7‐1: Distinguished Paper: Reliability Improvement of IGZO‐TFT in Hybrid Process with LTPS

2021 ◽  
Vol 52 (1) ◽  
pp. 57-60
Author(s):  
Mehadi Aman ◽  
Yujiro Takeda ◽  
Kazuatsu Ito ◽  
Kaoru Yamamoto ◽  
Kohei Tanaka ◽  
...  

Author(s):  
Mehadi Aman ◽  
Yujiro Takeda ◽  
Kazuatsu Ito ◽  
Kaoru Yamamoto ◽  
Kohei Tanaka ◽  
...  


2020 ◽  
Vol 20 (4) ◽  
pp. 313-323
Author(s):  
Hyukchoon Yun ◽  
Suneung Ahn ◽  
Suk Joo Bae


2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  


Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.



Author(s):  
Jungwoo Lee ◽  
Jongsu Oh ◽  
Eun Kyo Jung ◽  
KeeChan Park ◽  
Jae-Hong Jeon ◽  
...  


1978 ◽  
Author(s):  
J. L. Easterday ◽  
J. E. Drennan ◽  
L. R. Albrechtson ◽  
W. Gordon


2021 ◽  
Vol 332 ◽  
pp. 94-102
Author(s):  
Merhawi Mihreteab ◽  
Bryan A. Stubblefield ◽  
Eric S. Gilbert


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