scholarly journals Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

2017 ◽  
Vol 53 (4) ◽  
pp. 2618-2630 ◽  
Author(s):  
Jiaqi Wu ◽  
Chin C. Lee
2013 ◽  
Vol 302 ◽  
pp. 136-139 ◽  
Author(s):  
Ho Sung Lee ◽  
Jong Hoon Yoon ◽  
Joon Tae Yoo ◽  
Ji Ung Choi

In the solid state bonding, joint are made by pressing surfaces together at high temperature so that a bond grows across the interface by atomic diffusion. In order to satisfy both requirements of thermal and mechanical properties of aerospace vehicle, conductive CuCrZr alloy was bonded to duplex steel with high strength. Solid state bonding was performed at 3 different pressure conditions and at temperatures of 850°C and 950°C. Microstructural and mechanical evaluation was performed to obtain the optimum joining condition.


2020 ◽  
Vol 59 ◽  
pp. 477-486
Author(s):  
Shuangjie Zhang ◽  
Wei Wang ◽  
Shibo Ma ◽  
Huajun Yan ◽  
Lishi Jiao ◽  
...  

2000 ◽  
Author(s):  
Vladimir Dmitriev ◽  
T. P. Chow ◽  
Steven P. DenBaars ◽  
Michael S. Shur ◽  
Michael G. Spencer

JOM ◽  
1961 ◽  
Vol 13 (7) ◽  
pp. 490-493 ◽  
Author(s):  
R. A. Perkins ◽  
D. D. Crooks

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