This article provides an overview of the evolution of the in-situ consolidation (ISC) process over time. This evolution is intimately linked with the advancements in each of the steps of the ISC manufacturing process, is additive in nature, and is limited by the orthotropic nature of composite materials and the physicochemical behavior of the thermoplastic matrix. This review covers four key topics: (a) Thermal models—simulation tools are critical to understand a process with such large spatial gradients and fast changes. Heating systems once marked a turning point in the development of industrial ISC systems. Today, lasers are the most recent trend, and there are three key issues being studied: The absorption of energy of light by the material, the laser profile, and the laser focusing. Several approaches have been proposed for the distributed temperature measurements, given the strong temperature gradients. (b) Adhesion—this refers to two subsequent mechanisms. In the first place, the process of intimate contact is one by which two surfaces of thermoplastic pre-impregnated composite materials are brought into contact under pressure and temperature. This enables closure of the existing gaps between the two microscopic irregular surfaces. This process is then followed by the healing or diffusion of polymer molecules across the interface. (c) Crystallinity—mostly influenced by the cooling rate, and strongly affects the mechanical properties. (d) Degradation—this refers to the potential irreversible changes in the polymer structure caused by the high temperatures required for the process. Degradation can be avoided through adequate control of the process parameters. The end goal of the ISC manufacturing process is to achieve a high product quality with a high deposition rate through an industrial process competitive with the current manufacturing process for thermoset composites.
Microstructural characterization of NiAl–Al2O3 composite materials obtained by in situ aluminothermic reduction of NiO for potential coating applications
