A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints

2020 ◽  
Vol 818 ◽  
pp. 152893 ◽  
Author(s):  
Z.H. Li ◽  
Y. Tang ◽  
Q.W. Guo ◽  
G.Y. Li
Keyword(s):  
Intermetallic Compounds ◽  
Diffusion Model ◽  
Growth Kinetics ◽  
Solder Joints ◽  
Interfacial Intermetallic Compounds ◽  
Kinetics Of

Growth Kinetics of Fe Boride Layers: Application of a Diffusion Model

2008 ◽  
Vol 273-276 ◽  
pp. 318-322 ◽  
Author(s):  
Mourad Keddam
Keyword(s):  
Diffusion Model ◽  
Growth Kinetics ◽  
Thermodynamic Data ◽  
Boron Content ◽  
Kinetic Constant ◽  
Phase Interface ◽  
Layer Thickness Ratio ◽  
Kinetics Of ◽  
Good Agreement ◽  
Kinetics And Thermodynamic

In the present work, a kinetic study based on a diffusion model was performed by use of both kinetics and thermodynamic data as input parameters, it was possible to evaluate the kinetic constant at each phase interface for a biphase configuration FeB and Fe2B grown over the surfaces of Armco Fe and Fe-Cr binary alloys at 0.5 and 4wt. %Cr by powder- pack boriding. The simulated values of the kinetics constants by the model were compared to those found in the literature and a good agreement was observed. For the Fe-4wt. %Cr alloy, it was found by simulation that the layer thickness ratio between the FeB and Fe2B phases is very sensitive to the increase of temperature and surface boron content.

Sign in / Sign up

Export Citation Format

Share Document