Thin Films and Ultraviolet Photodetectors

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) ◽

10.1109/edssc.2019.8754062 ◽

2019 ◽

Author(s):

Wenxia Wang ◽

Yantao Liu ◽

Jianping Ma ◽

Ying Wang ◽

Xin Peng ◽

...

Keyword(s):

Thin Films ◽

Annealing Temperature ◽

Zno Thin Films ◽

Ultraviolet Photodetectors

Download Full-text

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Energy and Area Efficient 11-T Ternary Content Addressable Memory for High-Speed Search

A Refined Selected-Codes Linearity Test on Pipelined ADC

A 6.5kV FSRD structure with an epitaxial p buffer and diffused n buffer layers

The influence of comparator offset on event-driven level-crossing analog-to-digital converter

A high efficient triple-stacked 28VGaAs MMIC power amplifier with bandwidth of 6.5-10.5GHz

A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC

Preparation and Photoelectric Properties of p-Cu2O/n-ZnO Thin Film Heterojunction

High power 880nm laser chip with a predicted MTTF of 200,000 hours

A New Multilevel Interpolated TDC Method Based on a Two-Step Synchronizer

Effects of Annealing Temperature on the Properties of ZnO Thin Films and Ultraviolet Photodetectors

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
Latest Publications