Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

2004 ◽  
Vol 39 (13) ◽  
pp. 4211-4217 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Isothermal Aging ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Cu Substrate

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

2005 ◽  
Vol 486-487 ◽  
pp. 273-276
Author(s):  
Dae Gon Kim ◽  
Hyung Sun Jang ◽  
Young Jig Kim ◽  
Seung Boo Jung
Keyword(s):  
Solid State ◽  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Isothermal Aging ◽  
Flip Chip ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Temperature Range ◽  
Kinetics Of

In the present work, the growth kinetics of intermetallic compound layer formed in Sn-3.5Ag flip chip solder joints by solid-state isothermal aging was examined at temperatures between 80 and 150 °C for 0 to 60 days. The bumping for the flip chip devices was performed using an electroless under bump metallization. The quantitative analyses were performed on the intermetallic compound layer thickness as a function of aging time and aging temperature. The layer growth of the Ni3Sn4 intermetallic compound followed a parabolic law within a given temperature range. As a whole, because the value of the time exponent (n) is approximately equal to 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism in the temperature range studied. The apparent activation energy of the Ni3Sn4 intermetallic was 49.63 kJ/mol.

Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

2004 ◽  
Vol 381 (1-2) ◽  
pp. 151-157 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Young-Ho Lee ◽  
Dae-Gon Kim ◽  
Han-Byul Kang ◽  
Su-Jeong Suh ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Cu Substrate
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