Effect of solder ball pitch and substrate material of printed wiring board on reliability under thermal cycling - a finite element analysis

2004 ◽  
Author(s):  
S. Khan ◽  
M. Asaduzzaman ◽  
M.A. Lamontia ◽  
J.G. Sloan
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Cycling ◽  
Solder Ball ◽  
Substrate Material ◽  
Printed Wiring Board ◽  
Element Analysis ◽  
Wiring Board

Preventing Ceramic Chip Capacitor Cracking During Printing Wiring Board Bending

2003 ◽  
Author(s):  
Nathan J. Blattau ◽  
Donald B. Barker ◽  
Craig D. Hillman
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Failure Criterion ◽  
Low Voltage ◽  
Finite Element Models ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Element Analysis ◽  
Failure Data ◽  
Wiring Board

The purpose of this study is to investigate the possibility of using finite element models of varying complexities to better understand and predict the durability of multi-layer ceramic chip capacitors subjected to printed wiring board flexure. This study covers low voltage capacitors (0805, 1206, 1812, 2220 sizes) constructed from X7R ceramic mounted on FR-4 printed wiring boards. Existing failure data obtained from Kemet’s experiments on 0805 and 1206 capacitors is used to establish and verify the failure criterion, which is based upon the tensile stresses in the capacitor. This failure limit is determined by performing a finite element analysis that adequately represents the experiments performed by Kemet. The failure limit (overstress) is then extended to a family of capacitors to predict their durability with regard to printed wiring board flexure. Guidelines can then be established to aid designers in preventing failures of capacitors due to printed wiring board flexure.

A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling

1991 ◽  
Vol 226 ◽  
Author(s):  
Yi-Hsin Pao ◽  
Kuan-Luen Chen ◽  
An-Yu Kuo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Free Edge ◽  
Time Dependent ◽  
Element Analysis ◽  
Finite Element Program ◽  
Element Program ◽  
Peel Stress

AbstractA nonlinear and time dependent finite element analysis was performed on two surface mounted electronic devices subjected to thermal cycling. Constitutive equations accounting for both plasticity and creep for 37Pb/63Sn and 90Pb/10Sn solders were assumed and implemented in a finite element program ABAQUS with the aid of a user subroutine. The FE results of 37Pb/63Sn solder joints were in reasonably good agreement with the experimental data by Hall [19]. In the case of 9OPb/1OSn solder in a multilayered transistor stack, the FE results showed the existence of strong peel stress near the free edge of the joint, in addition to the anticipated shear stress. The effect of such peel stress on the crack initiation and growth as a result of thermal cycling was discussed, together with the singular behavior of both shear and peel stresses near the free edge.

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

2013 ◽  
Vol 30 (1) ◽  
pp. 14-18 ◽  
Author(s):  
Yap Boon Kar ◽  
Noor Azrina Talik ◽  
Zaliman Sauli ◽  
Jean Siow Fei ◽  
Vithyacharan Retnasamy
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Ball ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Element Analysis
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