Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

2021 ◽  
pp. 309-314
Author(s):  
Syed Mohamad Mardzukey Syed Mohamed Zain ◽  
Fakhrozi Che Ani ◽  
Mohamad Riduwan Ramli ◽  
Azman Jalar ◽  
Maria Abu Bakar
Keyword(s):  
Moisture Content ◽  
Crack Formation ◽  
Ball Grid Array ◽  
Reflow Soldering ◽  
Effect Of Moisture

scholarly journals Effect of Moisture Content on the Processing and Mechanical Properties of a Biodegradable Polyester

Polymers ◽  
2021 ◽  
Vol 13 (10) ◽  
pp. 1616
Author(s):  
Vincenzo Titone ◽  
Antonio Correnti ◽  
Francesco Paolo La Mantia
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Moisture Content ◽  
Mechanical Testing ◽  
Hydrolytic Degradation ◽  
Slight Reduction ◽  
Biodegradable Polyester ◽  
Molding Process ◽  
Elongation At Break ◽  
Effect Of Moisture

This work is focused on the influence of moisture content on the processing and mechanical properties of a biodegradable polyester used for applications in injection molding. The pellets of the biodegradable polyester were exposed under different relative humidity conditions at a constant temperature before being compression molded. The compression-molded specimens were again placed under the above conditions before the mechanical testing. With all these samples, it is possible to determine the effect of moisture content on the processing and mechanical properties separately, as well as the combined effect of moisture content on the mechanical properties. The results obtained showed that the amount of absorbed water—both before processing and before mechanical testing—causes an increase in elongation at break and a slight reduction of the elastic modulus and tensile strength. These changes have been associated with possible hydrolytic degradation during the compression molding process and, in particular, with the plasticizing action of the moisture absorbed by the specimens.

Structural Changes on Charring Woods of Dichrostachys and Salix from Southern Africa: The Effect of Moisture Content

IAWA Journal ◽  
1986 ◽  
Vol 7 (3) ◽  
pp. 243-250 ◽  
Author(s):  
Juliet Prior ◽  
K. L. Alvin
Keyword(s):  
Moisture Content ◽  
Southern Africa ◽  
Structural Changes ◽  
Initial Increase ◽  
Dichrostachys Cinerea ◽  
Chemical Changes ◽  
Structural Alterations ◽  
Wood Pyrolysis ◽  
Effect Of Moisture ◽  
Physical And Chemical

Air-dried and saturated cubes of fully developed wood of Dichrostachys cinerea (Leguminosae) and Salix subserrata (Salicaceae) were charred for 60 minutes at 400°C. An initial increase in moisture content caused few structural alterations in Salix but in Dichrostachys it resulted in considerable ray distension and massive deformation of non-gelatinous fibres. An attempt is made to correlate these observations with the physical and chemical changes known to occur during wood pyrolysis.

The effect of moisture content in fibre laser cutting of pine wood

2011 ◽  
Vol 49 (9-10) ◽  
pp. 1139-1152 ◽  
Author(s):  
Juan Carlos Hernández-Castañeda ◽  
Huseyin Kursad Sezer ◽  
Lin Li
Keyword(s):  
Moisture Content ◽  
Laser Cutting ◽  
Fibre Laser ◽  
Pine Wood ◽  
Effect Of Moisture

Ball Grid Array Thermomechanical Response During Reflow Assembly

1996 ◽  
Vol 118 (4) ◽  
pp. 214-222 ◽  
Author(s):  
T. E. Voth ◽  
T. L. Bergman
Keyword(s):  
Process Model ◽  
Experimental Studies ◽  
Ball Grid Array ◽  
Mechanical Processing ◽  
Processing Conditions ◽  
System Behavior ◽  
Reflow Soldering ◽  
Thermomechanical Response ◽  
Model Predictions ◽  
Representative System

The thermomechanical response of ball-grid array assemblies during reflow soldering is considered here. Experiments are performed to investigate the thermomechanical response of a representative system and the results are used to validate a numerical model of system behavior. The conclusions drawn from the experimental studies are used to guide development of a process model capable of describing more realistic BGA soldering scenarios. Process model predictions illustrate the system’s thermomechanical response to thermal and mechanical processing conditions, as well as component properties. High thermal conductivity assemblies show the greatest sensitivity to mechanical loading conditions.

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