The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers
2005 ◽
Vol 40
(19)
◽
pp. 5307-5309
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2004 ◽
Vol 51
(2)
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pp. 147-150
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2005 ◽
Vol 53
(7)
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pp. 835-839
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1981 ◽
Vol 39
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pp. 160-161
1988 ◽
Vol 46
◽
pp. 764-765
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