Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-017-6479-4 ◽

2017 ◽

Vol 28 (11) ◽

pp. 7827-7833 ◽

Author(s):

Byung-Suk Lee ◽

Soong-Keun Hyun ◽

Jeong-Won Yoon

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Power Electronics ◽

Transient Liquid Phase ◽

Electronics Packaging ◽

Transient Liquid Phase Bonding ◽

Technology Applications

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Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2012.2212211 ◽

2013 ◽

Vol 28 (5) ◽

pp. 2448-2456 ◽

Author(s):

Sang Won Yoon ◽

Michael D. Glover ◽

Koji Shiozaki

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Power Electronics ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Electrified Vehicles

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Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles

2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec.2012.6165863 ◽

2012 ◽

Author(s):

Sang Won Yoon ◽

Koji Shiozaki ◽

Satoshi Yasuda ◽

Michael D. Glover

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Power Electronics ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Bonding Technology ◽

Electrified Vehicles

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Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Materials Research Bulletin ◽

10.1016/j.materresbull.2021.111713 ◽

2022 ◽

Vol 149 ◽

pp. 111713

Author(s):

Jianhao Wang ◽

Xunda Liu ◽

Fupeng Huo ◽

Kento Kariya ◽

Noriyuki Masago ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

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A Process Improvement in Silver-indium Transient Liquid Phase Bonding Method for the High-Power Electronics and Photonics Packaging

10.1109/icept52650.2021.9567961 ◽

2021 ◽

Author(s):

Donglin Zhang ◽

Xiuchen Zhao ◽

Yingxia Liu ◽

Ying Liu ◽

Yongjun Huo

Keyword(s):

Liquid Phase ◽

Power Electronics ◽

Process Improvement ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

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Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2020.3009515 ◽

2020 ◽

Vol 10 (10) ◽

pp. 1604-1610

Author(s):

Nadeesh Singh Nobeen ◽

Guangxu Yan ◽

Chee Lip Gan ◽

Zhong Chen

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Electronic Packaging ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

High Temperature Electronic ◽

Packaging Effect

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Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound

Ultrasonics Sonochemistry ◽

10.1016/j.ultsonch.2017.02.016 ◽

2017 ◽

Vol 37 ◽

pp. 561-570 ◽

Author(s):

Huakai Shao ◽

Aiping Wu ◽

Yudian Bao ◽

Yue Zhao ◽

Lei Liu ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

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Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2016.2535365 ◽

2017 ◽

Vol 32 (1) ◽

pp. 441-451 ◽

Author(s):

Hongtao Chen ◽

Tianqi Hu ◽

Mingyu Li ◽

Zhenqing Zhao

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Shell Structure ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Powder Preform ◽

Core Shell Structure ◽

Temperature Applications

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Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2010.2046901 ◽

2010 ◽

Vol 33 (3) ◽

pp. 563-570 ◽

Author(s):

Habib A. Mustain ◽

William D. Brown ◽

Simon S. Ang

Keyword(s):

Silicon Carbide ◽

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Power Devices ◽

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Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors

Journal of Welding and Joining ◽

10.5781/jwj.2020.38.2.5 ◽

2020 ◽

Author(s):

Sunghyun Sohn ◽

Daewon Kim ◽

Hongpyo Kim ◽

Namhyun Kang

Keyword(s):

Liquid Phase ◽

Transient Liquid Phase ◽

Bonding Time ◽

Transient Liquid Phase Bonding ◽

Power Semiconductors ◽

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Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Ultrasonics Sonochemistry ◽

10.1016/j.ultsonch.2016.12.026 ◽

2017 ◽

Vol 36 ◽

pp. 420-426 ◽

Author(s):

Z.L. Li ◽

H.J. Dong ◽

X.G. Song ◽

H.Y. Zhao ◽

J.C. Feng ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Bonding Process ◽

Transient Liquid Phase Bonding ◽

Power Devices ◽

Die Attachment ◽

Rapid Formation

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