Influence of the Native Oxide Layer on the Silicon Surface During Initial Stages of Nitridation

2001 ◽  
Vol 137 (1-2) ◽  
pp. 49-56 ◽  
Author(s):  
Andreas Markwitz ◽  
Geoffrey Vaughan White ◽  
William Joseph Trompetter ◽  
Ian William Murray Brown
Keyword(s):  
Oxide Layer ◽  
Silicon Surface ◽  
Native Oxide ◽  
Native Oxide Layer

In situ removal of a native oxide layer from an amorphous silicon surface with a UV laser for subsequent layer growth

CrystEngComm ◽  
2018 ◽  
Vol 20 (44) ◽  
pp. 7170-7177 ◽  
Author(s):  
Christian Ehlers ◽  
Stefan Kayser ◽  
David Uebel ◽  
Roman Bansen ◽  
Toni Markurt ◽  
...  
Keyword(s):  
Laser Pulse ◽  
Amorphous Silicon ◽  
Oxide Layer ◽  
Silicon Surface ◽  
Layer Growth ◽  
Native Oxide ◽  
Native Oxide Layer ◽  
Uv Laser ◽  
Subsequent Layer

An in situ method for selectively heating a substrate by a laser pulse was modelled and investigated experimentally.

Interaction of iron atoms with the silicon surface coated with a native oxide layer

2009 ◽  
Vol 54 (8) ◽  
pp. 1210-1214 ◽  
Author(s):  
M. V. Gomoyunova ◽  
I. I. Pronin ◽  
V. N. Petrov ◽  
A. N. Titkov
Keyword(s):  
Oxide Layer ◽  
Silicon Surface ◽  
Native Oxide ◽  
Native Oxide Layer

Microanalysis of Tungsten Silicide/Polysilicon Interface: Effectiveness of In Situ Rie Clean on Removal of Native Oxide

1990 ◽  
Vol 181 ◽  
Author(s):  
Ronald S. Nowicki ◽  
Patrice Geraghty ◽  
David W. Harris ◽  
Gayle Lux
Keyword(s):  
High Temperature ◽  
Oxide Layer ◽  
Silicon Surface ◽  
Secondary Ion Mass Spectrometry ◽  
Film Deposition ◽  
Native Oxide ◽  
Native Oxide Layer ◽  
Tungsten Silicide ◽  
High Temperature Heat Treatment

ABSTRACTThe presence of a thin (10-30Å) oxide (“native oxide”) layer on a silicon surface prior to the deposition of another film on that surface can contribute to difficulties with subsequent device processing steps, e.g. contact metallization and high-temperature annealing or oxidation. Thus, the in situ process capability of “native oxide” removal affords an advantage over the conventional method of aqueous hydrofluoric acid cleaning prior to a film deposition step. This study describes such a technique, in which an in situ pre-deposition clean with C2F6 gas, using reactive ion etching (RIE) prior to tungsten silicide deposition, is employed. This technique allows post-silicide deposition high-temperature heat treatment and wet oxidation without loss of film adhesion or other obvious degradative effects. We also report the use of Secondary Ion Mass Spectrometry (SIMS) to show that this procedure has been effective in the removal of the oxide layer prior to silicide deposition. This study includes definition of the RIE etch parameters which provide acceptable etch selectivity of the oxide to silicon, and avoidance of excessive fluoropolymer formation on the silicon surface.

Microanalysis of Tungsten Silicide/Polysilicon Interface: Effectiveness of in Situ Rie Clean on Removal of Native Oxide

1990 ◽  
Vol 182 ◽  
Author(s):  
Ronald S. Nowicki ◽  
Patrice Geraghty ◽  
David W. Harris ◽  
Gayle Lux
Keyword(s):  
Oxide Layer ◽  
Silicon Surface ◽  
Secondary Ion Mass Spectrometry ◽  
Film Deposition ◽  
Native Oxide ◽  
Native Oxide Layer ◽  
Tungsten Silicide ◽  
High Temperature Heat Treatment ◽  
Oxide Removal

AbstractThe presence of a thin (10-30Å) oxide (“native oxide”) layer on a silicon surface prior to the deposition of another film on that surface can contribute todifficulties with subsequent device processing steps, e.g. contact metallization and hightemperature annealing or oxidation. Thus, the in situ process capability of “native oxide” removal affords an advantage over the conventional method of aqueous hydrofluoric acid cleaning prior to a film deposition step. This study describes such a technique, in which an in situ pre-deposition clean with C2F6 gas, using reactive ion etching (RIE) prior to tungsten silicide deposition, is employed. This technique allows post-silicide deposition high-temperature heat treatment and wet oxidation without loss of film adhesion or other obvious degradative effects. We also report the useof Secondary Ion Mass Spectrometry (SIMS) to show that this procedure has een effective in the removal of the oxide layer prior to silicide deposition. This study includes definition of the RIE etch parameters which provide acceptable etch selectivity of the oxideto silicon, and avoidance of excessive fluoropolymer formation on the silicon surface.

