Computer Controlled X-Ray Diffraction Measurement of Residual Stress

1973 ◽  
pp. 344-353 ◽  
Author(s):  
Carol J. Kelly ◽  
E. Eichen
1972 ◽  
Vol 16 ◽  
pp. 344-353 ◽  
Author(s):  
Carol J. Kelly ◽  
E. Eichen

AbstractThe system to be described includes hardware and software for the on-line computer control of the X-ray diffraction measurement of residual stress. This determination involves accurately measuring the angles at which a back-reflection line is diffracted, first by diffracting planes parallel to the sample surface, and then by planes at an angle (ψ) to the sample surface. The residual stress is calculated from the difference in the two measured diffraetion angles. The procedure executed by the computer consists of locating the peaks, selecting three angles for collection of X-ray counts, correcting the measured counts, fitting the equi-angular intensity measurements to a three-point parabola, calculating the peak angles, calculating the residual stress from the measured angles and typing a report. This automation has eliminated the tedium of the manual X-ray data accumulation and of the residual stress calculation. The online control has also permitted improvements in the technique not practicable with the manually performed measurement of residual stress.


2007 ◽  
Vol 40 (4) ◽  
pp. 675-683 ◽  
Author(s):  
Cristy L. Azanza Ricardo ◽  
Mirco D'Incau ◽  
Paolo Scardi

A new procedure is proposed to determine sub-surface residual stress gradients by laboratory X-ray diffraction measurements at different depths using a chemical layer-removal technique. The standard correction algorithm for stress relaxation due to layer removal is improved by including corrections for X-ray absorption, and by the addition of constraints imposed by the mechanical equilibrium conditions. Besides correcting the data,i.e.providing more reliable through-thickness residual stress trends, the proposed procedure also provides an elastically compatible and plausible estimate of the residual stress inside the component, well beyond the measured region. The application of the model is illustrated for a set of Al-alloy components shot-peened at different Almen intensities. Results are compared with those given by `blind hole drilling', which is an independent and partly destructive method.


1985 ◽  
Vol 107 (2) ◽  
pp. 185-191 ◽  
Author(s):  
C. O. Ruud ◽  
R. N. Pangborn ◽  
P. S. DiMascio ◽  
D. J. Snoha

A unique X-ray diffraction instrument for residual stress measurement has been developed that provides for speed, ease of measurement, accuracy, and economy of surface stress measurement. Application of this instrument with a material removal technique, e.g., electropolishing, has facilitated detailed, high resolution studies of three-dimensional stress fields. This paper describes the instrumentation and techniques applied to conduct the residual stress measurement and presents maps of the residual stress data obtained for the surfaces of a heavy 2 1/4 Cr 1 Mo steel plate weldment.


2014 ◽  
Vol 996 ◽  
pp. 175-180 ◽  
Author(s):  
Rasha Alkaisee ◽  
Ru Lin Peng

For X-Ray Diffraction Measurement of Depth Profiles of Residual Stress, Step-Wise Removal of Materials has to be Done to Expose the Underneath Layers to the X-Rays. this Paper Investigates the Influence of Layer Removal Methods, Including Electro-Polishing in Two Different Electrolytes and Chemical Etching, on the Accuracy of Residual Stress Measurement. Measurements on Two Shot-Peened Steels Revealed Large Discrepancy in Subsurface Distributions of Residual Stress Obtained with the Respective Methods. Especially, the Chemical Etching Yielded much Lower Subsurface Compressive Stresses than the Electro-Polishing Using a so Called AII Electrolyte. the Difference was Explained by the Influence of the Different Layer Removal Methods on the Microscopic Roughness.


2011 ◽  
Vol 38 (3) ◽  
pp. 186-191 ◽  
Author(s):  
Farid Takali ◽  
Anouar Njeh ◽  
Hartmut Fuess ◽  
Mohamed Hédi Ben Ghozlen

1963 ◽  
Vol 7 ◽  
pp. 31-45 ◽  
Author(s):  
Ronald C. Larson

AbstractThis paper presents the theoretical and practical aspects of measuring residual stresses by X-ray diffraction with emphasis on the analysis of aluminum alloys. The theoretical considerations of radiation) beam geometry, and peak location will be discussed in regard to establishing optimum analysis techniques. The precision and reproducibility of this technique have been investigated so that results can be applied accurately. The approach, however, is basically a practical one, with the intent of studying residual stress systems as they affect engineering applications. Residual stress systems produced by thermal and mechanical treatments have been determined and the effect of treatment modifications and variations on the resultant stress system have been analyzed. The effect of operational variables such as time and temperature on the developed stress system are shown. From this, the merits of a particular treatment can be determined with respect to its intended application.Analysis of solution heat-treated and quenched 2014 aluminum has shown a significant effect of the quench temperature on the resultant residual stress system. The results obtained from shot-peening this alloy are presented, as well as the effect of time and temperature on the shot-peened stress gradient.


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