Design of micro-displacement amplifier for the micro-channel cooling system in the micro-pump

2020 ◽  
Vol 84 (2) ◽  
pp. 161-168 ◽  
Author(s):  
Yunliang Zhang ◽  
Dezhi Li ◽  
Yuan Chen ◽  
Bin Zhang
Keyword(s):  
Cooling System ◽  
Micro Channel ◽  
Micro Pump

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

2009 ◽  
Author(s):  
Koichi Mashiko ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yasuhiro Horiuchi ◽  
Thang Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Cooling System ◽  
Cold Plate ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Liquid Cooling ◽  
Liquid Cooling System ◽  
Heat Spreading

Recently energy saving is most important concept for all electric products and production. Especially, in Data-Center cooling system, power consumption of current air cooling system is increasing. For not only improving thermal performance but also reducing electric power consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance, and easy for design and simulation. Another application is the evaporating surface for vapor chamber. The well-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes and vapor chamber, which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics. Normally, vapor chamber is composed of sintered power wick. Vapor chamber container is mechanically supported by stamped pedestal or wick column or solid column, but the mechanical strength is not enough strong. So far, the application is limited in the area of low strength assembly. Sometime the mechanical supporting frame is design for preventing deformation. In this paper, the testing result of sample is described that thermal resistance between the heat source and the ambient can be improved approximately 0.1°C/W by using the micro-channel vapor chamber. Additionally, authors presented case designs using vapor chamber for cooling computer processors, and proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader.

Simulation and Analysis of a Micro-Fluidics Cooling System

2007 ◽  
Vol 339 ◽  
pp. 490-494
Author(s):  
Xiao Wei Liu ◽  
Rong Yan Chuai ◽  
You Feng Zhang ◽  
Q.F. Tao
Keyword(s):  
Temperature Distribution ◽  
Silicon Substrate ◽  
Cooling System ◽  
Element Model ◽  
Temperature Sensors ◽  
Quantitative Relation ◽  
Micro Fluidics ◽  
Micro Pump ◽  
Design Requirements ◽  
Two Temperature

The paper presents a micro-fluidics cooling system which is designed on a silicon substrate including a micro-pump, two temperature sensors, a flow sensor and some microchannels. To design the cooling system optimally, a finite element model is built. The temperature distribution on the silicon substrate is analyzed using the model. Moreover, the quantitative relation is given of the temperature distribution, flow velocity and driving capability of the micro pump. Consequently, the structure parameters and design requirements of the cooling system are obtained.

Development of a Mini Liquid Cooling System for High Heat Flux Electronic Devices

2009 ◽  
Author(s):  
Chien-Yuh Yang ◽  
Chun-Ta Yeh ◽  
Kou-Chung Huang ◽  
Shao-Nong Tsai
Keyword(s):  
Flow Rate ◽  
Cooling System ◽  
Maximum Flow ◽  
Maximum Pressure ◽  
High Heat Flux ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Commercial Products ◽  
Micro Pump ◽  
Liquid Cooling System

The size of the most of the current commercialized liquid cooling systems is apparently too large to be easily adapted in a notebook or a mini size desk top computer. This study incorporated the authors’ previous micro heat exchanger design with an extra slim pump concept proposed by a local manufacturer to develop a high performance miniature liquid cooling system. An integrated pump and cold plate assembly was also developed for further reducing the overall size of the system. In comparing to the commercial products, the test results show that the micro pump provides a higher maximum pressure head and maximum flow rate performance. The cold plate has the lowest thermal resistance at moderate and high flow rate region. And the performed of the entire liquid system is similar to that of the recently announced product. It is emphasized that the size of the present developed cold plate, pump and liquid cooling system is much smaller than that of all commercial products.

