scholarly journals Local Turn-Boundedness: A Curvature Control for a Good Digitization

Author(s):  
Étienne Le Quentrec ◽  
Loïc Mazo ◽  
Étienne Baudrier ◽  
Mohamed Tajine
Keyword(s):  
2021 ◽  
pp. 110658
Author(s):  
Solene G.D. Hegarty-Cremer ◽  
Matthew J. Simpson ◽  
Thomas L. Andersen ◽  
Pascal R. Buenzli

Crystals ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 654
Author(s):  
Andrei A. Krasilin ◽  
Ekaterina K. Khrapova ◽  
Tatiana P. Maslennikova

The past two decades have been marked by an increased interest in the synthesis and the properties of geoinspired hydrosilicate nanoscrolls and nanotubes. The present review considers three main representatives of this group: halloysite, imogolite and chrysotile. These hydrosilicates have the ability of spontaneous curling (scrolling) due to a number of crystal structure features, including the size and chemical composition differences between the sheets, (or the void in the gibbsite sheet and SiO2 tetrahedron, in the case of imogolite). Mineral nanoscrolls and nanotubes consist of the most abundant elements, like magnesium, aluminium and silicon, accompanied by uncontrollable amounts of impurities (other elements and phases), which hinder their high technology applications. The development of a synthetic approach makes it possible to not only to overcome the purity issues, but also to enhance the chemical composition of the nanotubular particles by controllable cation doping. The first part of the review covers some principles of the cation doping approach and proposes joint criteria for the semiquantitative prediction of morphological changes that occur. The second part focuses on some doping-related properties and applications, such as morphological control, uptake and release, magnetic and mechanical properties, and catalysis.


Author(s):  
Sutee Eamkajornsiri ◽  
Ranga Narayanaswami ◽  
Abhijit Chandra

Chemical mechanical polishing (CMP) is a planarization process that produces high quality surfaces both locally and globally. It is one of the key process steps during the fabrication of very large scale integrated (VLSI) chips in integrated circuit (IC) manufacturing. CMP consists of a chemical process and a mechanical process being performed together to reduce height variation across a wafer. High and reliable wafer yield, which is dependent upon uniformity of the material removal rate across the entire wafer, is of critical importance in the CMP process. In this paper, the variations in material removal rate (MRR) variation across the wafer are analytically modeled assumimg a rigid wafer and a flexible polishing pad. The wafer pad contact is modeled as the indentation of a rigid indenter on an elastic half-space. Load and curvature control strategies are investigated for improving the wafer yield. The notion of curvature control is entirely new and has not been addressed in the literature. The control strategy is based on minimizing a moment function that represents the wafer curvature and the height of the oxide layer left for material removal. Simulation results indicate that curvature control can improve wafer yield significantly, and is more effective than just the load control.


2017 ◽  
Vol 42 (21) ◽  
pp. 4383 ◽  
Author(s):  
Siamak Abbaslou ◽  
Robert Gatdula ◽  
Ming Lu ◽  
Aaron Stein ◽  
Wei Jiang

Author(s):  
Siamak Abbaslou ◽  
Robert Gatdula ◽  
Ming Lu ◽  
Aaron Stein ◽  
Wei Jiang

2003 ◽  
Vol 125 (4) ◽  
pp. 787-793 ◽  
Author(s):  
Jong-Gye Shin ◽  
Yang-Ryul Choi ◽  
Hyunjune Yim

The mechanics of die-less asymmetric rolling has been investigated in depth, for the first time, using a two-dimensional analytical model and a three-dimensional finite element model. In doing so, the physical understanding of mechanics underlying die-less asymmetric rolling has greatly been enhanced. Moreover, the asymmetry in roller radii was found to be the most effective parameter for curvature control, in the considered ranges of various parameters.


Sign in / Sign up

Export Citation Format

Share Document