Analysis of electrical characteristics and electroluminescent efficiency of field induced contact-DGOLET

This research paper discusses the significance development in field-induced contact dual-gate organic light emitting transistor (FIC-DGOLET) device architecture and characteristics. The device behaviour is analyzed and observed significant value of electroluminescent efficiency. The deep investigation of FIC-DGOLET device is discussed in this paper, where impact of varying the various parameters such as thickness of organic semiconductor (OSC) materials from the range of 400 nm to 200 nm at altered value of threshold voltage by using 2D ATLAS simulator. Its theoretical calculation influence over the dynamic control of the device characteristics such as saturated drain current (I ds ), mobility (μ), threshold voltage (V th ) as well as sub threshold swing. The FIC-DGOLET is a dual-gate transistor which also emits light by the operations of two accumulated regions, that are electrons and holes which is not completely overlapped to each other. The leakage current in DG-OLET can be reduced to the extent that 70% than single gate OLET (SG-OLET). The recombination zone mechanism of FIC-DGOLET plays a vital role in its performance, where we get comparable value of electroluminescent efficiency with reported, low value of exciton quenching and current densities. The extracted parameters of DG-OLETs are like drive current of 100A, I on/off 108, threshold voltage V th of 1.3 V at V gs of –3 V and V ds of 0 to –3 V. These extracted performance parameters are very helpful in designing of flexible display applications.

Improving Device Characteristics of Dual-Gate IGZO Thin-Film Transistors with Ar–O2 Mixed Plasma Treatment and Rapid Thermal Annealing

In this study, high-performance indium–gallium–zinc oxide thin-film transistors (IGZO TFTs) with a dual-gate (DG) structure were manufactured using plasma treatment and rapid thermal annealing (RTA). Atomic force microscopy measurements showed that the surface roughness decreased upon increasing the O2 ratio from 16% to 33% in the argon–oxygen plasma treatment mixture. Hall measurement results showed that both the thin-film resistivity and carrier Hall mobility of the Ar–O2 plasma–treated IGZO thin films increased with the reduction of the carrier concentration caused by the decrease in the oxygen vacancy density; this was also verified using X-ray photoelectron spectroscopy measurements. IGZO thin films treated with Ar–O2 plasma were used as channel layers for fabricating DG TFT devices. These DG IGZO TFT devices were subjected to RTA at 100 °C–300 °C for improving the device characteristics; the field-effect mobility, subthreshold swing, and ION/IOFF current ratio of the 33% O2 plasma–treated DG TFT devices improved to 58.8 cm2/V·s, 0.12 V/decade, and 5.46 × 108, respectively. Long-term device stability reliability tests of the DG IGZO TFTs revealed that the threshold voltage was highly stable.

Printed dual-gate organic thin film transistors and PMOS inverters on flexible substrates: Role of top gate electrode

We report printed single and dual-gate organic thin film transistors (OTFTs) and PMOS inverters fabricated on 125 µm-thick flexible polyethylene naphthalate (PEN) substrate. All the electrodes (gate, source, and drain) are inkjet-printed, while the parylene dielectric is formed by chemical vapor deposition. A dispenser system is used to print the active channel material using a blend of 2,7-dihexyl-dithieno[2,3-d;2',3'-d']benzo[1,2-b;4,5-b']dithiophene (DTBDT-C6) and polystyrene (PS) in tetralin solvent, which gives highest mobility of 0.43 cm2/Vs. Dual-gate OTFTs are characterized by keeping the other gate electrode either in grounded or floating state. Floating gate electrode devices shows higher apparent mobility and current ratio due to additional capacitance of the parylene dielectric. PMOS inverter circuits are characterized in terms of gain, trip point and noise margin values calculated from the voltage transfer characteristics (VTC). Applied top gate voltage on the load OTFT control the conductivity or threshold voltage (VTh) of the bottom TFT and shift the trip point towards the middle of the VTC curve, and hence increase the noise margin.

Dual gate material (Au and Pt) based double-gate MOSFET for high-speed devices

Aluminium Gallium Arsenide (AlGaAs) is a semiconductor material used in the latest design of double heterostructure laser diodes. This semiconductor is mostly available in the arbitrary alloy form between Gallium Arsenide and Aluminium Arsenide. It is derived from the Tri-MethylGallium (TMG/TMGa), and Arsine (AsH3), both the chemicals are pyrophoric and toxic. The resistance is less between source and drain contacts in the case of AlGaAs so that it has been proposed as a material to grow contacts on Indium Phosphide (InP) layer. The AlGaAs uses an ion implantation model for a design purpose which lowers the thermal power while the operation of the device. The parasitic capacitance has to be taken care of while designing a device using this material since the capacitance affects much in the AlGaAs based devices. The average velocity of the electrons has been observed to be increased by 14.63 % in the Au-gate (gate-1) and Pt-gate (gate-2) material-based Double-Gate (DG) MOSFET compared to the Silicon-based DG MOSFET. This paves the way for higher electron mobility, in turn, it can be used in highfrequency device manufacturing. The proposed material can be used in high-speed hybrid applications such as HEMTs and radiofrequency devices for long-haul communication.