Abstract
Our objective was to examine the effects of processing, moisture, and anaerobic storage length of reconstituted corn grain (RCG) on the fermentation profile, geometric mean particle size (GMPS), and ruminal dry matter disappearance (DMD). Dry corn kernels were ground (hammer mill, 5-mm screen) or rolled, then rehydrated to 30%, 35%, or 40% moisture, and stored for 0, 14, 30, 60, 90, 120, or 180 d in laboratory silos. Rolled corn had an increased GMPS compared with ground corn (2.24 and 1.13 mm, respectively, at ensiling). However, there was a trend for an interaction between processing and moisture concentration to affect particle size, with GMPS increasing with increased moisture concentration, especially in ground corn. Longer storage periods also slightly increased GMPS. Processing, moisture, and storage length interacted to affect the fermentation pattern (two- or three-way interactions). Overall, pH decreased, whereas lactic acid, acetic acid, ethanol, and NH3-N increased with storage length. RCG with 30% moisture had less lactic acid than corn with 35% and 40% moisture, indicating that fermentation might have been curtailed and also due to the clostridial fermentation that converts lactic acid to butyric acid. Ensiling reconstituted ground corn with 30% of moisture led to greater concentrations of ethanol and butyric acid, resulting in greater DM loss than grain rehydrated to 35% or 40% of moisture. Ammonia-N and in situ ruminal DMD were highest for reconstituted ground corn with 35% or 40% of moisture, mainly after 60 d of storage. Therefore, longer storage periods and greater moisture contents did not offset the negative effect of greater particle size on the in situ ruminal DMD of rolled RCG. Nonetheless, RCG should be ensiled with more than 30% moisture and stored for at least 2 mo to improve the ruminal DMD and reduce the formation of ethanol and butyric acid.
Poly(lactic Acid): A Versatile Biobased Polymer for the Future with Multifunctional Properties—From Monomer Synthesis, Polymerization Techniques and Molecular Weight Increase to PLA Applications