Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics
2017 ◽
Vol 53
(4)
◽
pp. 2618-2630
◽
Keyword(s):
2013 ◽
Vol 302
◽
pp. 136-139
◽
2007 ◽
pp. 183-186
2015 ◽
Vol 26
(6)
◽
pp. 3521-3529
◽
Keyword(s):
Keyword(s):
2017 ◽
Vol 695
◽
pp. 2165-2172
◽
1993 ◽
2000 ◽