A Hybrid Approach for Building 2D and 3D Conforming Delaunay Meshes Suitable for Process and Device Simulation

1998 ◽  
pp. 185-188
Author(s):  
G. Garretón ◽  
L. Villablanca ◽  
N. Strecker ◽  
W. Fichtner
Keyword(s):  
Hybrid Approach ◽  
Device Simulation ◽  
Delaunay Meshes ◽  
2D And 3D

scholarly journals Topologically Rectangular Grids in the Parallel Simulation of Semiconductor Devices

VLSI Design ◽  
1998 ◽  
Vol 6 (1-4) ◽  
pp. 91-95 ◽  
Author(s):  
A. Asenov ◽  
A. R. Brown ◽  
S. Roy ◽  
J. R. Barker
Keyword(s):  
Simulated Annealing Algorithm ◽  
Semiconductor Device ◽  
Electronic Device ◽  
Device Simulation ◽  
Power Electronic ◽  
Two Dimensional ◽  
Solution Strategy ◽  
Rectangular Grids ◽  
Annealing Algorithm ◽  
2D And 3D

Topologically rectangular grids offer simplicity and efficiency in the design of parallel semiconductor device simulators tailored for mesh connected MIMD platforms. This paper presents several approaches to the generation of topologically rectangular 2D and 3D grids. The effects of the partitioning of such grids on different processor configurations are studied. A simulated annealing algorithm is used to optimise the partitioning of 2D and 3D grids on two dimensional arrays of processors. Problems related to the discretization, parallel matrix generation and solution strategy are discussed. The use of topologically rectangular grids is illustrated through the example of power electronic device simulation.

scholarly journals Hybrid Particle-based Full-band Analysis of Ultra-small MOS

VLSI Design ◽  
2001 ◽  
Vol 13 (1-4) ◽  
pp. 125-129
Author(s):  
S. J. Wigger ◽  
S. M. Goodnick ◽  
M. Saraniti
Keyword(s):  
Hybrid Approach ◽  
Simulation Tool ◽  
Ensemble Monte Carlo ◽  
Poisson Solver ◽  
Simulation Engine ◽  
Novel Approach ◽  
Full Band ◽  
Charge Concentration ◽  
2D And 3D ◽  
Mos Structures

We report on the 2D and 3D modeling of ultra-small MOS structures using a newly developed full-band device simulator. The simulation tool is based on a novel approach, featuring a hybrid Ensemble Monte Carlo (EMC)-Cellular Automata (CA) simulation engine. In this hybrid approach charge transport is simulated using the CA in regions of momentum space where most scattering events occur and the EMC elsewhere, thus optimizing the trade-off between the fast, but memory consuming CA method and the slower EMC method. To account for the spatial distribution of the electric field and charge concentration, the hybrid EMC/CA simulator is self-consistently coupled with a 2D and 3D multi-grid Poisson solver. The solver is then used to simulate the performance of a 40 nm gate length n-MOSFET structure.

Analysis of 2D and 3D defects associated with precipitation of Cu in silicon

1991 ◽  
Vol 49 ◽  
pp. 870-871
Author(s):  
P.M. Rice ◽  
MJ. Kim ◽  
R.W. Carpenter
Keyword(s):  
Colony Growth ◽  
Dark Field ◽  
Dark Side ◽  
Silicide Phase ◽  
Strain Fields ◽  
Near Surface ◽  
Unknown Composition ◽  
Secondary Precipitates ◽  
20 Nm ◽  
2D And 3D

Extrinsic gettering of Cu on near-surface dislocations in Si has been the topic of recent investigation. It was shown that the Cu precipitated hetergeneously on dislocations as Cu silicide along with voids, and also with a secondary planar precipitate of unknown composition. Here we report the results of investigations of the sense of the strain fields about the large (~100 nm) silicide precipitates, and further analysis of the small (~10-20 nm) planar precipitates.Numerous dark field images were analyzed in accordance with Ashby and Brown's criteria for determining the sense of the strain fields about precipitates. While the situation is complicated by the presence of dislocations and secondary precipitates, micrographs like those shown in Fig. 1(a) and 1(b) tend to show anomalously wide strain fields with the dark side on the side of negative g, indicating the strain fields about the silicide precipitates are vacancy in nature. This is in conflict with information reported on the η'' phase (the Cu silicide phase presumed to precipitate within the bulk) whose interstitial strain field is considered responsible for the interstitial Si atoms which cause the bounding dislocation to expand during star colony growth.

