Three-Dimensional CMOS Image Sensor for Pedestrian Protection and Collision Mitigation

A combined effect of moisture diffusion, heat transfer, and hygro-thermo-vapor pressure modeling for pre-mold QFN CMOS Image Sensor (CIS) package has been developed in this study. Hygroscopic swelling properties such as saturation, coefficient of moisture expansion (CME) and activation energy can be extracted through TMA (Thermal Mechanical Analysis) and TGA (Thermal Gravitational Analysis) instruments. Fick’s second law of transient diffusion is solved by using finite element analysis (FEA) to evaluate the overall moisture distributions. With obtained experimental data, a three-dimensional FEA CIS model using the “thermal-wetness” technique is developed to predict the moisture absorption, moisture desorption, temperature distributions, hygro-thermo-vapor pressure mechanical coupled effect and the residual stress distributions at JEDEC pre-conditioning standard JESD22-A120.

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Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005. ◽

10.1109/isscc.2005.1494016 ◽

2005 ◽

Cited By ~ 62

Author(s):

V. Suntharalingam ◽

R. Berger ◽

J.A. Burns ◽

C.K. Chen ◽

C.L. Keast ◽

...

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Cmos Image Sensor ◽

Image Sensor ◽

Three Dimensional Integrated Circuit ◽

Circuit Technology

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Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading

Materials Science Forum ◽

10.4028/www.scientific.net/msf.594.175 ◽

2008 ◽

Vol 594 ◽

pp. 175-180

Author(s):

Hsiang Chen Hsu ◽

Hui Yu Lee ◽

Wen Lo Shieh

Keyword(s):

Finite Element ◽

Finite Element Model ◽

Three Dimensional ◽

Region Of Interest ◽

Element Model ◽

Cmos Image Sensor ◽

Image Sensor ◽

Computational Time ◽

Mesh Density ◽

Good Agreement

A three-dimensional finite element model of CMOS image sensor QFN packaging using ANSYS codes is developed to investigate the solder joint reliability under thermal cycle test. The predicted thermal-induced displacements were found to be very good agreement with the Moiré interferometer experimental in-plane deformations. The developed finite element model is then applied to predict fatigue life of Sn4.0Ag0.5Cu, Sn3.5Ag0.5Cu and Sn3.9Ag0.6Cu alloys based on JEDEC standard JESD22-A104. In order to save computational time and produce satisfactory results in the region of interest, an independent more finely meshed so-called submodel scheme based on cut-boundary displacement method is generated. The mesh density for different area ratio of refinery/coarse model was verified and the results were found to be good agreement with previous researches. The modified Coffin-Manson equation and strain energy density based equation are applied to evaluate the reliability of SnAgCu alloys. A series of comprehensive parametric studies were conducted in this paper.

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