A new look at tensile yielding in isotactic polypropylene: role of strain rate and thermal softening

2022 ◽  
Author(s):  
Mohammad F. Farahani ◽  
Reza Bagheri
Keyword(s):  
Strain Rate ◽  
Isotactic Polypropylene ◽  
Thermal Softening ◽  
New Look

Magistri Legis. Eine Studie zur dogmatischen Funktion im industriellen System

2011 ◽  
Vol 2 (2) ◽  
pp. 69-112
Author(s):  
Pierre Legendre
Keyword(s):  
Social Function ◽  
Modern Human ◽  
Human Behaviour ◽  
Cultural Reproduction ◽  
Industrial System ◽  
The West ◽  
History Of ◽  
History Of Law ◽  
New Look

"Der Beitrag reevaluiert die «dogmatische Funktion», eine soziale Funktion, die mit biologischer und kultureller Reproduktion und folglich der Reproduktion des industriellen Systems zusammenhängt. Indem sie sich auf der Grenze zwischen Anthropologie und Rechtsgeschichte des Westens situiert, nimmt die Studie die psychoanalytische Frage nach der Rolle des Rechts im Verhalten des modernen Menschen erneut in den Blick. </br></br>This article reappraises the dogmatic function, a social function related to biological and cultural reproduction and consequently to the reproduction of the industrial system itself. On the borderline of anthropology and of the history of law – applied to the West – this study takes a new look at the question raised by psychoanalysis concerning the role of law in modern human behaviour. "

scholarly journals Unique Slow Crack Growth Behavior of Isotactic Polypropylene: The Role of Shear Layer-Spherulites Layer Alternated Structure

Polymers ◽  
2020 ◽  
Vol 12 (11) ◽  
pp. 2746
Author(s):  
Mingjin Liu ◽  
Jiaxu Luo ◽  
Jin Chen ◽  
Xueqin Gao ◽  
Qiang Fu ◽  
...  
Keyword(s):  
Shear Layer ◽  
Crack Growth ◽  
Isotactic Polypropylene ◽  
Slow Crack Growth ◽  
Crack Growth Behavior ◽  
Polymer Science ◽  
The Past ◽  
Propagation Behavior ◽  
Crack Propagation Behavior

With the development of polymer science, more attention is being paid to the longevity of polymer products. Slow crack growth (SCG), one of the most important factors that reveal the service life of the products, has been investigated widely in the past decades. Here, we manufactured an isotactic polypropylene (iPP) sample with a novel shear layer–spherulites layer alternated structure using multiflow vibration injection molding (MFVIM). However, the effect of the alternated structure on the SCG behavior has never been reported before. Surprisingly, the results showed that the resistivity of polymer to SCG can be enhanced remarkably due to the special alternated structure. Moreover, this sample shows unique slow crack propagation behavior in contrast to the sample with the same thickness of shear layer, presenting multiple microcracks in the spherulites layer, which can explain the reason of the resistivity improvement of polymer to SCG.

The role of hydrogen in weld cracking processes – a new look at the problem

2011 ◽  
Vol 25 (6) ◽  
pp. 409-414 ◽  
Author(s):  
Edmund Tasak ◽  
Aneta Ziewiec ◽  
Janusz Adamiec
Keyword(s):  
New Look

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

1992 ◽  
Vol 114 (2) ◽  
pp. 185-192 ◽  
Author(s):  
R. G. Ross ◽  
L. C. Wen ◽  
G. R. Mon ◽  
E. Jetter
Keyword(s):  
Computer Program ◽  
Strain Rate ◽  
Thermal Cycle ◽  
Failure Process ◽  
Strain Range ◽  
Strain Rate Effects ◽  
Rate Effects ◽  
Creep Fatigue ◽  
Solder Fatigue

With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

Role of strain rate in the strain-induced crystallization (SIC) of natural and synthetic isoprene rubber

2018 ◽  
Vol 51 (2) ◽  
pp. 221-226 ◽  
Author(s):  
Yuji Kitamura ◽  
Kiyoka Okada ◽  
Hiroyasu Masunaga ◽  
Masamichi Hikosaka
Keyword(s):  
Strain Rate ◽  
Strain Induced Crystallization ◽  
Induced Crystallization ◽  
Isoprene Rubber ◽  
Natural And Synthetic

THE ROLE OF THE GHOST FIELDS IN THE RENORMALIZED t–J LAGRANGIAN MODEL

2009 ◽  
Vol 23 (04) ◽  
pp. 493-519
Author(s):  
O. S. ZANDRON
Keyword(s):  
Thermal Softening ◽  
Lagrangian Model ◽  
Lagrangian Formalism ◽  
Spin Polaron ◽  
Renormalization Procedure ◽  
Ghost Field

The present work treats the role of ghost fields in the renormalization procedure of the Lagrangian perturbative formalism of the t–J model. We show that by introducing proper ghost field variables, the propagators and vertices can be renormalized to each order. In particular, the renormalized ferromagnetic magnon propagator coming from our previous Lagrangian formalism is studied in detail, and it is shown how the thermal softening of the magnon frequency is predicted by the model. The antiferromagnetic case is also analyzed, and the results are confronted with the previous one obtained by means of the spin-polaron theories.

Role of the interphase dynamics in the induction time of the thermo-oxidation of isotactic polypropylene

2006 ◽  
Vol 91 (7) ◽  
pp. 1433-1442 ◽  
Author(s):  
Mario Hoyos ◽  
Pilar Tiemblo ◽  
José Manuel Gómez-Elvira ◽  
Lyda Rychlá ◽  
Jozef Rychlý
Keyword(s):  
Isotactic Polypropylene ◽  
Induction Time
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