Development of Ultrasonic Vibration-Assisted Magnetic Compound Fluid (MCF) Polishing Technology

This study investigates the development of an ultrasonic vibration-assisted magnetic compound fluid (MCF) polishing technology for final polishing. The fabrication of an experimental apparatus entails an ultrasonic polishing unit, and the experimental investigation of its performance in surface polishing is described. In addition, ultrasonic vibration-assisted MCF polishing under different applied methods of ultrasonic vibration is studied. The experimental results indicate that applying ultrasonic vibration to the workpiece improves the surface roughness and material removal rate when the ultrasonic vibrations are changed. In addition, across the range of polishing conditions employed in this study, the precision surface roughness and high material removal rate can be easily obtained on the acrylic plate by applying an elliptical vibration to the ultrasonic vibration.

Effect of Surface Polishing on Nano-Hardness and Elastic Modulus of Different Resin Composites after Immersion in Alcoholic Medium

There has been a great tendency toward using resin composite in dentistry and exploring nano-hardness, elastic modulus, and effect of polishing on its mechanical properties after its artificial ageing. This study aimed to evaluate the effect of surface polishing of four different resin composites on their nano-hardness and elastic modulus. This effect was tested right after light curing of composite resin and after its artificial ageing (immersion in alcoholic medium). Nanoindentation test preparations, surface roughness, surface hardness, and scanning electron microscope were conducted across the four different resin composites: Clearfil AP-X (APX), Estelite Sigma Quick (ESQ), Beautifil II (BE2), and FiltekTM Supreme Ultra Universal restorative (FSU). We found that difference in fillers load and particle size are amongst the factors influencing hardness and modulus of elasticity. The APX is the highest in term of hardness due to fillers load and size while the ESQ is the lowest because all fillers in nano size and distributed homogenously. The significance of surface polishing of the studied resin composite restorations was highlighted. Future research may focus on exploring survival rate of polished and non-polished composite surfaces with emphasis on measuring degree of conversion and impacts of polished and non-polished surfaces on the individuals’ oral health quality of life.

Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO2-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization

For scaling-down advanced nanoscale semiconductor devices, tungsten (W)-film surface chemical mechanical planarization (CMP) has rapidly evolved to increase the W-film surface polishing rate via Fenton-reaction acceleration and enhance nanoscale-abrasive (i.e., ZrO2) dispersant stability in the CMP slurry by adding a scavenger to suppress the Fenton reaction. To enhance the ZrO2 abrasive dispersant stability, a scavenger with protonate-phosphite ions was designed to suppress the time-dependent Fenton reaction. The ZrO2 abrasive dispersant stability (i.e., lower H2O2 decomposition rate and longer H2O2 pot lifetime) linearly and significantly increased with scavenger concentration. However, the corrosion magnitude on the W-film surface during CMP increased significantly with scavenger concentration. By adding a scavenger to the CMP slurry, the radical amount reduction via Fenton-reaction suppression in the CMP slurry and the corrosion enhancement on the W-film surface during CMP performed that the W-film surface polishing rate decreased linearly and notably with increasing scavenger concentration via a chemical-dominant CMP mechanism. Otherwise, the SiO2-film surface polishing rate peaked at a specific scavenger concentration via a chemical and mechanical-dominant CMP mechanism. The addition of a corrosion inhibitor with a protonate-amine functional group to the W-film surface CMP slurry completely suppressed the corrosion generation on the W-film surface during CMP without a decrease in the W- and SiO2-film surface polishing rate.

Constrained Abrasive Jet Polishing with a Tangentially Aligned Nozzle Shroud

In order to improve surface polishing quality and efficiency for hard and brittle components, a novel nozzle with specifically designed shroud was proposed for an abrasive jet polishing process. The removal mechanism of the abrasive jet under such a nozzle was investigated by simulating the jet flow in the interaction area of the nozzle shroud and workpiece. The simulation results show that the speed of the abrasive jet increases greatly by the shroud and the direction of the jet is aligned near parallel to the workpiece surface to minimize impact damage to workpiece surface. The constrained abrasive jet polishing (CAJP) experiments were conducted on the quartz glass component, a typical hard and brittle material, showing that the material removal mainly relied on the shearing and scratching of the workpiece surface rather than the mechanical shock impacts, which is consistent with the simulation findings.

Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry

In this work we present a large-volume workflow for fast failure analysis of microelectronic devices that combines a stand-alone ps-laser ablation tool with a SEM/Xe Plasma FIB system. In this synergy, the ps-laser is used to quickly remove large volumes of bulk material while the SEM/Xe Plasma FIB is used for precise end-pointing to the feature of interest and fine surface polishing after laser. The concept of having a stand-alone laser tool obeys the logic of maximizing productivity as both systems can work simultaneously and continuously. As application examples we first present a full workflow to prepare an artefact-free, delamination-free cross-section in an AMOLED mobile display. We also present applications examples that require cm-sized long cuts to cut through whole microelectronic devices, or removal of cubic-mm of material to prepare mm-sized cross-sections in packages. We discuss a way how to implement correlation data across the laser and FIBSEM platforms through SYNOPSYS Avalon SW allowing precise navigation to the area of interest using layout circuit overlays. We also show an example of image bitmap overlay to navigate across platforms and end-pointing.

Effect of the Etching Profile of a Si Substrate on the Capacitive Characteristics of Three-Dimensional Solid-State Lithium-Ion Batteries

Along with the soaring demands for all-solid-state thin-film lithium-ion batteries, the problem of their energy density rise becomes very acute. The solution to this problem can be found in development of 3D batteries. The present work deals with the development of a technology for a 3D solid-state lithium-ion battery (3D SSLIB) manufacturing by plasma-chemical etching and magnetron sputtering technique. The results on testing of experimental samples of 3D SSLIB are presented. It was found that submicron-scale steps appearing on the surface of a 3D structure formed on Si substrate by the Bosch process radically change the crystal structure of the upper functional layers. Such changes can lead to disruption of the layers’ continuity, especially that of the down conductors. It is shown that surface polishing by liquid etching of the SiO2 layer and silicon reoxidation leads to surface smoothing, the replacement of the dendrite structure of functional layers by a block structure, and a significant improvement in the capacitive characteristics of the battery.

Machining Characteristics of Electrochemical Polishing Using Ultrasonic Vibration for Nanoscale High Surface Quality

This study demonstrates a method to improve the surface quality by adding artificial vibration to the electrolyte in electrochemical polishing (ECP, electropolishing). ECP is a typical non-contact surface polishing process that has been used to improve surface quality without leaving any of the mechanical scratch marks that can arise when applying mechanical processes. ECP can polish work material via electrochemical dissolution between the surfaces of an anode and a cathode, and irregular defects are generated on the surface by impurities and bubbles generated during machining. This study confirms that our novel ECP method yields improved results over conventional ECP based on experiments using vibration electrochemical polishing (VECP) with ultrasonic vibrations. VECP minimizes nanoscale surface defects, improves surface roughness, makes it possible to quickly remove materials at nanoscale by increasing the material removal rate (MRR). Under high current density, where the electrochemical relatively reaction is active, value of the current is increased when ultrasonic vibration is added. The localized roughness of the work material was measured by atomic force microscopy (AFM) according to various electrical conditions. In addition, we also compared the overall surface quality and productivity to those obtained by conventional ECP.