2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Silicon Nitride-induced Threshold Voltage Shift in p-GaN HEMTs with Au-free Gate-first Process

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260944 ◽

2020 ◽

Author(s):

Yi-Cheng Chen ◽

Shun-Wei Tang ◽

Pin-Hau Lin ◽

Zheng-Chen Chen ◽

Ming-Hao Lu ◽

...

Keyword(s):

Silicon Nitride ◽

Threshold Voltage ◽

Threshold Voltage Shift ◽

Voltage Shift ◽

Gan Hemts

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A CMUT receiving probe with an integrated preamplifier for through-transmission scanning acoustic tomography

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260824 ◽

2020 ◽

Author(s):

Taiichi Takezaki ◽

Shuntaro Machida ◽

Daisuke Ryuzaki

Keyword(s):

Acoustic Tomography

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Significance of pre- and post- EFI data processing to enhance dynamic electrical fault isolation success

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260742 ◽

2020 ◽

Author(s):

BL Yeoh ◽

MH Thor ◽

SH Goh ◽

YH Chan ◽

Li Song ◽

...

Keyword(s):

Data Processing ◽

Fault Isolation

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Exploring RRAM Variability as Synapses on Inception Simulation Framework to Characterize the Prediction Accuracy and Power Estimation per Bit for Convolution Neural Network

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260780 ◽

2020 ◽

Author(s):

N.L. Prabhu ◽

N. Raghavan

Keyword(s):

Neural Network ◽

Prediction Accuracy ◽

Power Estimation ◽

Convolution Neural Network ◽

Simulation Framework

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Effect of Cu barrier from TaN/Ta Deposition barrier(DD) & TaN/Etching/Ta Deposition barrier(DED) on Cu EM reliability

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9261015 ◽

2020 ◽

Author(s):

Yun-Chi Liao ◽

Hui-Lan Sung ◽

Wei-Lin Wang

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Wafer Level High Density Hybrid Bonding for High Performance Computing

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260626 ◽

2020 ◽

Author(s):

Hong-Miao Ji ◽

Lin Ji ◽

Fa-Xing Che ◽

Hong-Yu. Li ◽

King-Jien Chui ◽

...

Keyword(s):

High Performance Computing ◽

High Performance ◽

High Density ◽

Wafer Level ◽

Performance Computing

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Analysis of the Effects of Boron Transient Enhanced Diffusion on Threshold Voltage Mismatch in Steep Retrograde Doping NMOSFETs with Inserted Oxygen Layers

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260584 ◽

2020 ◽

Author(s):

Shuntaro Fujii ◽

Hideki Takeuchi ◽

Soichi Morita ◽

Tatsushi Yagi ◽

Shohei Hamada ◽

...

Keyword(s):

Threshold Voltage ◽

Enhanced Diffusion ◽

Transient Enhanced Diffusion

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Logic State Imaging From FA Techniques for Special Applications to One of the Most Powerful Hardware Security Side-Channel Threats

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9261000 ◽

2020 ◽

Author(s):

Christian Boit ◽

Tuba Kiyan ◽

Thilo Krachenfels ◽

Jean-Pierre Seifert

Keyword(s):

Hardware Security ◽

Side Channel ◽

Logic State

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Detection and prevention of assembly defects, by machine learning algorithms, in semiconductor industry for automotive

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260582 ◽

2020 ◽

Author(s):

Corinne Berges ◽

Claire Ceneray ◽

Guido Albermann ◽

Jim Bird ◽

Bala Balakrishnan ◽

...

Keyword(s):

Machine Learning ◽

Semiconductor Industry ◽

Learning Algorithms ◽

Machine Learning Algorithms

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Defect and Contamination Analysis Necessity with Multiple Surface Analytical Techniques

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa49335.2020.9260748 ◽

2020 ◽

Author(s):

Lei Zhu ◽

Caryn Sek ◽

Jun Xian Goh ◽

Yeh Yee Kee ◽

Jing Fang Pan ◽

...

Keyword(s):

Analytical Techniques

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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Silicon Nitride-induced Threshold Voltage Shift in p-GaN HEMTs with Au-free Gate-first Process

A CMUT receiving probe with an integrated preamplifier for through-transmission scanning acoustic tomography

Significance of pre- and post- EFI data processing to enhance dynamic electrical fault isolation success

Exploring RRAM Variability as Synapses on Inception Simulation Framework to Characterize the Prediction Accuracy and Power Estimation per Bit for Convolution Neural Network

Effect of Cu barrier from TaN/Ta Deposition barrier(DD) & TaN/Etching/Ta Deposition barrier(DED) on Cu EM reliability

Wafer Level High Density Hybrid Bonding for High Performance Computing

Analysis of the Effects of Boron Transient Enhanced Diffusion on Threshold Voltage Mismatch in Steep Retrograde Doping NMOSFETs with Inserted Oxygen Layers

Logic State Imaging From FA Techniques for Special Applications to One of the Most Powerful Hardware Security Side-Channel Threats

Detection and prevention of assembly defects, by machine learning algorithms, in semiconductor industry for automotive

Defect and Contamination Analysis Necessity with Multiple Surface Analytical Techniques

Export Citation Format

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Silicon Nitride-induced Threshold Voltage Shift in p-GaN HEMTs with Au-free Gate-first Process

A CMUT receiving probe with an integrated preamplifier for through-transmission scanning acoustic tomography

Significance of pre- and post- EFI data processing to enhance dynamic electrical fault isolation success

Exploring RRAM Variability as Synapses on Inception Simulation Framework to Characterize the Prediction Accuracy and Power Estimation per Bit for Convolution Neural Network

Effect of Cu barrier from TaN/Ta Deposition barrier(DD) & TaN/Etching/Ta Deposition barrier(DED) on Cu EM reliability

Wafer Level High Density Hybrid Bonding for High Performance Computing

Analysis of the Effects of Boron Transient Enhanced Diffusion on Threshold Voltage Mismatch in Steep Retrograde Doping NMOSFETs with Inserted Oxygen Layers

Logic State Imaging From FA Techniques for Special Applications to One of the Most Powerful Hardware Security Side-Channel Threats

Detection and prevention of assembly defects, by machine learning algorithms, in semiconductor industry for automotive

Defect and Contamination Analysis Necessity with Multiple Surface Analytical Techniques

2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications