Computer Controlled X-Ray Diffraction Measurement of Residual Stress

1972 ◽  
Vol 16 ◽  
pp. 344-353 ◽  
Author(s):  
Carol J. Kelly ◽  
E. Eichen
Keyword(s):  
Residual Stress ◽  
Computer Control ◽  
Sample Surface ◽  
Diffraction Measurement ◽  
X Ray Diffraction ◽  
X Ray ◽  
Intensity Measurements ◽  
On Line ◽  
Computer Controlled ◽  
The Difference

AbstractThe system to be described includes hardware and software for the on-line computer control of the X-ray diffraction measurement of residual stress. This determination involves accurately measuring the angles at which a back-reflection line is diffracted, first by diffracting planes parallel to the sample surface, and then by planes at an angle (ψ) to the sample surface. The residual stress is calculated from the difference in the two measured diffraetion angles. The procedure executed by the computer consists of locating the peaks, selecting three angles for collection of X-ray counts, correcting the measured counts, fitting the equi-angular intensity measurements to a three-point parabola, calculating the peak angles, calculating the residual stress from the measured angles and typing a report. This automation has eliminated the tedium of the manual X-ray data accumulation and of the residual stress calculation. The online control has also permitted improvements in the technique not practicable with the manually performed measurement of residual stress.

scholarly journals Influence of Layer Removal Methods in Residual Stress Profiling of a Shot Peened Steel Using X-Ray Diffraction

2014 ◽  
Vol 996 ◽  
pp. 175-180 ◽  
Author(s):  
Rasha Alkaisee ◽  
Ru Lin Peng
Keyword(s):  
Residual Stress ◽  
Chemical Etching ◽  
Stress Measurement ◽  
Diffraction Measurement ◽  
X Rays ◽  
X Ray Diffraction ◽  
X Ray ◽  
Layer Removal ◽  
Compressive Stresses ◽  
The Difference

For X-Ray Diffraction Measurement of Depth Profiles of Residual Stress, Step-Wise Removal of Materials has to be Done to Expose the Underneath Layers to the X-Rays. this Paper Investigates the Influence of Layer Removal Methods, Including Electro-Polishing in Two Different Electrolytes and Chemical Etching, on the Accuracy of Residual Stress Measurement. Measurements on Two Shot-Peened Steels Revealed Large Discrepancy in Subsurface Distributions of Residual Stress Obtained with the Respective Methods. Especially, the Chemical Etching Yielded much Lower Subsurface Compressive Stresses than the Electro-Polishing Using a so Called AII Electrolyte. the Difference was Explained by the Influence of the Different Layer Removal Methods on the Microscopic Roughness.

Problems Associated with Kα Doublet in Residual Stress Measurements

1979 ◽  
Vol 23 ◽  
pp. 333-339
Author(s):  
S. K. Gupta ◽  
B. D. Cullity
Keyword(s):  
Residual Stress ◽  
Silicon Powder ◽  
Lattice Parameter ◽  
Diffraction Peak ◽  
Parameter Determination ◽  
X Ray Diffraction ◽  
X Ray ◽  
Analysis Techniques ◽  
The Difference ◽  
Similar Accuracy

Since the measurement of residual stress by X-ray diffraction techniques is dependent on the difference in angle of a diffraction peak maximum when the sample is examined consecutively with its surface at two different angles to the diffracting planes, it is important that these diffraction angles be obtained precisely, preferably with an accuracy of ± 0.01 deg. 2θ. Similar accuracy is desired in precise lattice parameter determination. In such measurements, it is imperative that the diffractometer be well-aligned. It is in the context of diffractometer alignment with the aid of a silicon powder standard free of residual stress that the diffraction peak analysis techniques described here have been developed, preparatory to residual stress determinations.

Revision and extension of the standard laboratory technique for X-ray diffraction measurement of residual stress gradients

2007 ◽  
Vol 40 (4) ◽  
pp. 675-683 ◽  
Author(s):  
Cristy L. Azanza Ricardo ◽  
Mirco D'Incau ◽  
Paolo Scardi
Keyword(s):  
Residual Stress ◽  
Hole Drilling ◽  
Al Alloy ◽  
Diffraction Measurement ◽  
X Ray Diffraction ◽  
Surface Residual Stress ◽  
X Ray ◽  
Stress Gradients ◽  
Layer Removal ◽  
Removal Technique

A new procedure is proposed to determine sub-surface residual stress gradients by laboratory X-ray diffraction measurements at different depths using a chemical layer-removal technique. The standard correction algorithm for stress relaxation due to layer removal is improved by including corrections for X-ray absorption, and by the addition of constraints imposed by the mechanical equilibrium conditions. Besides correcting the data,i.e.providing more reliable through-thickness residual stress trends, the proposed procedure also provides an elastically compatible and plausible estimate of the residual stress inside the component, well beyond the measured region. The application of the model is illustrated for a set of Al-alloy components shot-peened at different Almen intensities. Results are compared with those given by `blind hole drilling', which is an independent and partly destructive method.