Wettability in pressure infiltration of SiC and oxidized SiC particle compacts by molten Al and Al-12wt%Si alloy

2007 ◽  
Vol 22 (8) ◽  
pp. 2273-2278 ◽  
Author(s):  
J.M. Molina ◽  
J. Tian ◽  
C. Garcia-Cordovilla ◽  
E. Louis ◽  
J. Narciso
Keyword(s):  
Contact Angle ◽  
Oxide Layer ◽  
Low Temperatures ◽  
Native Oxide ◽  
Native Oxide Layer ◽  
Threshold Pressure ◽  
Pressure Infiltration ◽  
Surface Conditions ◽  
Infiltration Behavior ◽  
Sic Particle

The infiltration behavior of compacts of SiC particles in two surface conditions, as-received and thermally oxidized, was investigated by using pure Al and Al-12wt%Si as infiltrating metals. Analysis of the threshold pressure for infiltration revealed that the process is governed by the same contact angle for all different systems, no matter the metal or particle condition. This leads to the conclusion that oxidation does not modify the wetting characteristics of the particles, most probably because they are already covered by a thin native oxide layer that remains unaltered in processing routes involving short contact times and low temperatures, such as actual conditions of pressure infiltration at 700 °C.

The Effect of Surface States on Secondary Electron (SE) Dopant Contrast from Silicon p-n Junctions

2007 ◽  
Vol 1026 ◽  
Author(s):  
Augustus K. W. Chee ◽  
Conny Rodenburg ◽  
Colin John Humphreys
Keyword(s):  
Oxide Layer ◽  
Computer Modelling ◽  
Surface States ◽  
Native Oxide ◽  
Native Oxide Layer ◽  
Element Analysis ◽  
Surface Band ◽  
Band Bending ◽  
Wide Range ◽  
Se Doping

AbstractDetailed computer modelling using finite-element analysis was performed for Si p-n junctions to investigate the effects of surface states and doping concentrations on surface band-bending, surface junction potentials and external patch fields. The density of surface states was determined for our Si specimens with a native oxide layer. Our calculations show that for a typical density of surface states for a Si specimen with a native oxide layer, the effects of external patch fields are negligible and the SE doping contrast is due to the built-in voltage across the p-n junction modified by surface band-bending. There is a good agreement between the experimental doping contrast and the calculated junction potential just below the surface, taking into account surface states, for a wide range of doping concentrations.

Nano-Thick Amorphous Oxide Layer Produced by Plasma on Type 316L Stainless Steel for Improved Corrosion Resistance Under Plastic Deformation

CORROSION ◽  
10.5006/2674 ◽  
2018 ◽  
Vol 74 (9) ◽  
pp. 1011-1022 ◽  
Author(s):  
Megan Mahrokh Dorri ◽  
Stéphane Turgeon ◽  
Maxime Cloutier ◽  
Pascale Chevallier ◽  
Diego Mantovani
Keyword(s):  
Plastic Deformation ◽  
Stainless Steel ◽  
Oxide Layer ◽  
Electrochemical Impedance ◽  
Open Circuit ◽  
Localized Corrosion ◽  
Native Oxide ◽  
Native Oxide Layer ◽  
Amorphous Oxide ◽  
Amorphous Oxide Layer

Localized corrosion constitutes a major concern in medical devices made of stainless steel. The conventional approach to circumvent such a problem is to convert the surface polycrystalline microstructure of the native oxide layer to an amorphous oxide layer, a few micrometers thick. This process cannot, however, be used for devices such as stents that undergo plastic deformation during their implantation, especially those used in vascular surgery for the treatment of cardiac, neurological, and peripheral vessels. This work explores the feasibility of producing a nano-thick plastic-deformation resistant amorphous oxide layer by plasma-based surface modifications. By varying the plasma process parameters, oxide layers with different features were produced and their properties were investigated before and after clinically-relevant plastic deformation. These properties and the related corrosion mechanisms were mainly evaluated using the electrochemical methods of open-circuit potential, cyclic potentiodynamic polarization, and electrochemical impedance spectroscopy. Results showed that, under optimal conditions, the resistance to corrosion and to the permeation of ions in a phosphate buffered saline, even after deformation, was significantly enhanced.

scholarly journals Эволюция физико-химических свойств поверхности GaSb(100) в растворах сульфида аммония

2019 ◽  
Vol 53 (7) ◽  
pp. 908
Author(s):  
М.В. Лебедев ◽  
Т.В. Львова ◽  
А.Л. Шахмин ◽  
О.В. Рахимова ◽  
П.А. Дементьев ◽  
...  
Keyword(s):  
Oxide Layer ◽  
Photoelectron Spectroscopy ◽  
Treatment Time ◽  
Solution Concentration ◽  
Native Oxide ◽  
Semiconductor Surface ◽  
Native Oxide Layer ◽  
Force Microscopy ◽  
Fermi Level Pinning ◽  
Ammonium Sulfide

AbstractVarious conditions of passivation of the GaSb(100) surface by ammonium sulfide ((NH_4)_2S) solutions depending on the solution concentration, solvent, and treatment time are investigated by X-ray photoelectron spectroscopy and atomic-force microscopy. It is shown that treatment of the GaSb(100) surface by any (NH_4)_2S solution leads to removal of the native oxide layer from the semiconductor surface and the formation of a passivating layer consisting of various gallium and antimony sulfides and oxides. The surface with the lowest roughness (RMS = 0.85 nm) is formed after semiconductor treatment with 4% aqueous ammonium sulfide solution for 30 min. Herewith, the atomic concentration ratio Ga/Sb at the surface is ~2. It is also found that aqueous ammonium sulfide solutions do not react with elemental antimony incorporated into the native-oxide layer. The latter causes a leakage current and Fermi-level pinning at the GaSb(100) surface. However, a 4% (NH_4)_2S solution in isopropanol removes elemental antimony almost completely; herewith, the semiconductor surface remains stoichiometric if a treatment duration is up to 13 min.

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