Covalent organic frameworks: an ideal platform for designing ordered materials and advanced applications

2021 ◽  
Author(s):  
Ruoyang Liu ◽  
Ke Tian Tan ◽  
Yifan Gong ◽  
Yongzhi Chen ◽  
Zhuoer Li ◽  
...  
Keyword(s):  
Covalent Organic Frameworks ◽  
2D And 3D ◽  
Advanced Applications

Covalent organic frameworks offer a molecular platform for integrating organic units into periodically ordered yet extended 2D and 3D polymers to create topologically well-defined polygonal lattices and built-in discrete micropores and/or mesopores.

Surgical and endovascular hybrid approach in peripheral arterial disease of the lower limbs

VASA ◽  
2016 ◽  
Vol 45 (5) ◽  
pp. 417-422 ◽  
Author(s):  
Anouk Grandjean ◽  
Katia Iglesias ◽  
Céline Dubuis ◽  
Sébastien Déglise ◽  
Jean-Marc Corpataux ◽  
...  
Keyword(s):  
Mortality Rate ◽  
Peripheral Arterial Disease ◽  
Limb Salvage ◽  
Hybrid Approach ◽  
Arterial Disease ◽  
Early Mortality ◽  
Secondary Patency ◽  
Limb Salvage Rate ◽  
Peripheral Arterial ◽  
Salvage Rate

Abstract. Background: Multilevel peripheral arterial disease is frequently observed in patients with intermittent claudication or critical limb ischemia. This report evaluates the efficacy of one-stage hybrid revascularization in patients with multilevel arterial peripheral disease. Patients and methods: A retrospective analysis of a prospective database included all consecutive patients treated by a hybrid approach for a multilevel arterial peripheral disease. The primary outcome was the patency rate at 6 months and 1 year. Secondary outcomes were early and midterm complication rate, limb salvage and mortality rate. Statistical analysis, including a Kaplan-Meier estimate and univariate and multivariate Cox regression analyses were carried out with the primary, primary assisted and secondary patency, comparing the impact of various risk factors in pre- and post-operative treatments. Results: 64 patients were included in the study, with a mean follow-up time of 428 days (range: 4 − 1140). The technical success rate was 100 %. The primary, primary assisted and secondary patency rates at 1 year were 39 %, 66 % and 81 %, respectively. The limb-salvage rate was 94 %. The early mortality rate was 3.1 %. Early and midterm complication rates were 15.4 % and 6.4 %, respectively. The early mortality rate was 3.1 %. Conclusions: The hybrid approach is a major alternative in the treatment of peripheral arterial disease in multilevel disease and comorbid patients, with low complication and mortality rates and a high limb-salvage rate.

Evaluating Alternate Visualization Methods for Microsurgery: 2D and 3D Optical Microscopes and Flat-Panel Displays

2012 ◽  
Author(s):  
Michael Sackllah ◽  
Denny Yu ◽  
Charles Woolley ◽  
Steven Kasten ◽  
Thomas J. Armstrong
Keyword(s):  
Flat Panel Displays ◽  
Flat Panel ◽  
2D And 3D

Alternative 2D and 3D Visualization Methods for Microsurgery: Posture, Performance, and Discomfort Analysis

2011 ◽  
Author(s):  
Denny Yu ◽  
Michael Sackllah ◽  
Charles Woolley ◽  
Steven Kasten ◽  
Thomas J. Armstrong
Keyword(s):  
3D Visualization ◽  
2D And 3D
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