Comparative Analysis of Printed Circuit Board Coating on Corrosion Test

Author(s):  
Chengyu Ju ◽  
Xiaohui Wang ◽  
Run Zhu ◽  
Xiaoming Ren
2019 ◽  
pp. 26-30 ◽  
Author(s):  
M. S. Batutina ◽  
A. A. Kuzmin ◽  
A. N. Mikhailov

The paper considers an embodiment of the antenna design based on a flat non‑axis‑symmetrical transreflector made by using multilayer printed circuit board technology. The construction principle of a flat non‑axis‑symmetrical transreflector by cutting it from the flat polarizing structure is given. The form of the flat multi‑layer non‑axisymmetric transreflector board is determined by the projection of the non‑axisymmetric parabolic transflector onto a plane perpendicular to the focal axis. An electrodynamic model of the antenna with a flat non‑axis‑symmetrical reflector to study the radiation characteristics in the UHF range was constructed. A comparative analysis of the radiation characteristics of antennas on the basis of planar multilayer axisymmetric and flat multilayer non‑axis‑symmetrical transreflectors was performed. A number of technological advantages of the developed flat structure over a non‑axis‑symmetrical parabolic transreflector due to use of the known technology of multilayer printed circuit boards is also described.


2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.


Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.


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