X-Ray Diffraction Measurement of Residual Stresses in Thick, Multi-Pass Steel Weldments

1985 ◽  
Vol 107 (2) ◽  
pp. 185-191 ◽  
Author(s):  
C. O. Ruud ◽  
R. N. Pangborn ◽  
P. S. DiMascio ◽  
D. J. Snoha
Keyword(s):  
Residual Stress ◽  
Measurement Accuracy ◽  
Stress Measurement ◽  
Three Dimensional ◽  
Residual Stress Measurement ◽  
Stress Fields ◽  
Diffraction Measurement ◽  
X Ray Diffraction ◽  
X Ray ◽  
Removal Technique

A unique X-ray diffraction instrument for residual stress measurement has been developed that provides for speed, ease of measurement, accuracy, and economy of surface stress measurement. Application of this instrument with a material removal technique, e.g., electropolishing, has facilitated detailed, high resolution studies of three-dimensional stress fields. This paper describes the instrumentation and techniques applied to conduct the residual stress measurement and presents maps of the residual stress data obtained for the surfaces of a heavy 2 1/4 Cr 1 Mo steel plate weldment.

X-Ray Spectrometer with a Submicron X-Ray Beam for Ulsi Microanalysis

1994 ◽  
Vol 338 ◽  
Author(s):  
Naoki Yamamoto ◽  
Yoshio Homma ◽  
Shinji Sakata ◽  
Yoshinori Hosokawa
Keyword(s):  
Line Width ◽  
Simultaneous Measurement ◽  
Strong Correlation ◽  
Void Formation ◽  
Single Layer ◽  
Diffraction Measurement ◽  
Minimum Sample Size ◽  
X Ray Diffraction ◽  
X Ray ◽  
On Line

ABSTRACTA fluorescent and diffraction X-ray spectrometer with a 0.8 μmϕ Xray beam has been developed. It allows simultaneous measurement of local strains and minute amounts of metal contaminants in fine ULSI devices. The minimum sample size for X-ray diffraction measurement with it is a 0.3 μm diameter by 0.2 μm deep volume. It is applied to analyze strain in Al lines, showing that strain in Al single-layer lines (no barrier) increases significantly as the line width is reduced below 1.5 μm. Introducing barrier metals reduces this dependence of strain on line width. It is also found that hillock and void formation has a very strong correlation to strain.

Review of Residual Stress Determination and Exploitation Techniques Using X-Ray Diffraction Method

2006 ◽  
Vol 524-525 ◽  
pp. 229-234
Author(s):  
M. Belassel ◽  
J. Pineault ◽  
M.E. Brauss
Keyword(s):  
Residual Stress ◽  
Diffraction Method ◽  
Point Of View ◽  
Stress And Strain ◽  
Stress Determination ◽  
Calculation Methods ◽  
X Ray Diffraction ◽  
X Ray ◽  
True Meaning ◽  
The Difference

Although x-ray diffraction techniques have been applied to the measurement of residual stress in the industry for decades, some of the related details are still unclear to many production and mechanical testing engineers working in the field. This is because these details, specifically those associated with the transition between diffraction and mechanics, are not always emphasized in the literature. This paper will emphasize the appropriate calculation methods and the steps necessary to perform high quality residual stress measurements. Additionally, details are given regarding the difference between mechanical and x-ray elastic constants, as well as the true meaning of stress and strain from both diffraction and strain gage point of view. Cases where the material is subject to loading above the yield limit are also included.

Non-Destructive Analysis of Surface Stresses Using Grazing Incident X-Ray Diffraction

2005 ◽  
Vol 490-491 ◽  
pp. 143-148
Author(s):  
Chedly Braham ◽  
Andrzej Baczmanski ◽  
Wilfrid Seiler ◽  
N. Shiraki
Keyword(s):  
Sample Surface ◽  
Polycrystalline Materials ◽  
Diffraction Measurement ◽  
X Ray Diffraction ◽  
Surface Layers ◽  
X Ray ◽  
Lattice Strains ◽  
Crystallographic Planes ◽  
Destructive Measurement ◽  
Non Destructive

The X-ray diffraction measurements based on the grazing incident geometry were applied to determine lattice strains in polycrystalline materials. This method enables a non-destructive measurement at chosen depth below the sample surface. The volume, for which the stress is measured, is well defined and it does not vary during experiment. The multireflection method was used for analysis of the experimental results since the interplanar spacings were measured for various orientation of the scattering vector as well as for various crystallographic planes {hkl}. Applying two different wavelengths of X- ray radiation and various incident angles non-destructive measurements of the residual stresses in function of penetration depth were performed. The variation of stresses in plastically deformed surface layers of steel samples was successfully determined and the values of the stresses were confirmed by standard diffraction measurement.

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