Research on flexible adaptive CNC polishing process and residual stress of blisk blade

2019 ◽  
Vol 103 (5-8) ◽  
pp. 2495-2513 ◽  
Author(s):  
Dongbo Wu ◽  
Hui Wang ◽  
Kaiyao Zhang ◽  
Xiaojun Lin
Keyword(s):  
Residual Stress ◽  
Polishing Process ◽  
Blisk Blade

CFD modelling of a novel hydrodynamic suspension polishing process for ultra-smooth surface with low residual stress

2017 ◽  
Vol 317 ◽  
pp. 320-328 ◽  
Author(s):  
Huan Qi ◽  
Zhong Xie ◽  
Tao Hong ◽  
Yang-yu Wang ◽  
Fan-zhi Kong ◽  
...  
Keyword(s):  
Residual Stress ◽  
Smooth Surface ◽  
Polishing Process ◽  
Cfd Modelling

Experimental Research on the Relationship between Surface Polishing and Fracture Strength for Ground Ceramics

2013 ◽  
Vol 770 ◽  
pp. 433-436
Author(s):  
Xin Li Tian ◽  
Jian Quan Wang ◽  
Bao Guo Zhang ◽  
Peng Xiao Wang
Keyword(s):  
Residual Stress ◽  
Fracture Strength ◽  
Ground Surface ◽  
Residual Tensile Stress ◽  
Residual Stress Field ◽  
Polishing Process ◽  
Machined Surface ◽  
X Ray ◽  
Surface Polishing ◽  
The Relationship

Fracture strength is one of the key mechanics performances for engineering ceramics products, greatly influenced by the microscopic topography and residual stress field of ground surface. In this work, several testing equipments, such as the metallurgical microscope, surface profiler and X ray residual stress tester were introduced to investigate the relationships between microscopic topography, surface roughness, residual stress and fracture strength of ground ceramics, after the surface grinding and mechanical polishing. The experimental results show that a smoother machined surface with low roughness and residual stress is obtained through polishing with absolute alcohol for 20 minutes; the fracture strength of Si3N4SiC and Al2O3 are increased by 6.64%8.18% and 6.58% respectively, comparing to the ceramics without polishing; the surface stress concentration and residual tensile stress of polished ceramics are both reduced after an appropriate time of polishing process, which causes a certain improvement of ground fracture strength.

Influence of Final Hand Polishing Process on Surface Residual Stress Field of Japanese Sword

2013 ◽  
Vol 768-769 ◽  
pp. 492-499 ◽  
Author(s):  
Yoshihisa Sakaida ◽  
Hajime Yoshida ◽  
Shigeki Yashiro ◽  
Toshiyuki Murai
Keyword(s):  
Residual Stress ◽  
Stress Field ◽  
Residual Stress Field ◽  
Polishing Process ◽  
Surface Residual Stress

Polishing process effect on the image of dispersed precipitates

1984 ◽  
Vol 42 ◽  
pp. 534-535
Author(s):  
C.T. Hu ◽  
C.W. Allen
Keyword(s):  
Matrix Material ◽  
Specimen Preparation ◽  
Second Phase ◽  
Precipitate Particle ◽  
Polishing Process ◽  
Second Phase Particles ◽  
The Matrix ◽  
Surface Profiles ◽  
Thinning Process

One important problem in determination of precipitate particle size is the effect of preferential thinning during TEM specimen preparation. Figure 1a schematically represents the original polydispersed Ni3Al precipitates in the Ni rich matrix. The three possible type surface profiles of TEM specimens, which result after electrolytic thinning process are illustrated in Figure 1b. c. & d. These various surface profiles could be produced by using different polishing electrolytes and conditions (i.e. temperature and electric current). The matrix-preferential-etching process causes the matrix material to be attacked much more rapidly than the second phase particles. Figure 1b indicated the result. The nonpreferential and precipitate-preferential-etching results are shown in Figures 1c and 1d respectively.

An Improved Method for the Preparation and TEM Examination of Sharp Pointed Tips used in APFIM and STM

1990 ◽  
Vol 48 (2) ◽  
pp. 102-103
Author(s):  
E.A. Fischione ◽  
P.E. Fischione ◽  
J.J. Haugh ◽  
M.G. Burke
Keyword(s):  
Atom Probe ◽  
Preparation Process ◽  
Improved Method ◽  
Ion Milling ◽  
Polishing Process ◽  
Probe Field ◽  
Scanning Tunnelling ◽  
Stm Tips ◽  
Tunnelling Microscopy ◽  
Ion Microscopy

A common requirement for both Atom Probe Field-Ion Microscopy (APFIM) and Scanning Tunnelling Microscopy (STM) is a sharp pointed tip for use as either the specimen (APFIM) or the probe (STM). Traditionally, tips have been prepared by either chemical or electropolishing techniques. Recently, ion-milling has been successfully employed in the production of APFIM tips [1]. Conventional electropolishing techniques are applicable to a wide variety of metals, but generally require careful manual adjustments during the polishing process and may also be time-consuming. In order to reduce the time and effort involved in the preparation process, a compact, self-contained polishing unit has been developed. This system is based upon the conventional two-stage electropolishing technique in which the specimen/tip blank is first locally thinned or “necked”, and subsequently electropolished until separation occurs.[2,3] The result of this process is the production of two APFIM or STM tips. A mechanized polishing unit that provides these functions while automatically maintaining alignment has been designed and developed.

TEM investigations of surface residual stress relaxation in A12O3 and Al2O3-SiC nanocomposite

1994 ◽  
Vol 52 ◽  
pp. 628-629
Author(s):  
J. Fang ◽  
H. M. Chan ◽  
M. P. Harmer
Keyword(s):  
Residual Stress ◽  
Single Phase ◽  
Stress Relief ◽  
Stress Recovery ◽  
Surface Residual Stress ◽  
Microscopic Mechanism ◽  
Sic Particles ◽  
Annealing Procedure ◽  
The Difference ◽  
Nano Size

It was Niihara et al. who first discovered that the fracture strength of Al2O3 can be increased by incorporating as little as 5 vol.% of nano-size SiC particles (>1000 MPa), and that the strength would be improved further by a simple annealing procedure (>1500 MPa). This discovery has stimulated intense interest on Al2O3/SiC nanocomposites. Recent indentation studies by Fang et al. have shown that residual stress relief was more difficult in the nanocomposite than in pure Al2O3. In the present work, TEM was employed to investigate the microscopic mechanism(s) for the difference in the residual stress recovery in these two materials.Bulk samples of hot-pressed single phase Al2O3, and Al2O3 containing 5 vol.% 0.15 μm SiC particles were simultaneously polished with 15 μm diamond compound. Each sample was cut into two pieces, one of which was subsequently annealed at 1300° for 2 hours in flowing argon. Disks of 3 mm in diameter were cut from bulk samples.

Residual stress measurements and modeling of built-up Box-T sections

2021 ◽  
Vol 160 ◽  
pp. 107336
Author(s):  
Ziqian Zhang ◽  
Gang Shi ◽  
Xuesen Chen ◽  
Lijun Wang ◽  
Le Zhou
Keyword(s):  
Residual Stress ◽  
Stress Measurements
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