Defect states in Czochalski p-type silicon: the role of oxygen and dislocations

2005 ◽  
Vol 202 (5) ◽  
pp. 889-895 ◽  
Author(s):  
A. Castaldini ◽  
D. Cavalcoli ◽  
A. Cavallini ◽  
S. Pizzini
Keyword(s):  
1990 ◽  
Vol 144 (3) ◽  
pp. 198-200 ◽  
Author(s):  
Kh.A. Abdullin ◽  
B.N. Mukashev ◽  
M.F. Tamendarov ◽  
T.B. Tashenov
Keyword(s):  

2005 ◽  
Author(s):  
Amartya Sengupta ◽  
Hakan Altan ◽  
Aparajita Bandyopadhyay ◽  
John F Federici ◽  
H Grebel ◽  
...  

1983 ◽  
Vol 25 ◽  
Author(s):  
O. Paz ◽  
F. D. Auret

ABSTRACTDefects introduced in p-type silicon during RF sputter deposition of Ti-W and electron-beam evaporation of hafnium were investigated using I-V, deep level transient spectroscopy and electron-beam induced current techniques. DLTS measurements indicate the presence of several deposition and evaporation induced defect states. H(0.35) at EV + .35 eV and H(0.38) were the most prominent defects. Minority carrier diffusion length results taken after annealing showed that in the case of the Hf contacts the damage was annealed out while in the case of Ti-W it was not. These differences in carrier recombination are traced to the concentration of H(0.35). Sputtering or evaporation induced damage also increased the barrier height. This observed increase was modeled assuming the introduction of donor-like defects.


2005 ◽  
Vol 245-246 ◽  
pp. 15-22
Author(s):  
Daniela Cavalcoli ◽  
Anna Cavallini

Dislocations and impurities in silicon have been widely investigated since many years, nevertheless many questions on this subject remain still unsolved. As an example, theory, models and experimental phenomena provide evidence of the existence of shallow bands in silicon induced by the dislocation strain field. Nevertheless, only deep bands, likely associated with contamination at dislocations, have been detected up to now by junction spectroscopy. The present contribution reviews several results, obtained by the authors, on dislocation impurity interactions and their effects on the electronic properties of defect states in silicon. Point and extended defects introduced in p-type Cz Si by oxygen precipitation and plastic deformation have been investigated with electrical methods. Different materials (oxygen precipitated and deformed Cz Si and Fz Si) were examined in order to separate the role of oxygen precipitation, plastic deformation and metallic contamination on non-radiative electronic transitions at defect centers. A deep hole trap, named T1, has been associated to dislocation-related impurity centers, while additional deep traps have been related to contamination by grown-in transition metals and to clusters involving oxygen atoms. Moreover, experimental results obtained by junction spectroscopy assessed the existence of dislocation related shallow states. These were found to be located at 70 and 60 meV from the valence and conduction band edge, respectively.


2013 ◽  
Vol 2 (6) ◽  
pp. P243-P247 ◽  
Author(s):  
E. Ossei-Wusu ◽  
J. Carstensen ◽  
E. Quiroga-González ◽  
M. Amirmaleki ◽  
H. Föll

Author(s):  
Н.Р. Григорьева ◽  
И.В. Штром ◽  
Р.В. Григорьев ◽  
И.П. Сошников ◽  
Р.Р. Резник ◽  
...  

The role of EL2 defect in a formation of a photoresponse of an array of radial GaAs/AlGaAs nanowires (x=0.3) n-type grown by molecular beam epitaxy on a p-type silicon substrate was studied. A significant reduction in the recovery time of the photoresponse of nanowires was found in comparison with the bulk crystal during the transition of the EL2-center from the non-photoactive to the normal state.


Author(s):  
Jeng-Han Lee ◽  
Y.M. Chen ◽  
C.M. Huang ◽  
F.Y. Tseng ◽  
C.J. Chen ◽  
...  

Abstract An anodic etching is used for silicon junction profile delineation. Experimental results show that the etching rate is determined by dopant type, of which P type silicon etching rate will be enhanced while the N type silicon become inactive when an external positive voltage is applied. The experiment verifies the role of holes on the silicon etching. The proposed method is applicable for exploring the profile of P+/N-well, N+/P-well, and N-well/P-well junctions, using the same recipe.


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