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

2013 ◽  
Author(s):  
Koichi Mashiko ◽  
Masataka Mochizuki ◽  
Kazuhiko Goto ◽  
Makoto Takahashi ◽  
Masahiro Matsuda ◽  
...  
Keyword(s):  
Data Centers ◽  
Cooling System ◽  
Water Pressure ◽  
Channel Structure ◽  
Cover Plate ◽  
Cold Plate ◽  
Micro Channel ◽  
Water Cooling ◽  
Micro Channels ◽  
Super Computer

Until recently, effective cooling solutions with high performance were required especially in data-centers and super computers because of the huge and ever-increasing power consumption in these applications. Water cooling systems have been considered for use in the cooling of large scale data-centers and super computers. For the cooling of super computer CPUs, a water cooling system using advanced cold plate technology is reconsidered. The thermal resistance of a cold plate for cooling the CPU is required to dissipate 80 to 100W of heat at 0.05 K/W. Also, in this application, the cold plate is required to be mechanically reliable in withstanding a cooling water pressure of 1MPa. We adopted a micro-channel structure as a heat transfer surface of this cold plate and developed a new brazing method so that the tips of the micro-channel fins are bonded to the inside of cover plate of the cold plate. In collaboration with a customer in charge of the design, we completed the water cooling unit consisting of cold plates, pipes and coupler manifold, assembled by brazing. Finally, the high volume products were manufactured with reliability inspection (pressure test and helium leakage test) and used to effectively cool the CPUs of an advanced super computer, which was awarded the fastest super computer record. Water cooling technology provides effective high capacity cooling in compact space limits, and has been widely used in applications like fiber laser machines and others. This paper describes the development of cold plate with micro-channels and its applications.

scholarly journals Comparative study of heat and fluid flow characteristics of parallel and offset strip fin micro-channels using CFD simulations

2018 ◽  
Vol 22 (5) ◽  
pp. 1973-1985
Author(s):  
Vinod Venkiteswaran ◽  
Cheah Yee ◽  
Chia Ming
Keyword(s):  
Cooling System ◽  
Flow Characteristics ◽  
Type A ◽  
Heat Sinks ◽  
Micro Channel ◽  
Smooth Flow ◽  
Side Channels ◽  
Micro Channels ◽  
Fluid Flow Characteristics ◽  
Offset Strip Fin

The primary aim of this study was to consider novel configurations of water-cooled micro-channel layout and compare them with existing configurations. The authors emphasize on establishing a benchmark based on investigations by earlier researchers and numerically analysing them. As a first attempt, offset strip fins are compared with existing parallel fins in terms of subsequent flow fields and temperature profiles. In offset types designated as A and B, the highest velocities occur at the side channels because of the straight wall allowing smooth flow through the channel. Generally, for offset type, the velocity increases after the sidewalls towards the centre. Type A configuration had an uneven velocity profile because of its staggered channel entrance. The lowest average temperature was observed in parallel heat sinks, followed by type A and type B. Causes are discussed for the observed differences and criteria are suggested for the selection of an appropriate geometry of offset fins. An efficient cooling system will ensure effective working of equipment resulting in low energy consumption and better sustainability. This work opens a platform for research on various other configurations and their use in micro-channel cooling.

Evaluation of Design and Performance of a Cryogenic Mems Micropump Realized with Si-Based Diaphragm Using Combination of Zygo/Wyko Interferometer and Raman Spectroscopy

2003 ◽  
Vol 782 ◽  
Author(s):  
Yi Zhao ◽  
Daryl Ludlow ◽  
Biao Li ◽  
Xin Zhang
Keyword(s):  
Raman Spectroscopy ◽  
Cooling System ◽  
Cryogenic Cooling ◽  
Maximum Deflection ◽  
Good Match ◽  
Micro Raman Spectroscopy ◽  
Micro Pump ◽  
And Performance ◽  
Silicon Based ◽  
The Relationship

ABSTRACTThis paper reports work concerning a silicon-based micro pump for use in a cryogenic cooling system. The diaphragm deflection, which is critical for the control of pumping capacity, was accurately derived using a combination of ZYGO and WYKO interferometer. The relationship between the pumping capacity and differential pressure was further achieved. Stress distribution was obtained using Micro Raman spectroscopy. It was found that Young's modulus derived from the maximum deflection increases with decreasing temperature. The compressive stress concentrates at the edge centers; whereas the tensile stress occurs at the diaphragm center. There is a fairly good match between the theoretical predications and experimental observations.

Sign in / Sign up

Export Citation Format

Share Document