Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging

2013 ◽  
Vol 24 (9) ◽  
pp. 3249-3254 ◽  
Author(s):  
Liang Zhang ◽  
Xi-ying Fan ◽  
Cheng-wen He ◽  
Yong-huan Guo
Keyword(s):  
Intermetallic Compound ◽  
Electronic Packaging ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Cu Substrate ◽  
Snagcu Solder

Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

2004 ◽  
Vol 381 (1-2) ◽  
pp. 151-157 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Young-Ho Lee ◽  
Dae-Gon Kim ◽  
Han-Byul Kang ◽  
Su-Jeong Suh ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Cu Substrate
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