Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate
2005 ◽
Vol 21
(3)
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pp. 381-386
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2005 ◽
Vol 16
(8)
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pp. 523-528
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2005 ◽
Vol 486-487
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pp. 273-276
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2013 ◽
Vol 24
(9)
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pp. 3249-3254
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2015 ◽
Vol 754-755
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pp. 546-550
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2014 ◽
Vol 25
(10)
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pp. 4219-4224
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2014 ◽
Vol 25
(12)
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pp. 5195-5200
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2004 ◽
Vol 33
(9)
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pp. 991-1004
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