Method to Determine the Sticking Coefficient of O2on Deposited Al During Reactive Magnetron Sputtering, Using Mass Spectrometry
2009 ◽
Vol 6
(S1)
◽
pp. S342-S346
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1999 ◽
Vol 17
(6)
◽
pp. 3317-3321
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1995 ◽
Vol 74-75
◽
pp. 586-593
◽
High Temperature Material Processes (An International Quarterly of High-Technology Plasma Processes)
◽
2015 ◽
Vol 19
(2)
◽
pp. 105-112
Keyword(s):
Structure and Electrical Property of CuInS2 Thin Films Deposited by DC Reactive Magnetron Sputtering
2011 ◽
Vol 26
(12)
◽
pp. 1287-1292
◽
2019 ◽
Vol 37
(2)
◽
pp. 021203
◽
2011 ◽
Vol 21
(4)
◽
pp. 770-776
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