Correction to: The role of process temperature on structural, optical, vibrational and electronic environments of thermal chemical vapor-deposited copper-doped zinc oxide nanostructured thin films

AbstractThe electrical and mechanical properties of low-k dielectric materials have received a great deal of attention in recent years; however, measurements of thermal properties such as the coefficient of thermal expansion remain minimal. This absence of data is due in part to the limited number of experimental techniques capable of measuring this parameter. Even when data does exist, it has generally not been collected on samples of a thickness relevant to current and future integrated processes. We present a procedure for using x-ray reflectivity to measure the coefficient of thermal expansion of sub-micron dielectric thin films. In particular, we elucidate the thin film mechanics required to extract this parameter for a supported film as opposed to a free-standing film. Results of measurements for a series of plasma-enhanced chemical vapor deposited and spin-on low-k dielectric thin films will be provided and compared.

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Rigidity Percolation in Plasma Enhanced Chemical Vapor Deposited a-SiC:H Thin Films

ECS Transactions ◽

10.1149/1.3484122 ◽

2019 ◽

Vol 33 (8) ◽

pp. 185-194 ◽

Cited By ~ 17

Author(s):

Sean King ◽

Jeff Bielefeld

Keyword(s):

Thin Films ◽

Chemical Vapor ◽

Chemical Vapor Deposited ◽

Rigidity Percolation

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Properties of Hf0.7Zr0.3O2 thin films chemical vapor deposited using a single-source precursor of anhydrous HfxZr1−x(NO34 precursors

2010 International Symposium on Next Generation Electronics ◽

10.1109/isne.2010.5669199 ◽

2010 ◽

Author(s):

Wenqi Zhang ◽

Liuying Huang ◽

Aidong Li ◽

Qiyue Shao ◽

Di Wu

Keyword(s):

Thin Films ◽

Chemical Vapor ◽

Single Source ◽

Chemical Vapor Deposited ◽

Single Source Precursor

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Growth, Structural and Mechanical Characterization and Reliability of Chemical Vapor Deposited Co and Co3O4 Thin Films as Candidate Materials for Sensing Applications

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.495.108 ◽

2011 ◽

Vol 495 ◽

pp. 108-111 ◽

Cited By ~ 2

Author(s):

Vasiliki P. Tsikourkitoudi ◽

Elias P. Koumoulos ◽

Nikolaos Papadopoulos ◽

Costas A. Charitidis

Keyword(s):

Thin Film ◽

Thin Films ◽

Elastic Modulus ◽

Data Storage ◽

Mechanical Stability ◽

Chemical Vapor ◽

Magnetic Sensors ◽

Functional Coatings ◽

Sensing Applications ◽

Chemical Vapor Deposited

The adhesion and mechanical stability of thin film coatings on substrates is increasingly becoming a key issue in device reliability as magnetic and storage technology driven products demand smaller, thinner and more complex functional coatings. In the present study, chemical vapor deposited Co and Co3O4thin films on SiO2and Si substrates are produced, respectively. Chemical vapor deposition is the most widely used deposition technique which produces thin films well adherent to the substrate. Co and Co3O4thin films can be used in innovative applications such as magnetic sensors, data storage devices and protective layers. The produced thin films are characterized using nanoindentation technique and their nanomechanical properties (hardness and elastic modulus) are obtained. Finally, an evaluation of the reliability of each thin film (wear analysis) is performed using the hardness to elastic modulus ratio in correlation to the ratio of irreversible work to total work for a complete loading-unloading procedure.

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